公开(公告)号：EP3186854A1

公开(公告)日：2017-07-05

申请号：EP15777983.6

申请日：2015-08-27

Applicant: Cambium Networks Limited

Inventor： WILKINS, Adam ,  MORRELL, Carl ,  CLARK, Paul ,  SPENCE, Peter ,  KING, Nigel Jonathan Richard

IPC: H01P5/02 ,  H05K1/02

CPC classification number: H01P5/085 ,  H01P3/08 ,  H01P5/028 ,  H01P11/003 ,  H05K1/0251 ,  H05K1/144 ,  H05K2201/09054 ,  H05K2201/10303

Abstract: A radio frequency transmission arrangement comprises a ground plate (8) having first and second opposite sides and a boss protruding from said second side of the ground plate (8), a first transmission line comprising a first elongate conductor (1) passing from the first side of the ground plate through an aperture (3) in the ground plate and the boss, and a second transmission line comprising a second elongate conductor (2) and a ground plane (6), the first elongate conductor (1) passing through the ground plane (6) to connect to the second elongate conductor. The boss has an end surface (4) disposed in a substantially parallel relationship with the ground plane (6) of the second transmission line, and there is a gap between the end surface of the boss and the ground plane.

Abstract translation: 射频传输装置包括具有第一和第二相对侧以及从接地板（8）的所述第二侧突出的凸台的接地板（8），第一传输线包括第一细长导体（1），该第一细长导体从第一细长导体 （2）和接地平面（6）的第二传输线，所述第一细长导体（1）穿过所述接地板中的孔（3）和所述凸台，所述第一细长导体 接地平面（6）以连接到第二细长导体。 凸台具有与第二传输线的接地面（6）基本平行设置的端面（4），并且在凸台的端面和接地面之间存在间隙。

公开(公告)号：EP3138370A1

公开(公告)日：2017-03-08

申请号：EP15718140.5

申请日：2015-04-04

Applicant: Ellenberger & Poensgen GmbH

Inventor： ULLERMANN, Wolfgang ,  MECKLER, Peter ,  ENGEWALD, Manuel ,  SCHWARZ, Matthias ,  SCHNEIDER, Ewald ,  MIKLIS, Markus

IPC: H05K1/02 ,  H05K3/34 ,  B60R16/02 ,  F02N11/08 ,  H01L25/07

CPC classification number: H05K1/0263 ,  F02N11/087 ,  F02N2011/0874 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014 ,  H01L2924/13091 ,  H02M7/00 ,  H05K3/3421 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10553 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

Abstract: The invention relates to a high current switch (2), in particular for a motor vehicle, comprising a first bus bar (4), a second bus bar (6) in addition to a first semi-conductor switch (16) which comprises a control connection (26) and a first transmission connection (20) as well as a second transmission connection (22). Said first transmission connection (20) is placed in direct contact with the first bus bar (4) and the second transmission connection (22) is placed in direct electric contact with the second bus bar (6).

Abstract translation: 除了具有控制连接和第一传输连接以及第二传输连接的第一半导体开关之外，具有第一母线，第二母线的大电流开关，特别是用于机动车辆的高电流开关。 第一传输连接被放置成与第一母线直接接触，并且第二传输连接被放置成与第二母线直接电接触。

公开(公告)号：EP2340393B1

公开(公告)日：2016-06-22

申请号：EP09789345.7

申请日：2009-09-21

Applicant: Tyco Electronics Corporation

Inventor： GINGRICH, Charles, Raymond, III

IPC: F21V19/00 ,  H01R13/24 ,  H01R13/717 ,  F21K9/00 ,  F21Y115/10

CPC classification number: F21V19/0035 ,  F21K9/00 ,  F21V7/0083 ,  F21V17/005 ,  F21V17/12 ,  F21V17/164 ,  F21V19/045 ,  F21V29/503 ,  F21V29/763 ,  F21V29/773 ,  F21V29/83 ,  F21Y2115/10 ,  H01R13/2442 ,  H01R33/7685 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/183 ,  H05K2201/09054 ,  H05K2201/09118 ,  H05K2201/10106

Abstract: A light-emitting device assembly which can be used in many applications has a contact carrier, at least one light-emitting device, a heat sink and at least one securing member. The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device. The at least one securing member extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device in position relative to each other and relative to the heat sink.

公开(公告)号：EP2626919A4

公开(公告)日：2016-03-16

申请号：EP12844655

申请日：2012-08-30

Applicant: DONGGUAN KINGSUN OPTOELECT CO

Inventor： BI XIAOFENG

IPC: H01L33/64 ,  H01L23/367 ,  H01L33/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01L33/64 ,  H01L21/4878 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  Y10T29/49124 ,  H01L2924/00

公开(公告)号：EP2724080A2

公开(公告)日：2014-04-30

申请号：EP12727765.5

申请日：2012-06-11

Applicant: Cree, Inc.

Inventor： PICKARD, Paul ,  PROGL, Curt

IPC: F21V29/00 ,  H05K1/02 ,  F21V7/00 ,  F21Y101/02 ,  F21V7/20

CPC classification number: F21V29/004 ,  F21K9/233 ,  F21V7/0008 ,  F21V29/51 ,  F21V29/74 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.

