公开(公告)号：EP2542036A1

公开(公告)日：2013-01-02

申请号：EP12170952.1

申请日：2012-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A. ,  Vadas, Robert L. ,  Gilbertson, Kurt E. ,  Pepples, Michael J.

IPC: H05K1/11 ,  H05K13/04 ,  H05K3/36 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/114 ,  H05K1/144 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/09227 ,  H05K2201/10378 ,  H05K2203/082

Abstract: An interposer (30) for connecting two or more circuit boards (22, 26) is a circuit carrying substrate (32) with two or more solder pads (40, 44) on each of two sides (34, 36). Each of the solder pads (40, 44) are connected (42) to an electrically conductive via (38) in the substrate (32), providing electrical interconnection from one side (34) to the other side (36). One or more solder pads (40, 44) have a solder ball (46) on it. The interposer (30) has a contact area (48) suitable for the interposer (30) to be picked up and placed by an automated part placement machine (50). An electrical assembly (20) is made by soldering the solder balls (46) on one side (34) of the interposer (30) to corresponding solder pads (24) on a circuit board (22). The solder balls (46) on the other side (36) of the interposer (30) are likewise soldered to the corresponding solder pads (28) of a second circuit board (26).

Abstract translation: 用于连接两个或多个电路板（22,26）的插入器（30）是在两侧（34,36）中的每一个上具有两个或更多个焊盘（40,44）的电路承载衬底（32）。 每个焊盘（40,44）被连接（42）到衬底（32）中的导电通孔（38），提供从一侧（34）到另一侧（36）的电互连。 一个或多个焊盘（40,44）上具有焊球（46）。 插入器（30）具有适合于插入器（30）的接触区域（48），以通过自动化部件放置机器（50）拾取和放置。 电气组件（20）通过将插入件（30）的一侧（34）上的焊球（46）焊接到电路板（22）上的对应焊盘（24）而制成。 插入器（30）的另一侧（36）上的焊球（46）同样焊接到第二电路板（26）的对应的焊盘（28）上。

公开(公告)号：EP2099275A1

公开(公告)日：2009-09-09

申请号：EP09153629.2

申请日：2009-02-25

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A.

IPC: H05K7/20 ,  H05K5/00 ,  B60R16/023

CPC classification number: H05K7/20872 ,  H01L2924/0002 ,  H05K7/20927 ,  Y10T137/8593 ,  Y10T137/87265 ,  H01L2924/00

Abstract: An electronic module (10) is provided having enhanced thermal cooling of electronics. The module (10) includes a housing (12), electronic circuitry (14) contained within the housing (12), and a fluid cooling chamber (16) extending through the housing (12). The chamber (16) has generally conical shaped portions (18) at opposite ends. At least one thermal cooling insert (20) extends into the chamber (16). The insert (20) comprises a plurality of projections (24) for forming fluid flow passages (26) between adjacent projections (24), wherein the projections (24) engage the generally conical shape portion (18) of the chamber (16).

Abstract translation: 提供一种电子模块（10），其具有电子装置的增强的热冷却。 模块（10）包括壳体（12），容纳在壳体（12）内的电子电路（14）和延伸穿过壳体（12）的流体冷却室（16）。 腔室（16）在相对端处具有大致锥形的部分（18）。 至少一个热冷却插入件（20）延伸到腔室（16）中。 插入件（20）包括用于在相邻突起（24）之间形成流体流动通道（26）的多个突起（24），其中突起（24）与腔室（16）的大致圆锥形部分（18）接合。

公开(公告)号：EP1271089A3

公开(公告)日：2004-03-31

申请号：EP02077141.6

申请日：2002-05-30

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A.

IPC: F28F13/12

CPC classification number: F28F1/405 ,  F28F1/40 ,  F28F2255/16

Abstract: A method for increasing the convective heat transfer capabilities of a liquid cooler (11) coupled to various system and vehicle components. A structure (12) is placed within a hollow tubing (14) of the liquid cooler to distort the laminar flow of fluid within a center portion of the hollow tubing (14), which decreases the temperature rise of the fluid along an outer wall of the hollow tubing (14) associated with laminar flow. In preferred embodiments, the structure (12) consists of an elongated baffle wire or an extruded elongated ridge member. The structure (12) allows the outer surface of the tubing (14) to have increased cooling at a particular liquid flow rate, which allows more heat transfer capability to a coupled system or vehicle component as compared with liquid coolers without the structure.

