公开(公告)号：EP2260512A4

公开(公告)日：2016-04-06

申请号：EP09722950

申请日：2009-03-18

申请人： HENKEL LTD

发明人： CHAN CHEW B ,  JI QING ,  CURRIE MARK ,  POOLE NEIL ,  KELLY GERALDINE

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/01028 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/0665

摘要： The present invention relates to a method of fabricating a semiconductor package or circuit assembly using an fluxing underfill composition applied to solder contact points in a dip process.

公开(公告)号：EP2176882A4

公开(公告)日：2014-04-16

申请号：EP08779889

申请日：2008-06-27

申请人： TESSERA INC

发明人： HABA BELGACEM

IPC分类号： H01L23/28 ,  H01L21/48 ,  H01L23/13 ,  H01L23/49 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/28 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Microelectronic package elements and packages having dielectric layers and methods of fabricating such elements packages are disclosed. The elements and packages may advantageously be used in microelectronic assemblies having high routing density.

公开(公告)号：EP2421032A1

公开(公告)日：2012-02-22

申请号：EP10173320.2

申请日：2010-08-18

申请人： NXP B.V.

发明人： Groenhuis, Roelf Anco Jacob ,  Walczyk, Sven ,  Dijkstra, Paul ,  de Bruin, Emiel

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L21/568 ,  H01L21/6836 ,  H01L23/051 ,  H01L23/3107 ,  H01L24/27 ,  H01L24/28 ,  H01L24/33 ,  H01L2221/68327 ,  H01L2223/54453 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a discrete semiconductor device package (100), the method comprising providing a discrete semiconductor device wafer (10) having a first surface and a second surface opposite to the first surface, said second surface carrying at least one bond pad for each discrete semiconductor device; applying a copper contact (20, 62) to the first surface; applying under bump metallization portion (32) to each of said bond pads; forming a copper layer portion (34, 62) on each of said under bump metallization portions; and dividing the wafer in a plurality of discrete semiconductor device packages (100). A thus obtained discrete semiconductor device package (100) and a PCB carrying such a package are also disclosed.

摘要翻译： 公开了一种制造分立半导体器件封装（100）的方法，所述方法包括提供具有第一表面和与第一表面相对的第二表面的分立半导体器件晶片（10），所述第二表面承载至少一个焊盘 对于每个分立半导体器件; 将铜触点（20,62）施加到所述第一表面; 将凹凸金属化部分（32）施加到每个所述接合焊盘; 在每个所述下凸块金属化部分上形成铜层部分（34,62）; 以及将所述晶片分割成多个分立半导体器件封装（100）。 还公开了如此获得的分立半导体器件封装（100）和携带这种封装的PCB。

公开(公告)号：EP2156465B1

公开(公告)日：2011-10-12

申请号：EP08718206.9

申请日：2008-03-26

申请人： International Business Machines Corporation

发明人： BUCHWALTER, Stephen, Leslie ,  FURMAN, Bruce, Kenneth ,  GRUBER, Peter, Alfred ,  NAH, Jae-Woong ,  SHIH, Da-Yuan

IPC分类号： H01L23/00

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

摘要翻译： 一种电气结构和成型方法。 电结构包括第一基板，其包括第一导电焊盘，第二基板，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：EP2339614A1

公开(公告)日：2011-06-29

申请号：EP09180391.6

申请日：2009-12-22

申请人： IMEC

发明人： Phommahaxay, Alain ,  Bogaerts, Lieve ,  Buisson, Thibault ,  Van Cauwenberghe, Marc ,  Tutunjyan, Nina ,  Tilmans, Hendrikus ,  Iker, François ,  Joudain, Anne

IPC分类号： H01L21/68 ,  H01L21/98 ,  H01L25/065 ,  H01L21/78

CPC分类号： H01L21/6835 ,  B81C1/00904 ,  B81C2201/0194 ,  B81C2203/032 ,  H01L21/6836 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention is related to a method for producing at least one semiconductor device, wherein a device wafer (1) is temporarily bonded to a support substrate (2), thinned and singulated to form separate dies (D1 to Dn). The dies, while remaining attached to the support substrate are then simultaneously attached to a target wafer (3), after which the support substrate (2) is removed. The above steps may be repeated to form stacks of dies. The target wafer is singulated to form said at least one device.

