公开(公告)号：EP3141322A4

公开(公告)日：2017-12-27

申请号：EP15811202

申请日：2015-05-29

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KURITA SATORU ,  HINOTSU TAKASHI ,  ENDOH KEIICHI ,  MIYOSHI HIROMASA

IPC: B22F7/08 ,  B22F1/00 ,  B22F1/02 ,  B22F9/00 ,  B23K20/00 ,  H01B1/22 ,  H01L21/52 ,  H05K3/32

CPC classification number: B23K35/3006 ,  B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  B22F9/00 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K35/3612 ,  H01B1/22 ,  H01L21/52 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/15747 ,  H05K3/32

Abstract: A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300 °C, a viscosity of 2,000 to 10,000 mPa at 20°C and at least one methyl group, such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.

公开(公告)号：EP2645408A4

公开(公告)日：2016-06-08

申请号：EP11842826

申请日：2011-05-13

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KURITA SATORU ,  ENDOH KEIICHI ,  SAITO YU ,  HISAEDA YUTAKA ,  UEYAMA TOSHIHIKO

IPC: H01L21/60 ,  B22F1/00 ,  B23K1/00 ,  B23K20/00 ,  B23K35/02 ,  B23K101/36 ,  B32B3/26 ,  B32B15/01 ,  H01L23/00 ,  H05K3/32

CPC classification number: B23K31/02 ,  B22F1/0014 ,  B22F1/0062 ,  B22F1/0096 ,  B22F2999/00 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K2201/36 ,  B32B3/26 ,  B32B15/018 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05639 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/2939 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/83439 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/83907 ,  H01L2224/83986 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/203 ,  Y10T428/12479 ,  H01L2224/832 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  B22F1/0018 ,  H01L2924/0002

Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1nm or more and 200nm or less, and silver particles having an average particle size of 0.5µm or more and 10µm or less, and an organic material having two or more carboxyl groups.

公开(公告)号：EP2805783A4

公开(公告)日：2016-01-20

申请号：EP12866368

申请日：2012-01-20

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  KURITA SATORU ,  NAGAOKA MINAMI

IPC: B22F1/02 ,  B22F1/00

CPC classification number: B23K35/365 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F3/1021 ,  B23K1/203 ,  B23K35/3006

Abstract: The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant.

公开(公告)号：EP3059740A4

公开(公告)日：2017-05-31

申请号：EP14854309

申请日：2014-10-06

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KURITA SATORU ,  ENDOH KEIICHI ,  MIYOSHI HIROMASA

IPC: B22F1/00 ,  B22F5/00 ,  B23K35/30 ,  H01L23/00

CPC classification number: H01L24/27 ,  B22F1/0018 ,  B22F1/0074 ,  B22F5/006 ,  B22F2999/00 ,  B23K35/3006 ,  B23K2203/12 ,  B23K2203/56 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/27505 ,  H01L2224/277 ,  H01L2224/29017 ,  H01L2224/29339 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/8384 ,  H01L2924/10253 ,  H01L2924/15788 ,  H01L2924/00 ,  B22F3/22

Abstract: [Problem] To provide a joining silver sheet that is capable of providing a high joining strength with a low pressure of 3 MPa or lower. [Means for Resolution] A joining silver sheet containing silver particles having a particle diameter of from 1 to 250 nm integrated by sintering, and having a capability of further undergoing sintering on heating and retaining the silver sheet at a temperature range of from T A to T B (°C) satisfying 270 ‰¤ T A

Abstract translation: [问题]为了提供一种接合银片所做的是能够提供高接合强度与3兆帕或更低的低压。 [用于解决]一种接合银片含具有1至250纳米的粒径的银颗粒通过烧结一体化，具有在加热时进一步经受烧结的能力和在温度范围从TA到TB的保留银片 （℃）满足270‰¤TA

公开(公告)号：EP3012048A4

公开(公告)日：2017-03-08

申请号：EP14814197

申请日：2014-06-19

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  NAGAOKA MINAMI ,  KURITA SATORU ,  MIYOSHI HIROMASA ,  KOHNO YOSHIKO ,  MIYAZAWA AKIHIRO

IPC: B22F1/00 ,  B22F1/02 ,  B22F7/08 ,  H05K3/32

CPC classification number: B23K35/3006 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0022 ,  B22F1/0062 ,  B22F1/0074 ,  B22F7/064 ,  B22F2301/255 ,  B22F2303/40 ,  B22F2304/05 ,  B23K1/0008 ,  B23K35/025 ,  H05K3/3484

Abstract: A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7 % by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2 % by weight of an acid dispersant and 0.01 to 0.1 % by weight of phosphate ester dispersant; and 0.01 to 0.1% by weight of a sintering aid, such as diglycolic acid, wherein the content of the fine silver particles is in the range of from 5% by weight to 30% by weight, and the content of the silver particles is in the range of from 60 % by weight to 90% by weight, the content of the total of the fine silver particles and the silver particles being not less than 90 % by weight.

