公开(公告)号：EP0989796A1

公开(公告)日：2000-03-29

申请号：EP98307755.3

申请日：1998-09-24

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin ,  Hwang, Chi-Kuang ,  Tien, Ching-Cheng

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09681

Abstract: A flexible circuit board with specific shielding planes is disclosed. The circuit board is used for low voltage differential transmission mode circuits. Both the impedance and the transmission time for the transmission line in the circuit board is controlled by shielding planes with varied void opening patterns. Capacitance and slow wave effects related to the combination of void opening patterns and the location configuration related to locations of void opening patterns are used to improve the impedance and transmission timing for the transmission line in the circuit board.

Abstract translation: 与特定的屏蔽方案的柔性电路板被游离缺失盘。 所述电路板被用于低电压差分传输方式的电路。 两者的阻抗和用于在电路板上的传输线的传输时间是通过屏蔽平面具有变化的空隙的开口图案的控制。 有关的空隙开口图案和相关的空隙开口图案的位置的位置配置的组合电容和慢波效果用于改善在电路板上的传输线的阻抗和传输定时。

公开(公告)号：EP2410826A1

公开(公告)日：2012-01-25

申请号：EP11005929.2

申请日：2011-07-20

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin ,  Su, Kuo-Fu

IPC: H05K1/11 ,  H05K3/32 ,  H05K5/06

CPC classification number: H05K1/0253 ,  H05K5/069 ,  H05K2201/0133 ,  H05K2203/1147

Abstract: Disclosed is a flexible printed circuit board with waterproof structure, including a flexible substrate that has a first surface on which a first metal layer is bonded. The first metal layer has an upper surface forming a covered area and at least one mounting zone and the metal layer forms on a surface thereof within the mounting zone a bonding improved waterproof structure. A first insulation layer is formed on the covered area of the upper surface of the first metal layer in such a way not to cover the mounting zone of the first metal so as to expose the mounting zone. A water resistant member is securely mounted to the mounting zone of the first metal layer. The flexible substrate also has a second surface to which a second metal layer and a second insulation layer are mounted. The second metal layer also forms a mounting zone, which is not covered by the second insulation layer so as to expose for mounting the water resistant member. The metal surface inside the mounting zone also forms bonding improved waterproof structure. The waterproof structure improves the bonding strength between the flexible printed circuit board and the water resistant member through proper arrangement and selection of shape, size, and distribution density of holes that are defined in the exposed metal surface. Alternatively, the holes can be made completely through the metal layer in order to also feature control of impedance for high frequency signals.

Abstract translation: 公开了一种具有防水结构的柔性印刷电路板，包括柔性基板，该柔性基板具有第一金属层和第一金属层。 第一金属层具有形成覆盖区域的上表面和至少一个安装区域，并且金属层在安装区域内的表面上形成结合改善的防水结构。 第一绝缘层形成在第一金属层的上表面的覆盖区域上，不会覆盖第一金属的安装区域，以露出安装区域。 防水构件牢固地安装到第一金属层的安装区域。 柔性基板还具有安装有第二金属层和第二绝缘层的第二表面。 第二金属层也形成安装区域，其不被第二绝缘层覆盖，以暴露以安装防水构件。 安装区内的金属表面也形成粘结改善的防水结构。 防水结构通过适当地布置和选择在暴露的金属表面中限定的孔的形状，尺寸和分布密度来提高柔性印刷电路板和防水构件之间的结合强度。 或者，可以通过金属层完全地形成孔，以便还可以控制高频信号的阻抗。

公开(公告)号：EP0989796B1

公开(公告)日：2006-05-03

申请号：EP98307755.3

申请日：1998-09-24

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin ,  Hwang, Chi-Kuang ,  Tien, Ching-Cheng

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09681

公开(公告)号：EP2667691A3

公开(公告)日：2016-11-16

申请号：EP13166673.7

申请日：2013-05-06

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin

IPC: H05K1/02 ,  H05K1/14 ,  H01B7/04

CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/051 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/10356

Abstract: Disclosed is a flexible circuit cable with at least two bundled wire groups (34A, 34B). The circuit cable (3) has first and second ends (31, 32) respectively connected to first and second connection sections (1, 2). The circuit cable (3) includes a cluster section (33), which is formed of a plurality of cluster wires (331) formed by slitting the circuit cable (3). The cluster section (33) includes at least two independent bundles (34A, 34B), which are formed by dividing the cluster wires (331) of the circuit cable (3) into different signal groups (L, G, S, SH, SL) according to electrical signals transmitted therethrough. Bundling members (4A, 4B) are used to the cluster wires (331) of the independent bundles (34A, 34B) according to predetermined bundling modes. Further, the circuit cable (3) has a surface forming a shielding conductive layer (37) for electromagnetic interference protection and impedance control for internal signals of the circuit cable (3).

