公开(公告)号：EP3016109A1

公开(公告)日：2016-05-04

申请号：EP14866060.8

申请日：2014-11-28

申请人： LG Chem, Ltd.

发明人： PARK, Chee-Sung ,  KIM, Jae Hyun ,  JUN, Shin Hee ,  PARK, Cheol-Hee ,  SEONG, Eun Kyu ,  JUNG, Sang Yun ,  KIM, Jae Jin ,  JEONG, Han Nah ,  LEE, Su Jeong

IPC分类号： H01B1/22

CPC分类号： H01B1/22 ,  C08K3/22 ,  C08K2003/2248 ,  C08K2003/2262 ,  C09D5/24 ,  C09D7/61 ,  C09D7/68 ,  C09D11/52 ,  C09D169/00 ,  H05K1/095 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2203/0514 ,  H05K2203/1157 ,  C08L69/00

摘要： The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

公开(公告)号：EP2957155A1

公开(公告)日：2015-12-23

申请号：EP14751180.2

申请日：2014-02-18

申请人： Orbotech Ltd.

发明人： ZENOU, Michael ,  ALTMAN, Marc ,  ROTTMAN, Claudio ,  KOTLER, Zvi

IPC分类号： H05K3/02 ,  H05K3/12 ,  H05K3/22 ,  H05K1/09 ,  B05D3/06 ,  G03F7/20 ,  B05D5/12 ,  G03F7/30 ,  G03F7/40

CPC分类号： H05K3/12 ,  G03F7/039 ,  G03F7/40 ,  H05K1/097 ,  H05K3/02 ,  H05K3/027 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/227 ,  H05K2201/0257 ,  H05K2201/2054 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/111 ,  H05K2203/1131 ,  H05K2203/1194 ,  H05K2203/1476 ,  H05K2203/1484

摘要： A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

摘要翻译： 用于制造的方法包括用包含待在基板上图案化的材料的基体（28）涂覆基板（22）。 通过引导能量束照射在涂覆的基底上以将图案固定在基体中而不完全烧结图案，将图案（42）固定在基体中。 除去固定图案外的衬底上的基体被去除，并且在去除基体后，图案中的材料被烧结。

公开(公告)号：EP2325693A1

公开(公告)日：2011-05-25

申请号：EP11155249.3

申请日：2003-10-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Park, Jong Jin ,  Jung, Myung Sup ,  Lee, Jae Jun

IPC分类号： G03F7/027

CPC分类号： H05K3/02 ,  B82Y10/00 ,  B82Y30/00 ,  G03F7/027 ,  H01L51/0048 ,  H01L51/0052 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0514 ,  Y10S977/89

摘要： Disclosed is a composition comprising carbon nanotubes having surfaces modified by double bond-containing functional groups introduced into the surface of the carbon nanotubes.

摘要翻译： 公开了包含具有由引入到碳纳米管的表面含双键的官能团改性的表面的碳纳米管的组合物。

公开(公告)号：EP1422563A1

公开(公告)日：2004-05-26

申请号：EP03256824.8

申请日：2003-10-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Park, Jong Jin ,  Lee, Jae Jun, 517/704 Sinnamusil ,  Jung, Myung Sup

IPC分类号： G03F7/027

CPC分类号： H05K3/02 ,  B82Y10/00 ,  B82Y30/00 ,  G03F7/027 ,  H01L51/0048 ,  H01L51/0052 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0514 ,  Y10S977/89

摘要： Disclosed herein is a method of forming a negative pattern of carbon nanotubes through: modifying the surfaces of carbon nanotubes to have double bond-containing functional group capable of participating in radical polymerization; coating a substrate with a liquid coating composition prepared by dispersing the surface-modified carbon nanotubes in an organic solvent along with a photoinitiator; exposing the film to UV light through a photomask to induce radical polymerization of the carbon nanotubes; and developing the film. By virtue of the present invention, desired patterns of carbon nanotubes can be easily made on the surfaces of various substrates according to the conventional photolithography procedure.