Abstract translation: 公开了一种用于固态定向灯的组件。 组件包括多层FR4印刷电路板和与多层FR4印刷电路板组装的金属散热器。 组件被配置成安装多个固态发光器。 多层FR4印刷电路板限定孔，并且金属散热器的至少一部分位于多层FR4印刷电路板的孔中。 位于多层FR4印刷电路板的孔中的散热器的部分与散热装置连通。

公开(公告)号：EP2339900A3

公开(公告)日：2013-01-23

申请号：EP10193543.5

申请日：2010-12-02

Applicant: Automotive Lighting Reutlingen GmbH

Inventor： Gottheil, Martin ,  Hiegler, Michael

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0216 ,  F21S41/141 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/05 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Die Erfindung betrifft ein Lichtmodul (5; 6) für eine Beleuchtungseinrichtung (1) eines Kraftfahrzeugs. Das Lichtmodul (5; 6) umfasst mindestens eine Halbleiterlichtquelle (16). Um bei dem Lichtmodul (5; 6) die Abschirmung von durch den Betrieb und die Ansteuerung der Halbleiterlichtquellen (16) entstehenden Störsignalen auf einfache und kostengünstige Weise zu verbessern, wird vorgeschlagen, dass das Lichtmodul (5; 6) aufweist:
- eine metallische Grundfläche (11),
- mindestens eine auf der metallischen Grundfläche (11) ausgebildete elektrische Isolationsschicht (12),
- mindestens eine in der mindestens einen elektrischen Isolationsschicht (12) ausgebildete Aussparung (13), und
- die in der mindestens einen Aussparung (13) angeordnete mindestens eine Halbleiterlichtquelle (16).

公开(公告)号：EP1890341B1

公开(公告)日：2012-07-11

申请号：EP06747126.8

申请日：2006-06-02

Applicant: FUJIKURA LTD.

Inventor： SUZUKI, Ryuji ,  TAKEMOTO, Kyosuke

IPC: H05K1/02

CPC classification number: H05K1/0204 ,  F21K9/00 ,  F21V29/505 ,  F21V29/763 ,  F21V29/83 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K1/021 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/09554 ,  H05K2201/10106 ,  H05K2203/135 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a porcelain enameled substrate for light-emitting device mounting which comprises a core metal, a porcelain enamel layer covering the surface of the core metal, and one or more through holes. The core metal is exposed at the inner surfaces of the through holes.

公开(公告)号：EP2454519A1

公开(公告)日：2012-05-23

申请号：EP10740028.5

申请日：2010-07-14

Applicant: Prism Projection, Inc.

Inventor： YOUNG, Garrett ,J. ,  STANGELAND, Andrew

IPC: F21K99/00 ,  H05B33/08 ,  H05K1/02 ,  H01L33/64 ,  G03B21/14

CPC classification number: F21V29/51 ,  F21K9/00 ,  F21K9/62 ,  F21V19/0025 ,  F21V29/402 ,  F21V29/56 ,  F21V29/58 ,  F21V29/60 ,  F21V29/677 ,  F21V29/83 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0845 ,  H05B33/0857 ,  H05B37/0227 ,  H05K1/0204 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: Various system embodiments comprise a substrate of high thermal conductivity, a solid state light emitting device, an electric circuit, and an electric dielectric. The device has a die and a connection point to the die with a low thermal resistance. The connection point is in contact with the substrate. The electric circuit is electrically connected to the light emitting device, and separated from the substrate by the electrical dielectric. Various system embodiments comprise at least four color sources; and a contoller configured to calculate a solution to form a target color using the color sources when the target is outside of a gamut formed by the color sources. The controller is configured to find an equivalent target color with reduced saturation.

Abstract translation: 各种系统实施例包括高导热性的衬底，固态发光器件，电路和电介质。 该器件有一个芯片和一个低热阻的芯片连接点。 连接点与基板接触。 电路电连接到发光器件，并且通过电介质与基板分离。 各种系统实施例包括至少四个颜色源; 以及控制器，被配置为当目标处于由色源形成的色域之外时使用色源来计算形成目标色彩的解决方案。 控制器配置为找到饱和度降低的等效目标颜色。

公开(公告)号：EP2145515A2

公开(公告)日：2010-01-20

申请号：EP08741605.3

申请日：2008-04-04

Applicant: Tan, Kia Kuang

Inventor： Tan, Kia Kuang

IPC: H05K1/05

CPC classification number: H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/19041 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0315 ,  H01L2924/00014

Abstract: In accordance with the present invention, a thermally-efficient metal core printed circuit board comprises a metal base (66) including opposing first face and a second face, and the said faces with a plurality of dispersed dielectric (55) or insulating layer selectively fabricated overlying the metal base (66) resulting in a planar surface for the overlying circuitries, a plurality of dispersed thermal metallization layer connected directly to the metal base (66) for optimum thermal performance and a plurality of electrical circuitries connected accordingly to the profile of the metal body for the multi-layer electrical circuit connectivity. The selective dielectric (55) or insulation layer configuration allows direct thermal pad contact to the bulk metal base (66) and insulation for the electrical terminals resulting in high thermal-efficient circuit board for single, matrix, multi-chip device assembly and mother-board applications. The selective dielectric and metallization topology is also applicable to 3D heat sink structure.

公开(公告)号：EP1406303A4

公开(公告)日：2007-12-12

申请号：EP02741385

申请日：2002-07-01

Applicant: DAIKIN IND LTD

Inventor： IIDA MASAKAZU ,  EHIRA SHINJI

IPC: H01L23/367 ,  H01L23/433 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  F28F2275/14 ,  H01L23/367 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/284 ,  H05K3/3421 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09054 ,  H05K2201/09745 ,  H05K2201/1034 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A power module capable of providing an efficient heat radiating structure, comprising a mounting substrate having a mounting surface for mounting, a power circuit for power control and a heat radiating surface with an irregular part for heat radiation formed therein and formed of a member with a high heat conductivity, whereby the size and cost of a device can be reduced.