公开(公告)号：EP3259321A1

公开(公告)日：2017-12-27

申请号：EP16751985.9

申请日：2016-02-16

Applicant: Xjet Ltd.

Inventor： BENICHOU, Axel ,  RÜHLE, Sven ,  AQUA, Tali

IPC: C09D11/30 ,  C09D11/52 ,  B22F1/02 ,  H05K1/09

CPC classification number: C09D11/38 ,  B22F1/0074 ,  B22F1/0088 ,  B22F3/008 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/322 ,  C09D11/36 ,  Y02P10/295 ,  B22F3/1021 ,  B22F3/1007 ,  B22F2003/1058 ,  B22F2201/013

Abstract: Ti ink compositions for printing, such as ink jet printing, are disclosed. The ink compositions comprise a liquid dispersion of Ti hydride powder having a mean particle size of less than 10.0 microns; a liquid carrier; and at least one surfactant. Methods of making and using the disclosed inks are also disclosed. For example, a finished Ti product can be produced by printing the disclosed ink composition, such as by ink jet printing, to form a green article, heating the green article to dehydrogenate it and form a Ti containing part. The method may further comprise sintering the Ti containing part to produce a sintered Ti product. In an embodiment, the method comprises printing one or more support materials for the ink composition, that comprises solid particles of a metal oxide, a metal carbide, a metal nitride, a polymer, or combinations thereof.

公开(公告)号：EP2554187B1

公开(公告)日：2017-11-08

申请号：EP10848739.8

申请日：2010-09-08

Applicant: CHONGQING RUZER PHARMACEUTICAL CO., LTD.

Inventor： RUAN, Jianming ,  XIE, Jianquan ,  JIE, Yunfeng ,  WANG, Zhiqiang ,  FENG, Hua ,  YOU, Chao ,  PANG, Qi ,  ZHOU, Jian ,  YE, Lei ,  LIU, Bin ,  ZHANG, Yazhuo

IPC: A61L27/04 ,  A61L27/56 ,  B22F3/11

CPC classification number: A61L27/56 ,  A61L27/047 ,  A61L2400/08 ,  B22F3/1137 ,  B22F3/1146 ,  B22F2003/248 ,  B22F2998/10 ,  B22F2999/00 ,  Y10T428/12153 ,  B22F1/0074 ,  B22F3/1021 ,  B22F2201/20

公开(公告)号：EP3103566A4

公开(公告)日：2017-11-01

申请号：EP14881484

申请日：2014-02-04

Applicant: SENJU METAL INDUSTRY CO

Inventor： KAWASAKI HIROYOSHI ,  AKAGAWA TAKASHI ,  KOIKEDA YUICHI ,  IKEDA ATSUSHI ,  SASAKI MASARU ,  ROPPONGI TAKAHIRO ,  SOMA DAISUKE ,  SATO ISAMU

IPC: B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/14 ,  B23K35/22 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  C22C1/04 ,  C22C19/03 ,  C22F1/00 ,  C22F1/10 ,  C25D7/00

CPC classification number: B22F1/02 ,  B22F1/0048 ,  B22F1/0074 ,  B22F2301/15 ,  B22F2302/45 ,  B23K35/025 ,  B23K35/22 ,  B23K35/262 ,  B23K35/3033 ,  B23K35/3612 ,  B23K35/3616 ,  B23K35/362 ,  C22C1/0425 ,  C22C19/03 ,  C22F1/00 ,  C22F1/10 ,  C25D7/00

Abstract: Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor chip 10 to an electrode 41 of a printed circuit board 40 with solder paste 12, 42. The solder bump 30 is formed by joining an electrode 11 of the semiconductor chip 10 to the solder ball 20. The 20 according to the present invention contains purity which is equal to or higher than 99.9% and equal to or lower than 99.995%, sphericity which is equal to or higher than 0.90, and Vickers hardness which is equal to or higher than 20 and equal to or less than 90HV.

