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1.发明授权POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER 有权具有抛光表面层的抛光垫具有透明基底层上方的孔或开口
公开(公告)号：EP2872291B1
公开(公告)日：2017-08-09
申请号：EP13728287.7
申请日：2013-05-29
发明人： LEFEVRE, Paul Andre , ALLISON, William C. , LACASSE, James P. , SCOTT, Diane , SIMPSON, Alexander William , HUANG, Ping , CHARNS, Leslie M.
CPC分类号： B24B37/205 , B24B37/16 , B24B37/22 , B24B37/26 , B24D11/003 , B24D18/0009
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公开(公告)号：EP3027363B1
公开(公告)日：2020-01-15
申请号：EP14747270.8
申请日：2014-07-17
发明人： HUANG, Ping , ALLISON, William C. , FRENTZEL, Richard , LEFEVRE, Paul Andre , KERPRICH, Robert , SCOTT, Diane
IPC分类号： B24B37/24
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公开(公告)号：EP2948271B1
公开(公告)日：2019-05-08
申请号：EP14702711.4
申请日：2014-01-16
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公开(公告)号：EP2590782B1
公开(公告)日：2018-02-21
申请号：EP11700490.3
申请日：2011-01-11
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , B24D11/003 , B32B3/30 , B32B5/142 , B32B5/18 , B32B7/06 , B32B7/12 , B32B25/045 , B32B25/08 , B32B27/065 , B32B27/08 , B32B27/308 , B32B27/36 , B32B2266/0278 , B32B2266/08 , B32B2307/40 , B32B2307/41 , B32B2307/412 , B32B2307/536 , B32B2307/72 , B32B2307/732 , B32B2457/00 , C08G18/3206 , C08G18/7621
摘要： Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
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5.发明授权
公开(公告)号：EP2969392B1
公开(公告)日：2020-04-15
申请号：EP14712132.1
申请日：2014-03-05
发明人： LEFEVRE, Paul, Andre , ALLISON, William, C. , SIMPSON, Alexander, William , SCOTT, Diane , HUANG, Ping , CHARNS, Leslie, M. , RINEHART, James, Richard , KERPRICH, Robert
IPC分类号： B24B37/26
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公开(公告)号：EP3250343A1
公开(公告)日：2017-12-06
申请号：EP16704084.9
申请日：2016-01-13
发明人： HUANG, Ping , ALLISON, William C. , FRENTZEL, Richard , LEFEVRE, Paul Andre , KERPRICH, Robert , SCOTT, Diane
CPC分类号： B24B37/24 , B24B37/205 , B24B37/26 , C08J9/0061 , C08J9/228 , C08J2333/00 , C08J2375/04 , C08J2433/00 , C08J2475/04
摘要： Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad (222) for polishing a substrate includes a polishing body having a density approximately in the range of 0.4 - 0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores (218) dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores (218) has a shell composed of an acrylic co-polymer.
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公开(公告)号：EP2627478B8
公开(公告)日：2017-08-02
申请号：EP11773633.0
申请日：2011-10-11
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