专利检索 ap:("E.I. DU PONT DE NEMOURS AND COMPANY") AND inv:"RAJENDRAN, Govindasamy, Paramasivan" 第 1 页

1.

发明公开
LOW LOSS DIELECTRIC MATERIAL FOR PRINTED CIRCUIT BOARDS AND INTEGRATED CIRCUIT CHIP PACKAGING 审中-公开
标题翻译：低损耗电介质材料，电路板和集成电路芯片封装

公开(公告)号：EP1500315A1

公开(公告)日：2005-01-26

申请号：EP03721874.0

申请日：2003-04-25

申请人： E.I. DU PONT DE NEMOURS AND COMPANY

发明人： LIN, Pui-Yan , RAJENDRAN, Govindasamy, Paramasivan , ZAHR, George, Elias

IPC分类号： H05K1/03 , C08J5/24

CPC分类号： H05K1/0366 , C08J5/043 , C08J5/046 , C08J2309/06 , H05K2201/0133 , H05K2201/0278 , H05K2201/029 , H05K2201/0293 , Y10S428/901 , Y10T428/249933 , Y10T428/24994 , Y10T442/2902 , Y10T442/2992 , Y10T442/30 , Y10T442/60

摘要： Disclosed are fiber reinforced composite substrates comprising a polymeric matrix and one or more woven or non-woven para-aramid or fiberglass fabrics, sheets, or papers, said polymeric matrix consisting essentially of one or more cross-linked copolymers of monovinyl aromatic hydrocarbons and conjugated dienes useful for printed circuit boards and cards suitable for use in high frequency circuits.