公开(公告)号：EP3383148A3

公开(公告)日：2018-10-10

申请号：EP18161588.1

申请日：2018-03-13

Applicant: Delphi Technologies LLC

Inventor： ZIMMERMAN, David W ,  PEPPLES, Michael J. ,  IHMS, David W.

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/34 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66

CPC classification number: H01L24/17 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6605 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2224/30179 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/1423 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/093 ,  H05K2201/10166 ,  Y02P70/613

Abstract: A circuit-board-assembly (10) includes a printed-circuit-board (12), an integrated-circuit-die (14), a ball-grid-array (16), a barrier-material (18), and an adhesive-material (20). The printed-circuit-board (12) includes a mounting-surface (22) that defines a plurality of contact-pads and a continuous-trace that interconnects a selected-group (28) of the contact-pads. The integrated-circuit-die (14) includes an electrical-circuit having a plurality of solder-pads. The ball-grid-array (16) includes a plurality of solder-balls interposed between the contact-pads and the solder-pads. The plurality of solder-balls establish electrical communication between the electrical-circuit and the contact-pads. The barrier-material (18) is located between a string (38) of solder-balls that are attached to the selected-group (28) of the contact-pads to create a barrier (40). The barrier (40) segregates an underfill-region (42) from a non-underfill-region (44) between the printed-circuit-board (12) and the integrated-circuit-die (14). The barrier (40) is in direct-contact with the string (38) of the solder-balls, the integrated-circuit-die (14), and the continuous-trace. The adhesive-material (20) is in direct contact with a portion of the underfill-region (42) and the barrier (40) prevents the adhesive-material (20) from encroaching upon the non-underfill-region (44).

公开(公告)号：EP3383148A2

公开(公告)日：2018-10-03

申请号：EP18161588.1

申请日：2018-03-13

Applicant: Delphi Technologies LLC

Inventor： ZIMMERMAN, David W ,  PEPPLES, Michael J. ,  IHMS, David W.

IPC: H05K1/18

CPC classification number: H01L24/17 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6605 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2224/30179 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/1423 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/093 ,  H05K2201/10166 ,  Y02P70/613

Abstract: A circuit-board-assembly (10) includes a printed-circuit-board (12), an integrated-circuit-die (14), a ball-grid-array (16), a barrier-material (18), and an adhesive-material (20). The printed-circuit-board (12) includes a mounting-surface (22) that defines a plurality of contact-pads and a continuous-trace that interconnects a selected-group (28) of the contact-pads. The integrated-circuit-die (14) includes an electrical-circuit having a plurality of solder-pads. The ball-grid-array (16) includes a plurality of solder-balls interposed between the contact-pads and the solder-pads. The plurality of solder-balls establish electrical communication between the electrical-circuit and the contact-pads. The barrier-material (18) is located between a string (38) of solder-balls that are attached to the selected-group (28) of the contact-pads to create a barrier (40). The barrier (40) segregates an underfill-region (42) from a non-underfill-region (44) between the printed-circuit-board (12) and the integrated-circuit-die (14). The barrier (40) is in direct-contact with the string (38) of the solder-balls, the integrated-circuit-die (14), and the continuous-trace. The adhesive-material (20) is in direct contact with a portion of the underfill-region (42) and the barrier (40) prevents the adhesive-material (20) from encroaching upon the non-underfill-region (44).