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公开(公告)号：EP3636722A1
公开(公告)日：2020-04-15
申请号：EP18813362.3
申请日：2018-05-25
发明人： SAWAMURA, Syota , HASUMI, Mizuki
IPC分类号： C09J7/24 , C09J107/00 , C09J109/00
摘要： An adhesive tape has superior mechanical properties, and can suppress occurrence of cracks after being exposed to high temperature conditions for a long period of time. The adhesive tape includes a substrate and an adhesive layer formed on one side of the substrate; wherein the substrate is made of a resin composition including 40 to 65 parts by mass of high boiling point plasticizer and 5 to 15 parts by mass of antimony trioxide with respect to 100 parts by mass of polyvinyl chloride resin.
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公开(公告)号：EP3170874B1
公开(公告)日：2019-04-10
申请号：EP15821547.5
申请日：2015-07-13
发明人： HASUMI, Mizuki , KOMODA, Fukumu
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3.发明公开
公开(公告)号：EP4333025A1
公开(公告)日：2024-03-06
申请号：EP22811161.3
申请日：2022-05-11
IPC分类号： H01L21/304 , B32B27/00 , C09J7/29 , C09J7/38 , C09J133/00 , H01L21/683
摘要： The present invention aims to provide an adhesive sheet for back grinding capable of suppressing peeling of an adhesive layer and capable of peeling a wafer easily from an adhesive sheet.
According to the present invention, provided is an adhesive sheet for back grinding of a semiconductor wafer having a convex part, comprising: a base material layer; and an adhesive layer provided on the base material layer, wherein: the adhesive layer comprises an opening part having a diameter smaller than a diameter of the semiconductor wafer; the adhesive layer is adhered to an outer peripheral part of the semiconductor wafer so shat the convex part of the semiconductor wafer is placed in the opening part; the adhesive layer is configured so that the convex part is protected by the base material layer with the semiconductor wafer adhered to the adhesive layer; the base material layer comprises a cushion layer and a surface treatment layer provided thereon; the adhesive layer is provided on the surface treatment layer; the surface treatment layer is formed of an acrylic resin composition containing an acrylic resin; the acrylic resin is cross-linked by light irradiation or heating; and the adhesive layer is formed of an acrylic resin composition containing an acrylic resin.-
公开(公告)号：EP4269103A1
公开(公告)日：2023-11-01
申请号：EP21910034.4
申请日：2021-11-12
发明人： KIMOTO, Yuki , HAYASHI, Yasunori , HASUMI, Mizuki
IPC分类号： B32B27/30 , C08F290/00 , C09J4/02 , C09J11/06 , C09J175/14 , C08F2/38 , C08F2/44 , C08F2/50 , H01L21/304 , C09J7/22 , C09J7/38
摘要： An ultraviolet curable resin composition having: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; a polymerization inhibitor; and an acid having an acid dissociation constant (pKa1) in pure water of 4.0 or less.
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公开(公告)号：EP4269102A1
公开(公告)日：2023-11-01
申请号：EP21910033.6
申请日：2021-11-12
发明人： KIMOTO, Yuki , HAYASHI, Yasunori , HASUMI, Mizuki
IPC分类号： B32B27/30 , C08F290/00 , C09J4/02 , C09J11/06 , C09J175/14 , C08F2/44 , C08F2/50 , H01L21/304 , C09J7/22 , C09J7/38
摘要： An ultraviolet curable resin composition containing: a monomer and/or an oligomer having a polymerizable unsaturated double bond; a photopolymerization initiator; and an acid having an acid dissociation constant (pKa1) in pure water of 4.0 or less.
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公开(公告)号：EP4242279A1
公开(公告)日：2023-09-13
申请号：EP21889024.2
申请日：2021-10-20
发明人： NAKAMURA, Chie , TANAKA, Tomoaki , TOKUI, Sota , HASUMI, Mizuki
IPC分类号： C09J133/04 , C09J175/04 , C09J201/02 , H01L21/301 , C09J7/38
摘要： Provided is an adhesive tape having a base material layer and an adhesive layer disposed on the base material layer, wherein the adhesive layer contains a radical photoinitiator and polymer A having polymerizable carbon double bonds, and difference |R 0 - R 1 | between contact angle R 0 of silicon wafer surface with respect to water and contact angle R 1 of the silicon wafer surface with respect to water after the adhesive layer is attached to the silicon wafer, left to stand for 24 hours, then irradiated with ultraviolet ray, and peeled, is 20° or less.
