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公开(公告)号:EP4398293A1
公开(公告)日:2024-07-10
申请号:EP23217754.3
申请日:2023-12-18
申请人: Analog Devices, Inc.
IPC分类号: H01L23/15 , H01L23/31 , H01L23/498 , H01L23/538
CPC分类号: H01L23/15 , H01L23/49827 , H01L23/5384 , H01L23/49816 , H01L21/486 , H01L23/3128 , H01L23/66 , H01L25/16
摘要: An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.
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公开(公告)号:EP4346189A1
公开(公告)日:2024-04-03
申请号:EP23188541.9
申请日:2023-07-28
申请人: Analog Devices, Inc.
摘要: Aspects of the present disclosure include a detection system including a base device including a power source configured to provide electrical energy to a plurality of edge nodes of a sensor network and a base data link configured to transmit a sensor interrogation signal to at least one of the plurality of edge nodes in the detection system and receive reporting information from at least one of the plurality of edge nodes, and the plurality of edge nodes sequentially coupled within the sensor network, wherein each edge node includes an edge data link configured to receive at least a portion of the electrical energy and the sensor interrogation signal, relay the at least a portion of the electrical energy and the sensor interrogation signal to a next edge node of the plurality of edge nodes, and transmit to the base device, in response to the sensor interrogation signal, the reporting information including sensor information associated with the edge node or a no selection match indication.
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公开(公告)号:EP4338284A1
公开(公告)日:2024-03-20
申请号:EP22808116.2
申请日:2022-05-09
申请人: Analog Devices, Inc.
发明人: YU, Tao , ALESSANDRI, Cristobal , LU, Wenjie
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公开(公告)号:EP4325583A1
公开(公告)日:2024-02-21
申请号:EP23188246.5
申请日:2023-07-27
申请人: Analog Devices, Inc.
发明人: YANG, Zhenyin
IPC分类号: H01L29/78 , H01L29/40 , H01L29/49 , H01L21/336
摘要: Apparatus and methods for shielded-gate trench power MOSFETs are disclosed herein. The power MOSFETs are fabricated using a self-aligned gate poly silicide to achieve low gate resistance. Accordingly, the power MOSFETs can be used in high speed applications operating with fast transistor switching speeds. Moreover, the self-aligned gate poly silicide processing can be achieved in relatively few processing steps, and thus can avoid the cost and/or complexity associated with conventional silicidation techniques for trench power MOSFETs. In particular, silicidation can include applying a silicide that is self-aligned to a gate oxide without an additional mask.
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公开(公告)号:EP4323738A1
公开(公告)日:2024-02-21
申请号:EP22720830.3
申请日:2022-04-08
申请人: Analog Devices, Inc.
IPC分类号: G01K7/42
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公开(公告)号:EP4323737A1
公开(公告)日:2024-02-21
申请号:EP22719441.2
申请日:2022-04-05
申请人: Analog Devices, Inc.
发明人: TANOVIC, Omer , YAUL, Frank , GULLAPALLI, Hemtej
IPC分类号: G01K7/42
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公开(公告)号:EP4300039A2
公开(公告)日:2024-01-03
申请号:EP23168935.7
申请日:2023-04-20
申请人: Analog Devices, Inc.
IPC分类号: G01C19/5726 , G01C19/5733
摘要: A gyroscope includes a substrate, a proof mass coupled to the substrate and configured to move in direction of an X axis and in direction of a Y axis orthogonal to the first axis, an X axis shuttle to selectively drive the proof mass along the X axis as a drive axis or sense movement of the proof mass along the X axis as a sense axis in response to the proof mass driven along the Y axis as the drive axis, and a Y axis shuttle to selectively sense movement of the proof mass along the Y axis as a sense axis in response to the proof mass driven along the X axis or drive the proof mass along the Y axis as the drive axis. The X axis shuttle is symmetric to the Y axis shuttle along a diagonal axis that is diagonal to both the X axis and the Y axis. The X and Y axis shuttles have gaps designed for a predetermined DC voltage to generate spring softening (negative cubic nonlinearity) that is equal to spring hardening (positive cubic nonlinearity), ensuring linear motion at high amplitudes (1/3 of the capacitive gap).
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公开(公告)号:EP4258553A1
公开(公告)日:2023-10-11
申请号:EP23158077.0
申请日:2023-02-22
申请人: Analog Devices, Inc.
发明人: ENGEL, Gil , WILKINS, Paul S.
摘要: Techniques that enable calibration of digital-to-analog Converters (DACs) with minimal processing overhead. A single frequency bin can be used to calibrate errors between bits. A low frequency feedback path can be included into a low frequency low power ADC to determine the error signal that exists in the calibration bin. The bits are calibrated when this error signal is minimized. The calibration techniques described provide an extremely efficient and optimal calibration at the DAC output of both static and dynamic errors.
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公开(公告)号:EP4258336A2
公开(公告)日:2023-10-11
申请号:EP23192886.2
申请日:2019-04-11
申请人: Analog Devices, Inc.
IPC分类号: H01L23/00
摘要: A packaged radio frequency (RF) module is disclosed. The module can include a package substrate, a first die electrically and mechanically attached to the substrate, the first die comprising an RF switch, wherein the first die is flip-chip attached to the package substrate by way of a plurality of interconnects between the first die and the package substrate, a second die electrically and mechanically attached to the substrate, an encapsulating material protecting electrical connections between the first die and the package substrate, and a lid attached to the package substrate such that the package substrate and the lid at least partially define an air cavity within which the first and the second die are mounted, an active surface of the second die being exposed to the air cavity.
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