LOW-K DIELECTRICS OBTAINABLE BY TWIN POLYMERIZATION

    公开(公告)号:EP2272068B1

    公开(公告)日:2018-07-04

    申请号:EP09738126.3

    申请日:2009-04-28

    Applicant: BASF SE

    CPC classification number: H01B3/441 C08G77/00 C08J9/26 C08J2383/00

    Abstract: The invention relates to a dielectric layer with a permittivity of 3.5 or less comprising a dielectric obtainable by polymerizing at least one twin monomer comprising a) a first monomer unit which comprises a metal or semimetal, and b) a second monomer unit which is connected to the first monomer unit via a chemical bond, wherein the polymerization involves polymerizing the twin monomer with breakage of the chemical bond and formation of a first polymer comprising the first monomer unit and of a second polymer comprising the second monomer unit, and wherein the first and the second monomer unit polymerize via a common mechanism.

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