公开(公告)号：EP2428293B1

公开(公告)日：2017-11-01

申请号：EP11006863.2

申请日：2011-08-23

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Schäfer, Michael ,  Schmitt, Wolfgang

IPC: B22F7/08 ,  B22F1/00 ,  B22F7/06 ,  C09D4/00 ,  H01L23/00

CPC classification number: B22F1/0062 ,  B22F1/007 ,  B22F1/0074 ,  B22F1/02 ,  B22F7/064 ,  B22F7/08 ,  C09D4/00 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/27442 ,  H01L2224/27505 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29369 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29424 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83464 ,  H01L2224/83469 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/01046 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2224/05552

公开(公告)号：EP2455171A4

公开(公告)日：2017-08-16

申请号：EP10799670

申请日：2010-04-27

Applicant: APPLIED NANOPARTICLE LABORATORY CORP

Inventor： KOMATSU TERUO ,  SHIBATA YOSHINORI ,  NAKAMURA HIDEO ,  FURUKAWA MASASHI ,  GOMI RYOSUKE ,  KANOU MITSUHIRO ,  SUGIE TSUKASA ,  KASUYA NARUTAKA ,  YAMAGUCHI SHUHEI ,  ISHIZAKI TOSHITAKA ,  OSHIMA TADASHI ,  TAKAO HISAAKI ,  TOMINAGA NAOTOSHI

IPC: B22F1/02 ,  B22F1/00 ,  B22F7/08 ,  B22F9/24 ,  B23K35/02 ,  B23K35/22 ,  B23K35/30 ,  B23K35/365 ,  C23C24/08 ,  H01B1/00 ,  H01B1/22

CPC classification number: H01B1/22 ,  B22F1/0062 ,  B22F1/0074 ,  B22F7/08 ,  B22F9/24 ,  B22F2999/00 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/365 ,  Y10T428/2991 ,  Y10T428/2993 ,  Y10T428/2995 ,  Y10T428/2996 ,  Y10T428/2998 ,  Y10T428/31678 ,  B22F7/064 ,  B22F1/0014 ,  B22F1/0018

公开(公告)号：EP2431344B1

公开(公告)日：2017-07-12

申请号：EP10766579.6

申请日：2010-04-20

Applicant: Hebei Yl-Bangda New Materials Limited Company

Inventor： YANG, Jinlong ,  CAI, Kai ,  XI, Xiaoqing ,  GE, Guojun ,  HUANG, Yong

IPC: B01J13/04

CPC classification number: C04B20/002 ,  B01J13/043 ,  B22F1/0051 ,  B22F9/082 ,  B22F2009/0888 ,  B22F2999/00 ,  C01B13/145 ,  C01B21/0687 ,  C01F7/021 ,  C01P2004/03 ,  C01P2004/34 ,  C01P2004/61 ,  C04B35/622 ,  C04B38/009 ,  C09C1/407 ,  C09C3/00 ,  C09C3/04 ,  Y10T428/2982 ,  C04B35/00 ,  B22F1/0074

公开(公告)号：EP3009211B1

公开(公告)日：2017-06-14

申请号：EP15183796.0

申请日：2015-09-04

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： KREBS, Thomas ,  SCHÄFER, Michael ,  SCHMITT, Wolfgang ,  DUCH, Susanne Klaudia ,  NACHREINER, Jens

IPC: B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  B23K35/34 ,  B23K35/36 ,  B23K35/365 ,  B23K35/02 ,  H01L23/00 ,  B22F7/06

CPC classification number: B23K35/025 ,  B22F1/0003 ,  B22F1/0055 ,  B22F1/0062 ,  B22F1/0074 ,  B22F1/025 ,  B22F7/064 ,  B22F2301/255 ,  B23K35/3006 ,  B23K35/34 ,  B23K35/3618 ,  B23K35/365 ,  B23K2201/36 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/2928 ,  H01L2224/8384

