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公开(公告)号：EP2160082B1
公开(公告)日：2018-07-04
申请号：EP08752683.6
申请日：2008-05-14
CPC分类号： H05K1/0274 , H01L33/60 , H05K1/056 , H05K3/28 , H05K2201/0209 , H05K2201/0227 , H05K2201/0266 , H05K2201/0338 , H05K2201/09909 , H05K2201/10106 , H05K2201/2054
摘要： Provided is a metal base circuit board having a new function of a light reflection in addition to the conventional printed circuit board function for mounting electronic parts. The metal base circuit board has a circuit arranged on a metal plate via an insulation layer. A white film is arranged at least one the insulation layer.
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公开(公告)号：EP2492924B1
公开(公告)日：2018-12-05
申请号：EP10824736.2
申请日：2010-09-13
发明人： MIYATA, Kenji , YAMAGATA, Toshitaka
IPC分类号： H01B17/56 , B32B15/092 , B32B27/38 , C08J5/18 , C08L63/00 , H01B3/00 , H01B3/40 , H01B19/00 , H05K1/03 , C08G59/42 , C08G59/62
CPC分类号： H05K1/0373 , C08G59/4223 , C08G59/621 , C08L63/00 , H05K1/0326 , H05K2201/0209 , Y10T156/1043 , Y10T156/1052
摘要： An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.
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