公开(公告)号：EP0702796A4

公开(公告)日：1997-01-22

申请号：EP94919153

申请日：1994-05-23

申请人： CORNELL RES FOUNDATION INC

发明人： SHAW KEVIN A ,  ADAMS SCOTT G ,  MACDONALD NOEL C

IPC分类号： B60G23/00 ,  B81B3/00 ,  B81C1/00 ,  G01P1/00 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  H01L29/84

CPC分类号： G01P15/131 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2203/0109 ,  B81B2203/0136 ,  G01P1/006 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0831 ,  G01R33/0286

摘要： A microelectromechanical accelerometer (60) having submicron features is fabricated from a single crystal silicon substrate (10). The accelerometer includes a movable portion incorporating an axial beam (102) carrying laterally-extending high aspect ratio released fingers (110-117, 120-127) cantilevered above the floor of a cavity formed in the substrate during the fabrication process. The movable portion is supported by restoring springs (132, 142) having controllable flexibility to vary the resonant frequency of the structure. A multiple-beam structure provides stiffness in the movable portion for accuracy.

摘要翻译： 具有亚微米特征的微机电加速度计（60）由单晶硅衬底（10）制造。 加速度计包括结合轴向梁（102）的可移动部分，所述轴向梁承载在制造过程期间在形成于衬底中的空腔的底板上方悬伸的横向延伸高纵横比释放指状物（110-117,120-127）。 可移动部分由具有可控柔性的复位弹簧（132,142）支撑，以改变结构的谐振频率。 为了精度，多梁结构在可移动部分中提供刚度。

公开(公告)号：EP1062684A4

公开(公告)日：2006-07-26

申请号：EP99903085

申请日：1999-01-14

申请人： CORNELL RES FOUNDATION INC

发明人： ADAMS SCOTT G ,  SHAW KEVIN A ,  WEBB RUSSELL Y ,  REED BRYAN W ,  MACDONALD NOEL C ,  DAVIS TIMOTHY J

IPC分类号： B81C1/00 ,  B81B3/00 ,  H01L21/76 ,  H01L21/762 ,  H01L29/84 ,  H01L21/00

CPC分类号： H01L21/76224 ,  B81B2203/0118 ,  B81B2203/033 ,  B81C1/00142 ,  B81C1/00698

摘要： An isolation process which enhances the performance of silicon micromechanical devices incorporates dielectric isolation segments (254, 256) within the silicon microstructure, which is otherwise composed of an interconnected grid of cantilevered beams. A metal layer on top of the beams (276, 278) provides interconnects (244, 246) and also allows contact to the silicon beams. Multiple conduction paths are incorporated through a metal patterning step prior to structure definition. The invention improves manufacturability of previous processes by performing all lithographic patterning steps on flat topographies, and removing complicated metal sputtering steps required of most high aspect ratio processes. With little modification, the invention can be implemented with integrated circuit fabrication sequences for fully integrated devices.

公开(公告)号：EP0834218A4

公开(公告)日：2002-04-10

申请号：EP96923321

申请日：1996-06-20

申请人： CORNELL RES FOUNDATION INC

发明人： ADAMS SCOTT G ,  BERTSCH FRED M ,  SHAW KEVIN A ,  MACDONALD NOEL C

IPC分类号： H03H9/125 ,  H02N1/00 ,  H03H9/02 ,  H03H9/205 ,  H03H9/24 ,  H03H9/46

CPC分类号： H03H9/02425 ,  H02N1/008 ,  H03H9/02417 ,  H03H9/46 ,  H03H2009/02496

摘要： A tunable electromechanical resonator structure incorporates an electrostatic actuator (66, 68) which permits reduction or enhancement of the resonant frequency of the structure. The actuator consists of two sets of opposed electrode fingers, each set having a multiplicity of spaced, parallel fingers (70, 72, 84, 90). One set (70, 72) is mounted on a movable portion (54) of the resonator structure and one set (84, 90) is mounted on an adjacent fixed base (132, 134) on the substrate, adjacent ends spaced apart by a gap (86, 92). An adjustable bias voltage (130) across the sets of electrodes adjusts the resonant frequency of the movable structure.