公开(公告)号：EP2946856A4

公开(公告)日：2017-01-18

申请号：EP14869414

申请日：2014-12-04

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： HINOTSU TAKASHI ,  SHIBAYAMA TOMONORI ,  MIYOSHI HIROMASA

IPC: B22F9/24 ,  B22F1/00 ,  B22F1/02 ,  B22F9/00 ,  C09C1/62 ,  C09C3/08 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  C09D11/52 ,  H01B1/00 ,  H01B1/22

CPC classification number: C09D11/52 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F1/0074 ,  B22F9/24 ,  C09C1/62 ,  C09D11/033 ,  C09D11/037 ,  C09D11/322 ,  C09D11/36 ,  H01B1/22

Abstract: There is produced a fine silver particle dispersing solution which contains: fine silver particles (the content of silver in the fine silver particle dispersing solution is 30 to 90 % by weight), which have an average primary particle diameter of 1 to 100 nm and which are coated with an amine having a carbon number of 8 to 12, such as octylamine, serving as an organic protective material; a polar solvent (5 to 70 % by weight) having a boiling point of 150 to 300 °C; and an acrylic dispersing agent (1.5 to 5 % by weight with respect to the fine silver particles), such as a dispersing agent of at least one of acrylic acid ester and methacrylic acid ester.

公开(公告)号：EP2719486A4

公开(公告)日：2016-01-20

申请号：EP11867177

申请日：2011-06-10

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KURITA SATORU ,  HINOTSU TAKASHI ,  SASAKI SHINYA

IPC: B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H05K3/32

CPC classification number: C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

公开(公告)号：EP3141322A4

公开(公告)日：2017-12-27

申请号：EP15811202

申请日：2015-05-29

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KURITA SATORU ,  HINOTSU TAKASHI ,  ENDOH KEIICHI ,  MIYOSHI HIROMASA

IPC: B22F7/08 ,  B22F1/00 ,  B22F1/02 ,  B22F9/00 ,  B23K20/00 ,  H01B1/22 ,  H01L21/52 ,  H05K3/32

CPC classification number: B23K35/3006 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  B22F9/00 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K35/3612 ,  H01B1/22 ,  H01L21/52 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/15747 ,  H05K3/32

Abstract: A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300 °C, a viscosity of 2,000 to 10,000 mPa at 20°C and at least one methyl group, such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.

公开(公告)号：EP2637175A4

公开(公告)日：2017-03-08

申请号：EP11837934

申请日：2011-10-28

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： HINOTSU TAKASHI ,  HIYAMA YUTO ,  UEYAMA TOSHIHIKO

IPC: H01B1/22 ,  C08K5/09 ,  C08K5/092 ,  H01B1/00 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12

CPC classification number: H01B1/16 ,  H01B1/22

Abstract: When a substrate having a low heat resistance is used, heat treatment at approximately 120°C at which deformation does not occur is desirable. When a low resistance is achieved regardless of the type of resin used for a conductive paste, a flexible design of a paste is possible according to purposes, and fields to which the paste could be applied are expanded. Thus, a conductive paste capable of forming a conductive film exhibiting a high conductivity even at low temperatures of approximately 120°C regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin is provided. In a method for forming a conductive film, a conductive paste in which a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste including silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin is used as a paste for formation of a wiring.

Abstract translation: 当使用具有低耐热性的衬底，在120℃热处理C大致在哪个不发生变形是理想的。 当低电阻不管取得用于导电膏的树脂的类型的，贴合的柔性设计是可能gemäß到的目的，并且对上述A糊可以被应用于被扩展字段。 因此，导电性膏能够形成导电膜，即使在大约120℃的低温下，无论是否在构成树脂为热固性树脂或提供了一种热塑性树脂表现出高导电性。 在用于形成导电电影，其中导电膏具有2-8个碳原子的二羧酸加入到包括具有2至6个碳原子，分散介质的有机物质涂覆有银纳米颗粒的糊剂的方法，和树脂 被用作用于形成布线的糊。

公开(公告)号：EP2990142A4

公开(公告)日：2017-01-04

申请号：EP14787542

申请日：2014-04-25

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  MIYOSHI HIROMASA ,  HINOTSU TAKASHI ,  KURITA SATORU ,  KOHNO YOSHIKO

IPC: B22F9/00 ,  B22F1/02 ,  B22F9/24 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H01R43/00

CPC classification number: B23K35/025 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B23K1/00 ,  B23K35/3006

Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200°C or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.

Abstract translation: 提供了可以在较低温度（例如200℃或更低）下结合的金属纳米颗粒分散体，并且能够获得粘合部分，金属纳米颗粒分散体的优异的机械性能和电性能，包括：金属纳米颗粒 每个颗粒的表面的至少一部分涂覆有具有8个以上碳原子的胺A. 和用于分散金属纳米粒子的分散介质，其中分散介质含有胺B，其为具有7个或更少碳原子的伯，仲或叔胺，并且是直链烷基胺或链烷醇胺。

公开(公告)号：EP2902138A4

公开(公告)日：2016-07-27

申请号：EP13844412

申请日：2013-09-20

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： SHIBAYAMA TOMONORI ,  HINOTSU TAKASHI ,  KARIYASU TATUYA

IPC: B22F9/24 ,  H01B1/02

CPC classification number: B22F9/24 ,  C22B11/04 ,  C22C5/06 ,  H01B1/02