公开(公告)号：EP3053663A4

公开(公告)日：2017-06-07

申请号：EP14847168

申请日：2014-09-25

Applicant: HITACHI METALS LTD

Inventor： MIYANO KOHEI ,  KUROKI MORIFUMI

IPC: B09B3/00 ,  B03C1/00 ,  B03C1/02 ,  B09B5/00 ,  B22D11/06 ,  B22F8/00 ,  C23G5/02

CPC classification number: C22C1/002 ,  B03C1/02 ,  B03C1/30 ,  B22D11/001 ,  B22D11/0611 ,  B22F8/00 ,  B22F2998/10 ,  C21D9/52 ,  C21D2201/03 ,  C22B1/005 ,  C22B7/001 ,  C22B7/005 ,  C22C1/02 ,  C22C45/02 ,  C22C2202/02 ,  C23G5/04 ,  Y02P10/214 ,  Y02P10/24 ,  Y02W30/541 ,  B22F9/08 ,  B22F2009/001 ,  B22F2009/046 ,  B22F1/0074 ,  B22F1/0085

公开(公告)号：EP3115129A1

公开(公告)日：2017-01-11

申请号：EP16178350.1

申请日：2016-07-07

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： KHAZAKA, Rabih

IPC: B22F1/00 ,  B22F3/10

CPC classification number: H01L23/49568 ,  B22F1/0018 ,  B22F1/0074 ,  B22F3/1017 ,  B22F7/064 ,  H01L23/00 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29139 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/0695 ,  H01L2924/07025 ,  H01L2924/10253

Abstract: L'invention concerne un ensemble comprenant :
- au moins un élément susceptible de transmettre de la chaleur (E) ;
- au moins un substrat isolant électrique comportant au moins un film (I P ) de polymère bon conducteur thermique et isolant électrique ;
- au moins un joint fritté métallique (J1) en contact avec ledit film de polymère ;
- un radiateur principal ;
ledit radiateur étant en contact direct ou en contact via un joint fritté, avec ledit substrat

Abstract translation: 一种组件，包括：至少一个元件所做的是能够热传递的; 至少一个电绝缘包含聚合物的至少一个膜所做的是良好的热导体和电绝缘体的底物; 至少一个烧结金属接头所做的是在与高分子膜接触; 主辐射器; 散热器通过烧结结点在直接接触，或在接触基板，与所述。

公开(公告)号：EP3028792A1

公开(公告)日：2016-06-08

申请号：EP15197573.7

申请日：2015-12-02

Applicant: Institute Of Chemistry, Chinese Academy Of Sciences

Inventor： Zhang, Xingye ,  Song, Yanlin

IPC: B22F1/00 ,  B22F9/24

CPC classification number: C09D11/52 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0074 ,  B22F9/24 ,  B22F2009/245 ,  B22F2301/255 ,  B22F2304/05 ,  C09D11/037 ,  C22B11/04

Abstract: The present invention discloses a nano-silver powder dispersible in environment friendly weak solvents, method for preparing the same and an electrically conductive ink comprising the nano-silver powder. The present invention employs a disperser dissoluble in water and weak solvents and an alcohol amine as reducing agent to prepare mono-dispersed nano-silver, and employs ultrafiltration for purification and spray drying process to obtain a nano-silver powder dispersible in weak solvents, and thereby obtain an eco-solvent nano-silver electrically conductive ink. The electrically conductive ink in accordance with the present application has advantages of high safety, low volatility, low toxicity, high flash point, resistant to ultraviolet radiation and moisture etc., and can be used with uncoated bearing substrates, and is suitable for use in outdoor environments.

Abstract translation: 本发明盘松的纳米银粉末分散在环境友好弱溶媒，制备方法相同的，并且以导电油墨，其包含纳米银粉末。 本发明采用在水和弱溶剂和醇胺作为还原剂，以制备单分散纳米银分散染料可溶性，并且采用超滤进行纯化和喷雾干燥过程，以获得在弱溶剂中的纳米银粉末分散性的，并 由此获得到环保溶剂型纳米银导电性油墨。 在雅舞蹈的导电性油墨与本申请具有高安全性，低挥发性，低毒性，高闪点，在紫外线辐射和湿气等耐优点，并且可以与未涂覆的支承基底中使用，并适合于在使用中 室外环境。