摘要翻译： 公开的是通过在形成碳纳米管的负图案的方法：修饰碳纳米管的表面，以具有能够参与自由基聚合的双键的官能团; 涂布用的光引发剂沿所述表面改性的碳纳米管分散在有机溶剂中而制备的组合物的液体涂层的底物; 通过光掩模暴露所述膜于UV光以诱导碳纳米管的自由基聚合; 和发展电影。 凭借本发明的，碳纳米管的期望的图案可容易地各种基板gemäß的表面上以传统的光刻法过程上进行的。

公开(公告)号：EP1215701A3

公开(公告)日：2004-03-31

申请号：EP01129851.0

申请日：2001-12-14

申请人： CANON KABUSHIKI KAISHA

发明人： Uda, Yoshimi ,  Ishiwata, Kazuya ,  Kubo, Shinsaku ,  Watanabe, Yasuyuki

IPC分类号： H01J29/02 ,  H05K1/02

CPC分类号： H05K1/0271 ,  H01J29/02 ,  H01J31/127 ,  H01J2329/0489 ,  H01J2329/861 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/035 ,  H05K2201/09745 ,  H05K2203/0514 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/53204 ,  Y10T29/53209

摘要： As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 µm. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

公开(公告)号：EP0832448A1

公开(公告)日：1998-04-01

申请号：EP97922296.0

申请日：1997-04-11

申请人： Lynntech, Inc.

发明人： MURPHY, Oliver, J. ,  HODKO, Dalibor ,  ANDREWS, Craig, C. ,  CLARKE, Eric, T. ,  CHEPIN, Suchitra

IPC分类号： C08F2 ,  C08G61 ,  C23C26 ,  C25D5 ,  G03F7 ,  H01B1 ,  H01C7 ,  H01C17 ,  H01G9 ,  H05K1 ,  H05K3 ,  H05K9

CPC分类号： H01G9/025 ,  C08G61/124 ,  C23C26/00 ,  C25D5/54 ,  G03F7/027 ,  H01B1/12 ,  H01C7/005 ,  H01C17/242 ,  H05K1/095 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/105 ,  H05K3/185 ,  H05K3/188 ,  H05K3/424 ,  H05K9/0083 ,  H05K2201/0329 ,  H05K2203/0514 ,  Y10T29/417

摘要： The present invention provides electronically conducting polymer films formed from photosensitive formulations of pyrrole and an electron acceptor that have been selectively exposed to UV light, laser light, or electron beams. The formulations may include photoinitiators, flexibilizers, solvents and the like. These formulations can be used to manufacture multichip modules on typical multichip module substrates, such as alumina, fiberglass epoxy, silicon and polyimide. The formulations and methods of the invention enable the formation of passive electronic circuit elements such as resistors, capacitors and inductors in multichip modules or printed wiring boards.

公开(公告)号：EP0250842A3

公开(公告)日：1990-05-02

申请号：EP87107443.1

申请日：1987-05-22

申请人： W.R. Grace & Co.-Conn.

发明人： Lau, John Wing-Keung ,  Bennet, Kevin Elliott

IPC分类号： H05K1/16 ,  H05K3/46 ,  H05K3/00

CPC分类号： H05K3/4667 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/02 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0514 ,  H05K2203/056

摘要： Electronic circuits are made with a ceramic body and electrical components which can be disposed in different layers. Interconnecting means can be provided which are disposed entirely within the body. The ceramic body and the electrical components are sintered to form a monolithic structure in a single firing. The electrical components are formed in layers by mixing the electrical component in a sinterable form with a radiation sensitive material which serves as a binder. After exposure to radiation in the desired pattern the layer is developed to form the desired pattern. Multiple patterns can be formed prior to firing.

公开(公告)号：EP0157374A3

公开(公告)日：1986-08-06

申请号：EP85103766

申请日：1985-03-28

申请人： HOECHST AKTIENGESELLSCHAFT

发明人： Geissler, Ulrich, Dr. Dipl.-Ing. ,  Lampas, Heide

IPC分类号： G03C01/68 ,  G03F07/02 ,  H05K03/34

CPC分类号： H05K3/287 ,  B23K35/224 ,  C08G18/675 ,  G03F7/027 ,  H05K1/0266 ,  H05K3/28 ,  H05K2203/0514 ,  H05K2203/122 ,  H05K2203/161