公开(公告)号：EP2990142A4

公开(公告)日：2017-01-04

申请号：EP14787542

申请日：2014-04-25

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  MIYOSHI HIROMASA ,  HINOTSU TAKASHI ,  KURITA SATORU ,  KOHNO YOSHIKO

IPC: B22F9/00 ,  B22F1/02 ,  B22F9/24 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H01R43/00

CPC classification number: B23K35/025 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B23K1/00 ,  B23K35/3006

Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200°C or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.

Abstract translation: 提供了可以在较低温度（例如200℃或更低）下结合的金属纳米颗粒分散体，并且能够获得粘合部分，金属纳米颗粒分散体的优异的机械性能和电性能，包括：金属纳米颗粒 每个颗粒的表面的至少一部分涂覆有具有8个以上碳原子的胺A. 和用于分散金属纳米粒子的分散介质，其中分散介质含有胺B，其为具有7个或更少碳原子的伯，仲或叔胺，并且是直链烷基胺或链烷醇胺。

公开(公告)号：EP3189914A4

公开(公告)日：2018-06-06

申请号：EP15838051

申请日：2015-08-31

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  MIYOSHI HIROMASA ,  MOTOMURA KIMIKAZU ,  KURITA SATORU

IPC: B22F1/00 ,  B22F7/08 ,  B22F9/00 ,  B22F9/24 ,  B23K20/00 ,  C22C9/00 ,  H01L21/52 ,  H05K3/32

CPC classification number: B23K35/302 ,  B22F1/0011 ,  B22F1/0059 ,  B22F7/008 ,  B22F7/062 ,  B22F9/02 ,  B22F9/24 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K5/00 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K35/025 ,  B23K35/36 ,  B23K2201/42 ,  B23K2203/12 ,  C22C9/00 ,  H01B1/22 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/27848 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/32245 ,  H01L2224/83075 ,  H01L2224/83192 ,  H01L2224/83204 ,  H01L2224/8384 ,  H01L2924/00012

Abstract: There is provided an inexpensive bonding material, which can be easily printed on articles to be bonded to each other and which can suppress the generation of voids in the bonded portions of the articles to be bonded to each other, and a bonding method using the same. In a bonding material of a copper paste which contains a copper powder containing 0.3 % by weight or less of carbon and having an average particle diameter of 0.1 to 1 µ m, and an alcohol solvent, such as a monoalcohol, a diol, a triol or a terpene alcohol, the content of the copper powder is in the range of from 80 % by weight to 95 % by weight, and the content of the alcohol solvent is in the range of from 5 % by weight to 20 % by weight.

公开(公告)号：EP3150301A4

公开(公告)日：2018-01-03

申请号：EP15799050

申请日：2015-05-15

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： ENDOH KEIICHI ,  YUZAKI KOICHI ,  NAGAOKA MINAMI ,  MIYOSHI HIROMASA ,  KURITA SATORU

IPC: B22F1/00 ,  B22F1/02 ,  B22F9/00 ,  B23K20/00 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00

CPC classification number: H01L24/29 ,  B22F1/00 ,  B22F1/0044 ,  B22F1/02 ,  B22F9/00 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2304/054 ,  B22F2998/10 ,  B23K1/0016 ,  B23K20/00 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/3618 ,  H01B1/00 ,  H01B1/22 ,  H01B13/00 ,  H01L24/83 ,  H01L2224/29139 ,  H01L2224/8309 ,  H01L2224/8384 ,  H01L2924/01047

Abstract: A bonding material includes: fine silver particles having an average primary particle diameter of 1 to 50 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 µ m, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing a primary alcohol solvent and a terpene alcohol solvent; and a dispersant containing a phosphoric acid ester dispersant (or a phosphoric acid ester dispersant and an acrylic resin dispersant), wherein the content of the fine silver particles is in the range of from 5 wt% to 30 wt%, and the content of the silver particles is in the range of from 60 wt% to 90 wt%, the total content of the fine silver particles and the silver particles being not less than 90 wt%, and wherein the bonding material further includes a sintering aid of a monocarboxylic acid having an ether bond.

公开(公告)号：EP2719486A4

公开(公告)日：2016-01-20

申请号：EP11867177

申请日：2011-06-10

Applicant: DOWA ELECTRONICS MATERIALS CO

Inventor： KURITA SATORU ,  HINOTSU TAKASHI ,  SASAKI SHINYA

IPC: B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H05K3/32

CPC classification number: C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

Abstract: A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.