公开(公告)号：EP1663513A4

公开(公告)日：2009-08-05

申请号：EP04809486

申请日：2004-07-09

申请人： FRY METALS INC

发明人： LEWIS B G ,  SINGH B ,  DETIG ROBERT H ,  MINOGUE GERARD ,  EBERLEIN DIETMAR C ,  REILLY K ,  MARCZI M

IPC分类号： H01L21/60 ,  B01J19/08 ,  B05D1/06 ,  B05D1/32 ,  B23K3/06 ,  C23C20060101 ,  H01L21/288 ,  H01L21/48 ,  H05K3/34

CPC分类号： H05K3/3484 ,  B23K3/0607 ,  H01L21/288 ,  H01L21/2885 ,  H01L21/4853 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03622 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/11005 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/11442 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/12042 ,  H05K3/3478 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0425 ,  H05K2203/0776 ,  H05K2203/09 ,  H05K2203/105 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.