公开(公告)号：EP2099275B1

公开(公告)日：2011-05-04

申请号：EP09153629.2

申请日：2009-02-25

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A.

IPC: H05K7/20 ,  H05K5/00 ,  B60R16/023

CPC classification number: H05K7/20872 ,  H01L2924/0002 ,  H05K7/20927 ,  Y10T137/8593 ,  Y10T137/87265 ,  H01L2924/00

公开(公告)号：EP1271089B1

公开(公告)日：2007-04-11

申请号：EP02077141.6

申请日：2002-05-30

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A.

IPC: F28F13/12

CPC classification number: F28F1/405 ,  F28F1/40 ,  F28F2255/16

公开(公告)号：EP1804564A1

公开(公告)日：2007-07-04

申请号：EP06077255.5

申请日：2006-12-14

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A.

IPC: H05K7/20

CPC classification number: H05K7/20872 ,  F01P2050/30 ,  F02B3/06 ,  F02M31/145

Abstract: A cooling apparatus 10 including an elongated body portion 12 having a fluid inlet 16, a fluid outlet 18 and a fluid channel 14 extending between the fluid inlet 16 and the fluid outlet 18, wherein the fluid channel 14 includes a generally "G," "C" or "( )" shaped cross-section.

Abstract translation: 冷却装置10包括具有流体入口16的细长主体部分12，流体出口18和在流体入口16和流体出口18之间延伸的流体通道14，其中流体通道14包括通常为“G”，“ C“或”（）“形横截面。

公开(公告)号：EP1408584A1

公开(公告)日：2004-04-14

申请号：EP03078052.2

申请日：2003-09-26

Applicant: Delphi Technologies, Inc.

Inventor： Stillabower, Morris D. ,  Visser, Roy A.

IPC: H01R12/04

CPC classification number: H05K3/368 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/10386 ,  H05K2201/10825 ,  H05K2201/10871

Abstract: A flat twisted electrical terminal (30) is provided for connecting a first circuit element (14) to a second circuit element (22) on respective first and second circuit boards (12 and 20). The terminal (30) includes a flat conductive member having a first end (32) for connecting to a first circuit element (14) and a second end (34) for connecting to a second circuit element (22). The conductive member is axially twisted about its longitudinal axis.

Abstract translation: 端子（30）包括一个平坦的导电构件，其一端连接到第一电路元件，而另一端连接到第二电路元件（22）。 导电构件在端部之间具有扭转部分，该扭转部分轴向地扭转45度至135度的角度（θ）。 包括用于电路的独立权利要求，以及用于在两个电路元件之间提供电连接的方法。

公开(公告)号：EP1271089A2

公开(公告)日：2003-01-02

申请号：EP02077141.6

申请日：2002-05-30

Applicant: Delphi Technologies, Inc.

Inventor： Visser, Roy A.

IPC: F28F13/12

CPC classification number: F28F1/405 ,  F28F1/40 ,  F28F2255/16

Abstract: A method for increasing the convective heat transfer capabilities of a liquid cooler (11) coupled to various system and vehicle components. A structure (12) is placed within a hollow tubing (14) of the liquid cooler to distort the laminar flow of fluid within a center portion of the hollow tubing (14), which decreases the temperature rise of the fluid along an outer wall of the hollow tubing (14) associated with laminar flow. In preferred embodiments, the structure (12) consists of an elongated baffle wire or an extruded elongated ridge member. The structure (12) allows the outer surface of the tubing (14) to have increased cooling at a particular liquid flow rate, which allows more heat transfer capability to a coupled system or vehicle component as compared with liquid coolers without the structure.

Abstract translation: 一种用于增加耦合到各种系统和车辆部件的液体冷却器（11）的对流传热能力的方法。 结构（12）被放置在液体冷却器的空心管（14）内，以扭曲中空管（14）的中心部分内的流体的层流，这降低了流体沿着外壁的温度上升 中空管（14）与层流相关联。 在优选实施例中，结构（12）由细长的挡板线或挤出的细长脊构件组成。 结构（12）允许管（14）的外表面在特定液体流速下具有增加的冷却，与没有结构的液体冷却器相比，其允许对耦合的系统或车辆部件的更多的传热能力。