Abstract:
The invention describes a method for inspecting samples in an electron microscope. A sample carrier 500 shows electrodes504, 507 connecting pads 505, 508 with areas A on which the sample is to be placed. After placing the sample on the sample carrier, a conductive pattern is deposited on the sample, so that voltages and currents can be applied to localized parts of the sample. Applying the pattern on the sample may be done with, for example, Beam Induced Deposition or ink-jet printing. The invention also teaches building electronic components, such as resistors, capacitors, inductors and active elements such as FET's in the sample.
Abstract:
A method of examining a sample using a charged-particle microscope, comprising the following steps: - Mounting the sample on a sample holder; - Using a particle-optical column to direct at least one beam of particulate radiation onto the sample, thereby producing an interaction that causes emitted radiation to emanate from the sample; - Using a first detector configuration C 1 to detect a first portion of the emitted radiation and produce a first image I 1 based thereupon,
which method comprises the following steps: - Using at least a second detector configuration C 2 to detect a second portion of the emitted radiation and produce a second image I 2 based thereupon, whereby C 2 is different to C 1 , thus compiling a set S D = {C 1 , C 2 } of detector configurations and a set S I = {I 1 , I 2 } of corresponding images; - Using computer processing apparatus to automatically compare different members of S I and mathematically identify on the sample at least one occlusion region with an occluded line of sight relative to at least one member of S D . In a particular embodiment: - Plural members of S I are mathematically fused into a composite reference image IF; - At least one test image I T is selected from S I ; - Said occlusion region is identified using a technique that comprises comparing I F to I T and identifying an area in I T in which at least one of the following is observed: ■ A reduced correlation between I T and IF; ■ A reduced intensity in I T relative to I F .
Abstract:
The invention describes a method for inspecting samples in an electron microscope. A sample carrier 500 shows electrodes504, 507 connecting pads 505, 508 with areas A on which the sample is to be placed. After placing the sample on the sample carrier, a conductive pattern is deposited on the sample, so that voltages and currents can be applied to localized parts of the sample. Applying the pattern on the sample may be done with, for example, Beam Induced Deposition or ink-jet printing. The invention also teaches building electronic components, such as resistors, capacitors, inductors and active elements such as FET's in the sample.
Abstract:
A method of examining a region of interest of a sample using a charged-particle microscope, comprising the following steps: - Mounting the sample on a movable sample holder; - Providing a particle-optical column that can be used to direct at least one beam of particulate radiation onto at least said region, thereby producing an interaction that causes emitted radiation to emanate from the sample; - In a measurement of a first type, using a first detector to detect a first type of said emitted radiation; - Using an output of said first detector as a basis to perform at least one of the following actions: - Assign a value of a measurand to a given coordinate position within said region, for one or more such coordinate positions; - Construct an image of said region, wherein the following steps are additionally performed: - In a measurement of a second type, using a second detector to detect a second type of said emitted radiation; - Providing computer processing apparatus; - Using said computer processing apparatus to automatically perform the following actions: - Based on an output of said second detector, construct a topographical map of at least a portion of the sample proximal to said region of interest; - Based on said topographical map, identify at least one locus of said sample where sample topography is expected to detrimentally affect accuracy of a measurement of the first type performed at that locus, for at least one geometric attitude of said locus with respect to at least one of said beam and said first detector.
Said computer processing apparatus can be employed to automatically perform at least one of the following actions: - Draw the attention of a user of said charged-particle microscope to the existence of said locus; - For said locus, indicate an extent to which said accuracy is expected to be detrimentally affected; - Calculate at least one modification of said measurement of the first type aimed at improving said accuracy; - Enact said modification.