公开(公告)号：EP2104141B1

公开(公告)日：2016-05-18

申请号：EP09155530.0

申请日：2009-03-18

Applicant: Fujitsu Limited

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Soga, Ikuo ,  Hirose, Shinichi

IPC: H01L23/373 ,  H01L23/433

CPC classification number: H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2924/3512

公开(公告)号：EP2104141A2

公开(公告)日：2009-09-23

申请号：EP09155530.0

申请日：2009-03-18

Applicant: Fujitsu Limited

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Soga, Ikuo ,  Hirose, Shinichi

IPC: H01L23/373

CPC classification number: H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K.

Abstract translation: 片状结构包括碳原子的多个线性结构，填充在用于支撑多个线性结构的线性结构之间的间隙中的填充层，以及形成在多个线性结构的至少一个端部上的涂膜，并且具有 导热率不低于1 W / m·K。

公开(公告)号：EP2187440A3

公开(公告)日：2010-10-27

申请号：EP09173510.0

申请日：2009-10-20

Applicant: FUJITSU LIMITED

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Hirose, Shinichi ,  Sakita, Yukie ,  Soga, Ikuo ,  Yagishita, Yohei

IPC: H01L23/373 ,  H01L23/433

CPC classification number: H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

公开(公告)号：EP2061077A2

公开(公告)日：2009-05-20

申请号：EP08167274.3

申请日：2008-10-22

Applicant: Fujitsu Limited

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Soga, Ikuo ,  Hirose, Shinichi

IPC: H01L23/367 ,  H01L23/373

CPC classification number: H01L23/367 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/16152

Abstract: The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.

Abstract translation: 片状结构包括多个线性结构束12，每个线性结构束12包括多个碳原子的线性结构，它们以第一间隙彼此间隔布置，并且布置在比第一间隙大的第二间隙处; 填充层14填充在第一间隙和第二间隙中并且支撑多个线性结构束12。

公开(公告)号：EP2104141A3

公开(公告)日：2010-10-27

申请号：EP09155530.0

申请日：2009-03-18

Applicant: Fujitsu Limited

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Soga, Ikuo ,  Hirose, Shinichi

IPC: H01L23/373 ,  H01L23/433

CPC classification number: H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10T428/30 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K.

公开(公告)号：EP2061077A3

公开(公告)日：2009-12-09

申请号：EP08167274.3

申请日：2008-10-22

Applicant: Fujitsu Limited

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Soga, Ikuo ,  Hirose, Shinichi

IPC: H01L23/367 ,  H01L23/373

CPC classification number: H01L23/367 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/16152

Abstract: The sheet structure includes a plurality of linear structure bundles 12 each of which comprises a plurality of linear structures of carbon atoms arranged, spaced from each other at a first gap and which are arranged at a second gap which is larger than the first gap; and a filling layer 14 filled in the first gap and the second gap and supporting the plurality of linear structure bundles 12.

Abstract translation: 片结构包括多个线性结构束12，每个线性结构束12包括多个碳原子线性结构，所述多个碳原子线性结构在第一间隙处彼此间隔开并且布置在比第一间隙大的第二间隙处; 以及填充在第一间隙和第二间隙中并且支撑多个线性结构束12的填充层14。

公开(公告)号：EP2187440B1

公开(公告)日：2017-02-15

申请号：EP09173510.0

申请日：2009-10-20

Applicant: FUJITSU LIMITED

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Hirose, Shinichi ,  Sakita, Yukie ,  Soga, Ikuo ,  Yagishita, Yohei

IPC: H01L23/373 ,  H01L23/433

CPC classification number: H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

Abstract translation: 该电子设备包括一个热发生器54，一个散热器58，和一个热辐射材料56的发热体54和散热体58和包括直链结构的碳原子12的多个部分并加以形成一个填充层14之间设置 热塑性树脂和线性结构12的多元性之间设置

公开(公告)号：EP2061077B1

公开(公告)日：2015-11-11

申请号：EP08167274.3

申请日：2008-10-22

Applicant: Fujitsu Limited

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Soga, Ikuo ,  Hirose, Shinichi

IPC: H01L23/367 ,  H01L23/373

CPC classification number: H01L23/367 ,  H01L23/373 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/16152

公开(公告)号：EP2187440A2

公开(公告)日：2010-05-19

申请号：EP09173510.0

申请日：2009-10-20

Applicant: FUJITSU LIMITED

Inventor： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Hirose, Shinichi ,  Sakita, Yukie ,  Soga, Ikuo ,  Yagishita, Yohei

IPC: H01L23/373

CPC classification number: H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.