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公开(公告)号：EP3159369A4
公开(公告)日：2018-02-14
申请号：EP15809360
申请日：2015-06-16
IPC分类号： C08G77/50 , C08G77/44 , C08L83/04 , C08L83/05 , C08L83/14 , C09D183/04 , C09J11/00 , C09J183/04 , C09J183/05 , C09J183/07
CPC分类号： C08L83/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/80 , C08K5/5419 , C08K5/56 , C08L83/00 , C09D183/04 , C09J11/00 , C09J183/04
摘要： A hot melt silicone that is non-flowable at 25°C and that has a melt viscosity at 100°C of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol% or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass% or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25°C, has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.
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公开(公告)号：EP3190156A4
公开(公告)日：2018-03-28
申请号：EP15838940
申请日：2015-08-26
发明人： YAMAZAKI HARUNA , YOSHITAKE MAKOTO , DOGEN RYOTA
IPC分类号： C08L83/07 , C08G77/00 , C08G77/12 , C08G77/20 , C08L83/04 , C08L83/05 , C09D183/04 , C09J183/04 , H01L23/29 , H01L23/31 , H01L33/52
CPC分类号： C08G77/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , C09D183/04 , H01L23/29 , H01L23/31 , H01L33/52 , H01L33/56 , H01L2924/0002 , H01L2924/00 , C08L83/00 , C08K5/56
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst; and a curable hot-melt silicone that is obtained by subjecting this composition to a hydrosilylation reaction to a degree that does not form a cured product, that is non-flowable at 25°C, and that has a melt viscosity at 100°C of 5000 Pa·s or less. This curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. This curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.
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3.发明公开
公开(公告)号：EP3107965A4
公开(公告)日：2017-10-11
申请号：EP15751816
申请日：2015-02-16
发明人： JO GUNN , YAMAZAKI HARUNA , YOOK JU YOUNG , YOSHITAKE MAKOTO
IPC分类号： C08L83/04 , C08G77/00 , C08G77/08 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/38 , C09J183/04 , H01L23/29 , H01L33/50
CPC分类号： C08G77/38 , C08G77/08 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G2170/20 , C08K3/22 , C08K5/56 , C08K2201/00 , C08L83/00 , C08L83/04 , C09J183/04 , H01L23/296
摘要： This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.
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