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公开(公告)号：EP3960898A1
公开(公告)日：2022-03-02
申请号：EP20193722.4
申请日：2020-08-31
摘要： The present invention is directed to a composition for depositing a palladium coating on a substrate, in particular on a nickel-coated substrate, the composition comprising:
(i) palladium ions,
(ii) chloride ions,
(iii) ethylenediamine (EDA),
(iv) ethylenediamine disuccinate (EDDS), and
(v) at least one reducing agent.-
2.发明公开Autocatalytic plating bath composition for deposition of tin and tin alloys 有权Autokatalytische Plattierungsbadzusammensetzung zum Aufbringen von Zinn und Zinnlegierungen
公开(公告)号：EP2481835A1
公开(公告)日：2012-08-01
申请号：EP11152524.2
申请日：2011-01-28
摘要： An autocatalytic tin plating bath containing Sn 2+ ions, Ti 3+ ions as reducing agent, an organic complexing agent and phenanthroline or a derivative thereof as stabilizing agent is disclosed. The plating bath is suitable for manufacture of printed circuit boards, lC substrates and metallization of semiconductor wafers.
摘要翻译： 公开了含有Sn 2+离子，作为还原剂的Ti 3+离子，有机络合剂和菲咯啉或其衍生物作为稳定剂的自催化镀锡浴。 电镀液适用于制造印刷电路板，lC基板和半导体晶片的金属化。
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公开(公告)号：EP4215642A1
公开(公告)日：2023-07-26
申请号：EP22153310.2
申请日：2022-01-25
摘要： The present invention is directed to a composition for depositing a palladium coating on an activated copper-coated substrate, the composition comprising:
(i) palladium ions,
(ii) chloride ions,
(iii) ethylenediamine (EDA),
(iv) ethylenediamine disuccinate (EDDS), and
(v) at least one reducing agent,
wherein the composition has a pH in a range from 7.5 to 9.5, preferably from 7.6 to 9.1, more preferably from 7.7 to 8.7, and most preferably from 7.8 to 8.5.-
公开(公告)号：EP2581470A1
公开(公告)日：2013-04-17
申请号：EP11184919.6
申请日：2011-10-12
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1637
摘要： The present invention concerns an aqueous plating bath composition for electroless deposition of palladium and/or palladium alloys and a method which utilises such aqueous plating bath compositions. The aqueous plating bath comprises a source of palladium ions, a reducing agent, a nitrogenated complexing agent which is free of phosphorous and an organic stabilising agent comprising 1 to 5 phosphonate residues. The aqueous plating bath and the method are particularly useful if the aqueous plating bath comprises copper ions.
摘要翻译： 本发明涉及用于无电沉积钯和/或钯合金的水性镀浴组合物以及使用这种水性镀浴组合物的方法。 含水电镀液包含钯离子源，还原剂，不含磷的氮化络合剂和包含1至5个膦酸酯残基的有机稳定剂。 如果含水电镀浴包含铜离子，则含水电镀浴和方法特别有用。
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公开(公告)号：EP2581470B1
公开(公告)日：2016-09-28
申请号：EP11184919.6
申请日：2011-10-12
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1637
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6.发明授权
公开(公告)号：EP2481835B1
公开(公告)日：2013-09-11
申请号：EP11152524.2
申请日：2011-01-28
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7.发明公开A layer assembly, a method of forming said layer assembly and a circuit carrier comprising said layer assembly 审中-公开层结构中，具有该层布置在制备该层布置和电路基板的过程
公开(公告)号：EP1956114A1
公开(公告)日：2008-08-13
申请号：EP07090013.9
申请日：2007-01-30
发明人： Hirsekorn, Isabel-Roda , Rossenbeck, Britta, Dr. , Schreier, Hans-Jürgen, Dr. , Sebald, Christian , Wegricht, Jens , Beck, Thomas , Kuldip, Singh Johal
CPC分类号： H05K3/244 , C23C18/1651 , C23C18/32 , C23C18/44 , C23C18/54 , H01L24/11 , H01L2224/0554 , H01L2224/05567 , H01L2224/05573 , H01L2224/05647 , H01L2924/00014 , H01L2924/14 , H01L2924/351 , H05K3/3463 , H05K2201/0338 , H05K2203/072 , H05K2203/073 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： To achieve good solder performance with Pd-free solder to a BGA design, a layer assembly comprising first, second and, optionally, third sub-layers is provided, wherein said first sub-layer comprises a first material, said first material comprising nickel and phosphorus and said first sub-layer being in contact with said second sub-layer; said second sub-layer comprises a second material, said second material comprising palladium and phosphorus and said second sub-layer being in contact with said first sub-layer and said third sub-layer and wherein said second sub-layer is at least 0.1 µm thick; and said third sub-layer comprises a third material, said third material consisting of gold or a gold alloy and said third sub-layer being in contact with said second sub-layer. Such layer assembly is coated to the copper structure which is provided on one or on both sides of the carrier corpus of a circuit carrier.
摘要翻译： 为了实现用Pd-无铅焊料到BGA设计中，层组件包括第一，第二和任选的第三子层良好的焊料性能设置，worin所述第一子层包括第一材料，所述第一材料包含镍和 磷和所述第一子层与所述第二子层接触; 所述第二子层包括第二材料，所述第二材料包括钯，磷和所述第二子层具有与所述第一子层接触和所述第三子层和worin所述第二子层为至少0.1微米 厚; 和所述第三子层包括第三材料，所述第三材料由金或金合金，并且所述第三子层与所述第二子层接触。 搜索层组件被涂覆到铜结构中的所有其设置在一个或上的电路载波的载波语料库的bothsides。
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