摘要:
The invention relates to a method for electron beam induced deposition of electrically conductive material from a metal carbonyl. Said method consists of the following steps: at least one electron beam is provided on one area of a substrate (90), the at least one metal carbonyl is stored at a first temperature, and then heated to at least a second temperature prior to placing it on the area on which the at least one electron beam strikes the substrate (90).
摘要:
The invention relates to a method for electron beam induced etching of a layer (120, 122) contaminated with gallium. Said method consists of the following steps: at least one first compound containing halogen is provided as an etching gas on one area on which an electron beam strikes the layer (120, 220) and at least one second compound containing halogen is provided as a precursor gas for removing gallium from said area.
摘要:
The invention relates to a method for processing a substrate with a focussed particle beam which incidents on the substrate, the method comprising the steps of: (a) generating at least one reference mark on the substrate using the focused particle beam and at least one processing gas, (b) determining a reference position of the at least one reference mark, (c) processing the substrate using the reference position of the reference mark, and (d) removing the at least one reference mark from the substrate.
摘要:
The invention relates to a method for electron beam induced etching of a material (100, 200). Said method consists of the following steps: at least one etching gas is provided on one area of the material (100, 200) on which an electron beam strikes said material (100, 200) and at least one passivation gas that is used to slow down or prevent spontaneous etching by the at least one etching gas is provided.
摘要:
The invention relates to a method for electron beam induced etching of a material (100, 200). Said method consists of the following steps: at least one etching gas is provided on one area of the material (100, 200) on which an electron beam strikes said material (100, 200) and at least one passivation gas that is used to slow down or prevent spontaneous etching by the at least one etching gas is provided.