公开(公告)号：EP2424056A3

公开(公告)日：2013-10-02

申请号：EP11006265.0

申请日：2011-07-29

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin ,  Su, Kuo-Fu ,  Chuo, Chih-Heng

IPC: H02G3/04 ,  H02G11/00 ,  H02G15/013 ,  H02G15/18 ,  H01B7/28

CPC classification number: H02G15/013 ,  H01B7/2825 ,  H02G3/0481 ,  H02G11/00 ,  H02G15/18

Abstract: A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending. The adhesive material can be a material containing conductive particles therein. Further, the substrate of the flexible circuit cable can be of such a design that a shielding layer is included and in electrical connection with a grounding line, whereby the shieling layer enclosing each of the lapped flat cable components in the water resistant structure is electrically connected to the water resistant component containing a conductive substance or the device enclosure to realize protection against electromagnetic interference.

公开(公告)号：EP2654390A3

公开(公告)日：2015-01-07

申请号：EP13159263.6

申请日：2013-03-14

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Su, Kuo-Fu ,  Lin, Gwun-Jin

IPC: H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4038 ,  H05K3/42

Abstract: A structure of via hole (5) of electrical circuit board includes an adhesive layer (31) and a conductor layer (41) that are formed after circuit trace (21) is formed on a carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901). At least one through hole (5) extends in a vertical direction through the carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901), the circuit trace (21), the adhesive layer (31), and the conductor layer (41) and forms a hole wall surface (51). The conductor layer (41) shows a height difference (h1) with respect to an exposed zone (211) of the circuit trace (21) in the vertical direction. A conductive cover section (6) covers the conductor layer (41) and the hole wall surface (51) of the through hole (5). The carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901) is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

公开(公告)号：EP2667691A2

公开(公告)日：2013-11-27

申请号：EP13166673.7

申请日：2013-05-06

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0219 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/148 ,  H05K2201/051 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09663 ,  H05K2201/10356

Abstract: Disclosed is a flexible circuit cable with at least two bundled wire groups (34A, 34B). The circuit cable (3) has first and second ends (31, 32) respectively connected to first and second connection sections (1, 2). The circuit cable (3) includes a cluster section (33), which is formed of a plurality of cluster wires (331) formed by slitting the circuit cable (3). The cluster section (33) includes at least two independent bundles (34A, 34B), which are formed by dividing the cluster wires (331) of the circuit cable (3) into different signal groups (L, G, S, SH, SL) according to electrical signals transmitted therethrough. Bundling members (4A, 4B) are used to the cluster wires (331) of the independent bundles (34A, 34B) according to predetermined bundling modes. Further, the circuit cable (3) has a surface forming a shielding conductive layer (37) for electromagnetic interference protection and impedance control for internal signals of the circuit cable (3).

Abstract translation: 公开了具有至少两个捆扎线组（34A，34B）的柔性电路电缆。 电路电缆（3）具有分别连接到第一和第二连接部分（1,2）的第一和第二端（31,32）。 电路电缆（3）包括由通过切断电路电缆（3）形成的多个集群电线（331）形成的集束部（33）。 集群部分（33）包括通过将电路电缆（3）的集群电线（331）分成不同的信号组（L，G，S，SH，SL）形成的至少两个独立的束（34A，34B） ）根据通过其传输的电信号。 捆束构件（4A，4B）根据预定的捆扎模式用于独立束（34A，34B）的簇线（331）。 此外，电路电缆（3）具有形成用于对电路电缆（3）的内部信号进行电磁干扰保护和阻抗控制的屏蔽导电层（37）的表面。

公开(公告)号：EP2410826B1

公开(公告)日：2013-10-30

申请号：EP11005929.2

申请日：2011-07-20

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin ,  Su, Kuo-Fu

IPC: H05K1/11 ,  H05K3/32 ,  H05K5/06 ,  H05K1/02

CPC classification number: H05K1/0253 ,  H05K5/069 ,  H05K2201/0133 ,  H05K2203/1147