摘要： Durch Strahlung polymerisierbares Gemisch und Ver fahren zum Aufbringen von Markierungen auf eine Lötstop resistschicht.
Es wird ein photopolymerisierbares Gemisch beschrie ben, das
a) eine radikalisch polymerisierbare Verbindung
b) ein polymeres Bindemittel
c) einen Photopolymerisationsinitiator und
d) eine mit dem Bindemittel (b), mit dem Polymerisa tionsprodukt von (a) oder mit sich selbst thermisch vernetz bare Verbindung und
e) ein Pigment
enthält. Das Gemisch dient zum Aufbringen von Kennzeich nungen auf gedruckte Schaltungen und wird bevorzugt nach dem Trockenresistverfahren auf die Lötstopresistschicht aufgebracht, belichtet und dann allein oder zusammen mit dieser entwickelt.

公开(公告)号：EP3016109B1

公开(公告)日：2018-01-31

申请号：EP14866060.8

申请日：2014-11-28

申请人： LG Chem, Ltd.

发明人： PARK, Chee-Sung ,  KIM, Jae Hyun ,  JUN, Shin Hee ,  PARK, Cheol-Hee ,  SEONG, Eun Kyu ,  JUNG, Sang Yun ,  KIM, Jae Jin ,  JEONG, Han Nah ,  LEE, Su Jeong

IPC分类号： H05K1/09 ,  H05K3/10 ,  H05K3/18 ,  H01B1/22 ,  C09D11/52 ,  C09D7/12 ,  C09D5/24

CPC分类号： H01B1/22 ,  C08K3/22 ,  C08K2003/2248 ,  C08K2003/2262 ,  C09D5/24 ,  C09D7/61 ,  C09D7/68 ,  C09D11/52 ,  C09D169/00 ,  H05K1/095 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2203/0514 ,  H05K2203/1157 ,  C08L69/00

摘要： The present invention relates to a composition for forming a conductive pattern capable of forming a fine conductive pattern on a variety of polymer resin products or resin layers by a significantly simple process, a method for forming a conductive pattern using the same, and a resin structure having a conductive pattern. The composition for forming a conductive pattern includes: a polymer resin; and a non-conductive metal compound including at least one of first and second metals as a predetermined non-conductive metal compound including the first and second metals, wherein a metal core including the first or second metal, or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

公开(公告)号：EP3244712A1

公开(公告)日：2017-11-15

申请号：EP17169727.9

申请日：2017-05-05

申请人： Xerox Corporation

发明人： BUCHAR, Wayne A. ,  GIBSON, George A.

IPC分类号： H05K3/02 ,  G06K19/077 ,  G06K19/067 ,  G03F7/06 ,  H05K3/10 ,  H05K1/16 ,  H05K1/09

CPC分类号： G03F7/2053 ,  G03F7/06 ,  G03F7/20 ,  G06K7/10009 ,  G06K19/0672 ,  H05K1/092 ,  H05K1/16 ,  H05K3/02 ,  H05K3/105 ,  H05K2201/10098 ,  H05K2203/0514 ,  H05K2203/0557 ,  H05K2203/056 ,  H05K2203/107 ,  H05K2203/125

摘要： A method for forming a structure for a radio frequency identification device includes dispensing a photosensitive compound 302 onto a substrate 304. Subsequently, first portions of the photosensitive compound are exposed to a light pattern 404 from a light source 308, while second portions of the photosensitive compound remain unexposed to the light source. Exposing the photosensitive compound to light reduces the photosensitive compound to a metal layer 402. The unexposed second portions of the photosensitive compound may be rinsed away to leave the metal layer. Processing may continue to form an RFID circuit from the metal layer, and a completed RFID transponder comprising the RFID circuit.

摘要翻译： 用于形成用于射频识别装置的结构的方法包括将光敏化合物302分配到衬底304上。随后，将光敏化合物的第一部分暴露于来自光源308的光图案404，而将光敏化合物的第二部分 化合物保持未暴露于光源。 将光敏化合物曝光以将光敏化合物还原成金属层402.光敏化合物的未曝光的第二部分可被冲洗掉以留下金属层。 处理可以继续从金属层形成RFID电路，并且完成包括RFID电路的RFID应答器。