公开(公告)号：EP4258336A2

公开(公告)日：2023-10-11

申请号：EP23192886.2

申请日：2019-04-11

申请人： Analog Devices, Inc.

发明人： BENSON, Keith E. ,  CLARK, Michael Patrick ,  HEINY, Michael Baldwin ,  BU, Vincent Lixiang

IPC分类号： H01L23/00

摘要： A packaged radio frequency (RF) module is disclosed. The module can include a package substrate, a first die electrically and mechanically attached to the substrate, the first die comprising an RF switch, wherein the first die is flip-chip attached to the package substrate by way of a plurality of interconnects between the first die and the package substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material protecting electrical connections between the first die and the package substrate, and a lid attached to the package substrate such that the package substrate and the lid at least partially define an air cavity within which the first and the second die are mounted, an active surface of the second die being exposed to the air cavity.

公开(公告)号：EP4258336A3

公开(公告)日：2024-08-14

申请号：EP23192886.2

申请日：2019-04-11

申请人： Analog Devices, Inc.

发明人： BENSON, Keith E. ,  CLARK, Michael Patrick ,  HEINY, Michael Baldwin ,  BU, Vincent Lixiang

IPC分类号： H01L23/66 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L23/04

CPC分类号： H01L23/04 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2223/662720130101 ,  H01L2223/668320130101 ,  H01L2224/0404220130101 ,  H01L2224/0562420130101 ,  H01L2224/0564420130101 ,  H01L2224/1300920130101 ,  H01L2224/1614520130101 ,  H01L2224/1622720130101 ,  H01L2224/1623520130101 ,  H01L2224/1718120130101 ,  H01L2224/2617520130101 ,  H01L2224/2901120130101 ,  H01L2224/2901420130101 ,  H01L2224/291920130101 ,  H01L2224/3222520130101 ,  H01L2224/3224520130101 ,  H01L2224/4809120130101 ,  H01L2224/4822720130101 ,  H01L2224/7320420130101 ,  H01L2224/7326520130101 ,  H01L2224/8338520130101 ,  H01L2224/859220130101 ,  H01L2224/9212520130101 ,  H01L2924/1025320130101 ,  H01L2924/103220130101 ,  H01L2924/1032920130101 ,  H01L2924/103320130101 ,  H01L2924/142120130101 ,  H01L2924/1421520130101 ,  H01L2924/142320130101 ,  H01L2924/1531120130101 ,  H01L2924/1531320130101 ,  H01L2924/1625120130101 ,  H01L2924/165920130101 ,  H01L2924/1904120130101 ,  H01L2924/1904320130101 ,  H01L2924/1910520130101 ,  H01L2924/3512120130101 ,  H01L23/66 ,  H01L2223/664420130101 ,  H01L23/3677 ,  H01L25/0655

摘要： A packaged radio frequency (RF) module is disclosed. The module can include a package substrate, a first die electrically and mechanically attached to the substrate, the first die comprising an RF switch, wherein the first die is flip-chip attached to the package substrate by way of a plurality of interconnects between the first die and the package substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material protecting electrical connections between the first die and the package substrate, and a lid attached to the package substrate such that the package substrate and the lid at least partially define an air cavity within which the first and the second die are mounted, an active surface of the second die being exposed to the air cavity.