摘要:
An optical system for detecting the shape of a three-dimensional object (50) comprising a collimate lens (23) for converting a laser beam to a parallel beam of light, a scanning optical system (25, 27) which moves the parallel beam incident on the object (50) normal to the latter to scan the object with the scanning beam, a mirror (29) which is located in the vicinity of the scanning beam at a predetermined inclination angle with respect to the object (50), to reflect the beam reflected by the object in a predetermined direction, an image forming lens (33) which converges the reflection beam reflected from the object by the mirror (29) onto a point through the scanning optical system to make an image of the reflection beam, and a first optical dectector (35) located on the point at which the reflection beam is converged to detect the converged beam spot by the image forming lens (33).
摘要:
An optical system for inspecting bonding wires (70) on a semiconductor has a camera (1), focal length and depth adjusting means (2), an illumination device (4) for irradiating brilliantly a desired portion of an inspection object (7) with an illumination light. The focal length and depth adjusting means (2) comprises a plurality of glass plates (21, 22, ... 24) each having a different focal length and depth, and each bonding wire (70) is inspected at a plurality of levels (F 1 , F 2 , F 3 ) in height position of the wire (70) and at a plurality of portions (P, Q) thereof in its longitudinal direction to make a comparison between focal point evaluation quantities (E) at each detected position whereby wiring defects can be detected.
摘要:
An optical system for detecting the shape of a three-dimensional object (50) comprising a collimate lens (23) for converting a laser beam to a parallel beam of light, a scanning optical system (25, 27) which moves the parallel beam incident on the object (50) normal to the latter to scan the object with the scanning beam, a mirror (29) which is located in the vicinity of the scanning beam at a predetermined inclination angle with respect to the object (50), to reflect the beam reflected by the object in a predetermined direction, an image forming lens (33) which converges the reflection beam reflected from the object by the mirror (29) onto a point through the scanning optical system to make an image of the reflection beam, and a first optical dectector (35) located on the point at which the reflection beam is converged to detect the converged beam spot by the image forming lens (33).
摘要:
An optical system for inspecting bonding wires (70) on a semiconductor has a camera (1), focal length and depth adjusting means (2), an illumination device (4) for irradiating brilliantly a desired portion of an inspection object (7) with an illumination light. The focal length and depth adjusting means (2) comprises a plurality of glass plates (21, 22, ... 24) each having a different focal length and depth, and each bonding wire (70) is inspected at a plurality of levels (F 1 , F 2 , F 3 ) in height position of the wire (70) and at a plurality of portions (P, Q) thereof in its longitudinal direction to make a comparison between focal point evaluation quantities (E) at each detected position whereby wiring defects can be detected.
摘要:
An optical system for inspecting bonding wires (70) on a semiconductor has a camera (1), focal length and depth adjusting means (2), an illumination device (4) for irradiating brilliantly a desired portion of an inspection object (7) with an illumination light. The focal length and depth adjusting means (2) comprises a plurality of glass plates (21, 22, ... 24) each having a different focal length and depth, and each bonding wire (70) is inspected at a plurality of levels (F1, F2, F3) in height position of the wire (70) and at a plurality of portions (P, Q) thereof in its longitudinal direction to make a comparison between focal point evaluation quantities (E) at each detected position whereby wiring defects can be detected.
摘要:
A method of measuring a wire-shaped object (1, 11) comprises a scanning step of scanning a light beam (LB) on the surface of the wire-shaped object (1, 11), a detection step of detecting a reflected light (RL) reflected from the surface of the wire-shaped object (1, 11) by a plurality of optical sensor cells (21), the optical sensor cells (21) being mounted on an inner wall (2a) of a reflected light detection unit (2, 20) located over the wire-shaped object (1, 11); and a measurement step of measuring a three-dimensional configuration of the wire-shaped object (1, 11) in accordance with output signals from the plurality of optical sensor cells (21), whereby, the three-dimensional configuration of the wire-shaped object (1, 11) is automatically measured in a short time.
摘要:
A method of measuring a wire-shaped object (1, 11) comprises a scanning step of scanning a light beam (LB) on the surface of the wire-shaped object (1, 11), a detection step of detecting a reflected light (RL) reflected from the surface of the wire-shaped object (1, 11) by a plurality of optical sensor cells (21), the optical sensor cells (21) being mounted on an inner wall (2a) of a reflected light detection unit (2, 20) located over the wire-shaped object (1, 11); and a measurement step of measuring a three-dimensional configuration of the wire-shaped object (1, 11) in accordance with output signals from the plurality of optical sensor cells (21), whereby, the three-dimensional configuration of the wire-shaped object (1, 11) is automatically measured in a short time.