公开(公告)号：EP2654390A2

公开(公告)日：2013-10-23

申请号：EP13159263.6

申请日：2013-03-14

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Su, Kuo-Fu ,  Lin, Gwun-Jin

IPC: H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4038 ,  H05K3/42

Abstract: A structure of via hole (5) of electrical circuit board includes an adhesive layer (31) and a conductor layer (41) that are formed after circuit trace (21) is formed on a carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901). At least one through hole (5) extends in a vertical direction through the carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901), the circuit trace (21), the adhesive layer (31), and the conductor layer (41) and forms a hole wall surface (51). The conductor layer (41) shows a height difference (h1) with respect to an exposed zone (211) of the circuit trace (21) in the vertical direction. A conductive cover section (6) covers the conductor layer (41) and the hole wall surface (51) of the through hole (5). The carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901) is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract translation: 电路板的通孔（5）的结构包括在电路迹线（21）形成在载体板（100,200,300,400,400）上形成的粘合剂层（31）和导体层（41） 500，600，700，800，900，901）。 至少一个通孔（5）沿垂直方向延伸穿过载板（100,200,300,400,500,600,700,800,900,901），电路迹线（21），粘合层（ 31）和导体层（41）形成孔壁面（51）。 导体层（41）相对于电路迹线（21）的垂直方向的曝光区域（211）示出高度差（h1）。 导电盖部分（6）覆盖通孔（5）的导体层（41）和孔壁表面（51）。 载体板（100,200,300,400,500,600,700,800,900,901）是单面板，双面板，多层板或其组合，并且 单面板，双面板和多层板可以是柔性板，刚性板或组合柔性和刚性板的复合板。

公开(公告)号：EP2424056A2

公开(公告)日：2012-02-29

申请号：EP11006265.0

申请日：2011-07-29

Applicant: Advanced Flexible Circuits Co., Ltd.

Inventor： Lin, Gwun-Jin ,  Su, Kuo-Fu ,  Chuo, Chih-Heng

IPC: H02G3/04 ,  H02G11/00 ,  H02G15/013 ,  H02G15/18

CPC classification number: H02G15/013 ,  H01B7/2825 ,  H02G3/0481 ,  H02G11/00 ,  H02G15/18

Abstract: A bundled flexible circuit cable with water resistant structure is provided, in which a flexible substrate forms a cluster section having a lap section. In the lap section, a plurality of flat cable components that collectively form the cluster section is arranged to stack by substantially paralleling each other and corresponding up and down and is bonded and positioned by being applied with an adhesive material. The flat cable components are enclosed by a water resistant component at the lap section, whereby water, liquids, and contaminants are prevented from moving through gaps present in the bundled flexible substrate to get into the enclosure of an electronic device so as to realize protection against water, humidity, and dust. A tubular member or a wrapping member is further provided to fit over a section of the cluster section other than the lap section in order to facilitate extension through a holed mechanism device, such as a hinge, and to improve resistance against flexing and bending. The adhesive material can be a material containing conductive particles therein. Further, the substrate of the flexible circuit cable can be of such a design that a shielding layer is included and in electrical connection with a grounding line, whereby the shieling layer enclosing each of the lapped flat cable components in the water resistant structure is electrically connected to the water resistant component containing a conductive substance or the device enclosure to realize protection against electromagnetic interference.

Abstract translation: 提供了具有防水结构的捆绑式柔性电路电缆，其中柔性基板形成具有搭接部分的集束部分。 在搭接部分中，共同形成集束部分的多个扁平电缆部件被布置成通过彼此基本上彼此并联并相应地上下叠合并且通过施加粘合材料而被粘合和定位。 扁平电缆部件在搭接部分由防水部件包围，从而防止水，液体和污染物通过存在于捆扎的柔性基板中的间隙移动进入电子设备的外壳中，从而实现防止 水，湿度和灰尘。 进一步提供管状构件或包裹构件以配合在除了搭接部分之外的集束部分的一部分上，以便于通过诸如铰链的孔结构装置延伸，并提高抵抗弯曲和弯曲的能力。 粘合剂材料可以是其中含有导电颗粒的材料。 此外，柔性电路电缆的基板可以具有包括屏蔽层并与接地线电连接的设计，由此封闭防水结构中的每个重叠扁平电缆部件的屏蔽层电连接 到含有导电物质或设备外壳的防水部件，以实现电磁干扰的保护。