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公开(公告)号：EP3693431A1
公开(公告)日：2020-08-12
申请号：EP18863821.7
申请日：2018-08-23
发明人： HONDA, Yuto , YOKOZUKA, Manabu , HASUMI, Mizuki
IPC分类号： C09J7/38 , B32B27/00 , C09J11/06 , C09J107/00 , C09J201/00 , H01B7/00
摘要： [Problem] To provide: an adhesive sheet capable of bonding adhesive layers together at normal temperatures, with little stickiness of the adhesive layers due to a plasticizer seeping out from a substrate; a protective material using the adhesive sheet; and a wire harness.
[Solution] An adhesive sheet comprising: a substrate containing 20-100 parts by mass of a polyester-based plasticizer (B) with respect to 100 parts by mass of a vinyl halide-based resin (A); a primer layer; and adhesive layers in which an included amount of a tackifier (D) is 0-250 parts by mass and an included amount of inorganic microparticles (E) is 0-250 parts by mass with respect to 100 parts by mass of an elastomer (C), and a total value of the included amounts of the tackifier (D) and the inorganic microparticles (E) is 0-350 parts by mass; wherein the adhesive layers have a probe tack of 7 N/cm 2 or less in accordance with ASTM D 2979, and the adhesive force between the adhesive layers having a width of 15 mm is 1.5 N or more.-
8.发明公开
公开(公告)号：EP3680302A1
公开(公告)日：2020-07-15
申请号：EP18853390.5
申请日：2018-08-01
摘要： The substrate for adhesive tape is thin in thickness and can also suppress repelling of a water-borne primer when the primer is being coated. The substrate for adhesive tape includes 25 to 75 parts by mass of a plasticizer and 5 to 40 parts by mass of an inorganic filler with respect to 100 parts by mass of polyvinyl chloride resin having a mean degree of polymerization of 1200 to 1800; wherein the inorganic filler has a mean particle size of 0.05 to 0.8µm; and the substrate has a thickness of 40 to 80µm.
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9.发明公开
公开(公告)号：EP4407659A1
公开(公告)日：2024-07-31
申请号：EP22883392.7
申请日：2022-10-07
IPC分类号： H01L21/304 , B32B27/00 , C09J7/20 , C09J7/29 , C09J7/38 , C09J201/00 , H01L21/301 , H01L21/683
CPC分类号： B32B27/00 , C09J7/29 , C09J7/38 , C09J7/20 , C09J201/00 , H01L21/30 , H01L21/304 , H01L21/683
摘要： The present invention provides a base material for semiconductor wafer processing, the base material being capable of enhancing adhesion to a stage in a semiconductor wafer processing step. The present invention provides a base material which is used for an adhesive sheet for processing a semiconductor wafer having a projected part, wherein the thermal shrinkages of the base material in the machine direction (MD) and in the transverse direction (TD) after heating at 130°C for 10 minutes are both 0% or more.
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10.发明公开
公开(公告)号：EP4333026A1
公开(公告)日：2024-03-06
申请号：EP22811162.1
申请日：2022-05-11
IPC分类号： H01L21/304 , B32B27/00 , C09J7/29 , C09J7/40 , C09J201/00 , H01L21/683
摘要： The present invention aims to provide an adhesive sheet for back grinding capable of enhance followability of a base material layer to a convex part of a semiconductor wafer.
According to the present invention, provided is an adhesive sheet for back grinding of a semiconductor wafer having a convex part, comprising: a base material layer; and an adhesive layer provided on the base material layer, wherein: the adhesive layer comprises an opening part having a diameter smaller than a diameter of the semiconductor wafer; the adhesive layer is adhered to an outer peripheral part of the semiconductor wafer such shat the convex part of the semiconductor wafer is placed in the opening part; the adhesive layer is configured so that the convex part is protected by the base material layer with the semiconductor wafer adhered to the adhesive layer; the base material layer comprises a cushion layer and a barrier layer; and an oxygen permeability of the base material layer at 25°C and at RH0% measured base on JIS K 7126-2 (isobaric method) is 1000 ml/(m 2 ·24h·atm) or lower.
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