公开(公告)号：EP2642532A1

公开(公告)日：2013-09-25

申请号：EP12848326.0

申请日：2012-08-30

申请人： Dongguan Kingsun Optoelectronic Co., Ltd

发明人： BI, Xiaofeng

IPC分类号： H01L33/00 ,  H01L33/64

CPC分类号： B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

摘要： A manufacturing process of a high-power LED radiating structure includes steps of: (1) preparing parts or material such as a PCB board (4), a heat conducting plate (6) and a heat dissipating plate (9); (2) providing a first locating hole and a first fixing hole passing through the PCB board, welding a copper plate layer on one side of the PCB board, and welding an electrode weld pad on the other side of the PCB board, and then applying soldering paste on the surface of the copper plate layer; (3) providing a second locating hole and a second fixing hole passing through the heat conducting plate; (4) inserting a fixing pole into the first and second fixing holes to fixedly connect the PCB board and the heat conducting plate together; (5) inserting the heat conducting pole into the first and second locating holes; (6) proving the heat conducting plate and the PCB board resulted from step (5) on a stamping equipment, and adjusting the length of the protruding end of the heat conducting pole. The inventive process is simple, and the manufactured dissipating structure is advantageous for a simple construction and good heat conducting and dissipating effects.

摘要翻译： 大功率LED辐射结构的制造工艺包括以下步骤：（1）制备诸如PCB板（4），导热板（6）和散热板（9）的部件或材料; （2）提供穿过PCB板的第一定位孔和第一固定孔，在PCB板的一侧焊接铜板层，并在PCB板的另一侧焊接电极焊盘，然后施加 铜板表面焊膏; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）将固定杆插入第一和第二固定孔中以将PCB板和导热板固定在一起; （5）将导热柱插入第一和第二定位孔; （6）在冲压设备上证明由步骤（5）导出的导热板和PCB板，并调整导热柱的突出端的长度。 本发明方法简单，制造的散热结构对于简单的结构和良好的导热和散热效果是有利的。

公开(公告)号：EP2626919A1

公开(公告)日：2013-08-14

申请号：EP12844655.6

申请日：2012-08-30

申请人： Dongguan Kingsun Optoelectronic Co., Ltd

发明人： BI, Xiaofeng

IPC分类号： H01L33/64 ,  H01L33/00 ,  H01L23/367

CPC分类号： H01L33/64 ,  H01L21/4878 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  Y10T29/49124 ,  H01L2924/00

摘要： A manufacturing process of a high-power LED radiating structure includes steps of: (1) preparing a PCB board, a heat conducting plate which is provided with a heat conducting pole on its one side and a heat dissipating plate; (2) providing in the PCB board a locating hole passing through both sides of the PCB board, welding a copper plate layer on one side of the PCB board, and welding an electrode weld pad on the other side of the PCB board, and then applying soldering paste on the surface of the copper plate layer; (3) inserting the heat conducting pole into the locating hole from one side of the PCB board which is provided with the copper plate layer, and welding the copper plate layer and the heat conducting plate through reflow soldering; (4) placing the assembled heat conducting plate and the PCB board acquired in step (3) on a stamping equipment, to adjust the height of the heat conducting pole; and (5) fixedly engaging the upper side of the heat dissipating plate with the other side of the heat conducting plate. The inventive process is simple, and the manufactured dissipating structure is advantageous for a simple construction and good heat conducting and dissipating effects.

摘要翻译： 一种大功率LED散热结构的制作工艺，包括以下步骤：（1）准备PCB板，一侧设有导热柱的导热板和散热板; （2）在PCB板上设置穿过PCB板两侧的定位孔，在PCB板的一侧焊接铜板层，在PCB板的另一侧焊接电极焊盘，然后 在铜板层的表面上施加焊膏; （3）将导热柱从设置有铜板层的PCB​​板的一侧插入定位孔中，并通过回流焊接将铜板层和导热板焊接在一起; （4）将步骤（3）中得到的组装好的导热板和PCB板放置在冲压设备上，调节导热杆的高度; 和（5）将散热板的上侧与导热板的另一侧固定接合。 本发明工艺简单，制造出的散热结构有利于结构简单，导热散热效果好。