专利检索 ap:("CABOT MICROELECTRONICS CORPORATION") AND inv:"LEFEVRE, Paul Andre" 第 1 页

1.

发明公开
POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETO 审中-公开

公开(公告)号：EP3370917A1

公开(公告)日：2018-09-12

申请号：EP16862819.6

申请日：2016-11-02

申请人： Cabot Microelectronics Corporation

发明人： LEFEVRE, Paul Andre , ALLISON, William C. , SCOTT, Diane , ARNO, Jose

IPC分类号： B24B37/20 , B24B37/22 , B24B37/24 , B24B37/26 , C09K3/14 , H01L21/321

CPC分类号： B24B37/22 , B24B37/205

摘要： Polishing pads having a foundation layer and a window attached to the foundation layer, and methods of fabricating such polishing pads, are described. In an example, a polishing pad for polishing a substrate includes a foundation layer having a first modulus. A polishing layer is attached to the foundation layer and has a second modulus less than the first modulus. A first opening is through the polishing layer and a second opening is through the foundation layer. The first opening exposes at least a portion of the second opening and exposes a portion of the foundation layer. A window is disposed in the first opening and is attached to the exposed portion of the foundation layer.

2.

发明授权
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS 有权

公开(公告)号：EP2948271B1

公开(公告)日：2019-05-08

申请号：EP14702711.4

申请日：2014-01-16

申请人： CABOT MICROELECTRONICS CORPORATION

发明人： LEFEVRE, Paul Andre , ALLISON, William C. , SIMPSON, Alexander William , SCOTT, Diane , HUANG, Ping , CHARNS, Leslie M. , RINEHART, James Richard , KERPRICH, Robert

IPC分类号： B24B37/26 , B24B37/20 , B24B37/22

3.

发明授权
LOW DENSITY POLISHING PAD 有权

公开(公告)号：EP3027363B1

公开(公告)日：2020-01-15

申请号：EP14747270.8

申请日：2014-07-17

申请人： Cabot Microelectronics Corporation

发明人： HUANG, Ping , ALLISON, William C. , FRENTZEL, Richard , LEFEVRE, Paul Andre , KERPRICH, Robert , SCOTT, Diane

IPC分类号： B24B37/24

4.

发明公开
LOW DENSITY POLISHING PAD 审中-公开
标题翻译：低密度抛光垫

公开(公告)号：EP3250343A1

公开(公告)日：2017-12-06

申请号：EP16704084.9

申请日：2016-01-13

申请人： Cabot Microelectronics Corporation

发明人： HUANG, Ping , ALLISON, William C. , FRENTZEL, Richard , LEFEVRE, Paul Andre , KERPRICH, Robert , SCOTT, Diane

IPC分类号： B24B37/20 , B24B37/24 , B24B37/26

CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , C08J9/0061 , C08J9/228 , C08J2333/00 , C08J2375/04 , C08J2433/00 , C08J2475/04

摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad (222) for polishing a substrate includes a polishing body having a density approximately in the range of 0.4 - 0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores (218) dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores (218) has a shell composed of an acrylic co-polymer.

5.

发明授权
POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER 有权
标题翻译：具有抛光表面层的抛光垫具有透明基底层上方的孔或开口

公开(公告)号：EP2872291B1

公开(公告)日：2017-08-09

申请号：EP13728287.7

申请日：2013-05-29

申请人： Cabot Microelectronics Corporation

发明人： LEFEVRE, Paul Andre , ALLISON, William C. , LACASSE, James P. , SCOTT, Diane , SIMPSON, Alexander William , HUANG, Ping , CHARNS, Leslie M.

IPC分类号： B24B37/20 , B24B37/22 , B24B37/26 , B24D11/00 , B24D18/00

CPC分类号： B24B37/205 , B24B37/16 , B24B37/22 , B24B37/26 , B24D11/003 , B24D18/0009