摘要翻译： 本发明涉及一种用于制造至少一种半导体器件的方法，其中器件晶片（1）临时地结合到支撑衬底（2）上，被薄化并单切以形成分开的裸片（D1至Dn）。 然后将残留在支撑基板上的模具同时附接到目标晶片（3），然后移除支撑基板（2）。 可以重复上述步骤以形成模具堆叠。 将目标晶片分割成形成所述至少一个器件。

公开(公告)号：EP2171752A2

公开(公告)日：2010-04-07

申请号：EP08826843.8

申请日：2008-07-17

申请人： Commissariat à l'Energie Atomique ,  Photonera France

发明人： KOPP, Christophe ,  BABLET, Jacqueline ,  RABY, Jacques ,  ROSSAT, Cyrille

IPC分类号： H01L21/56

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/3512

摘要： Disclosed is a method for coating the hybridization zone of a component comprising two elements that are joined to each other by means of a soldering material (6). In said method, a coating substance that is capable of filling the defined volume between the hybrid elements of the component by means of capillary action is deposited near the component. A zone (10) that is non-wettable by said substance is defined at the edge of the hybridization zone, on the lower element of the component, by depositing a coating that is non-wettable by said substance by means of a PECVD process and defining, vertically in line with the hybridization zone, a surface (12) that is wettable by the coating substance on said first element.

公开(公告)号：EP2156465A1

公开(公告)日：2010-02-24

申请号：EP08718206.9

申请日：2008-03-26

申请人： International Business Machines Corporation

发明人： BUCHWALTER, Stephen, Leslie ,  FURMAN, Bruce, Kenneth ,  GRUBER, Peter, Alfred ,  NAH, Jae-Woong ,  SHIH, Da-Yuan

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/56 ,  H01L21/68

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

公开(公告)号：EP1830309A4

公开(公告)日：2009-05-13

申请号：EP04819892

申请日：2004-12-02

申请人： HITACHI CHEMICAL CO LTD

发明人： TASAKI KOUJI ,  ISHIZAKA HIRONORI ,  SHIBUTANI MASAHITO ,  TANAKA KOUSUKE ,  SHINZAWA MASAHISA

IPC分类号： G06K19/00 ,  G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01Q1/22 ,  H01Q23/00

CPC分类号： H01Q1/2208 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/563 ,  H01L24/28 ,  H01L24/33 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68354 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01Q23/00 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199

摘要： There is provided an electronic device manufacturing method capable of manufacturing a device having a preferable communication characteristic at a low cost with a high productivity. The manufacturing method is for manufacturing an electronic device including a plurality of IC chips 100, each having external electrodes formed on a pair of opposing surfaces. One 102 of the electrodes is arranged on an antenna circuit 201 in a transmission/reception antenna having a slit. Furthermore, a bridging plate 300 is arranged for separately and electrically connecting the other external electrode 103 to a predetermined position of the corresponding antenna circuit 301. The method is characterized in that by positioning at least one of the IC chips 100 with the predetermined position on the corresponding antenna circuit 201 to be mounted, it is possible to arrange the retraining IC chips 100 at the predetermined positions on the antenna circuit 201 all at once.

公开(公告)号：EP1408364B1

公开(公告)日：2009-05-13

申请号：EP03028994.6

申请日：1998-03-04

申请人： Sharp Kabushiki Kaisha

发明人： Shiota, Motoji ,  Inada, Kiyoshi ,  Yoshida, Hirokazu

IPC分类号： G02F1/13 ,  H01L21/60 ,  H05K3/32

CPC分类号： H01L24/83 ,  G02F1/13452 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/1411 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/323 ,  H05K2201/0367 ,  H05K2201/09709 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP1603702A4

公开(公告)日：2008-10-29

申请号：EP04708960

申请日：2004-02-06

申请人： ZIPTRONIX INC

发明人： TONG QIN-YI ,  ENQUIST PAUL M ,  ROSE ANTHONY SCOT

IPC分类号： B23K31/00 ,  B23K20/02 ,  C04B37/00 ,  C04B37/02 ,  H01L21/60 ,  H01L21/98

CPC分类号： H01L21/76251 ,  B23K20/02 ,  H01L21/481 ,  H01L24/09 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/28 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/90 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/32145 ,  H01L2224/80801 ,  H01L2224/81011 ,  H01L2224/81013 ,  H01L2224/81014 ,  H01L2224/81136 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81208 ,  H01L2224/8121 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81894 ,  H01L2224/83095 ,  H01L2224/8319 ,  H01L2224/8334 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2224/83907 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05124 ,  H01L2224/05147

摘要： A bonded device structure including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the metallic bonding pads on the first substrate, a second substrate having a second set of metallic bonding pads aligned with the first set of metallic bonding pads, preferably connected to a device or circuit, and having a second non-metallic region adjacent to the metallic bonding pads on the second substrate, and a contact-bonded interface between the first and second set of metallic bonding pads formed by contact bonding of the first non-metallic region to the second non-metallic region. At least one of the first and second substrates may be elastically deformed.