公开(公告)号：EP1976004B1

公开(公告)日：2017-02-15

申请号：EP06843018.0

申请日：2006-12-21

申请人： A.L.M.T. CORP.

发明人： TAKASHIMA, Kouichi ,  MORIGAMI, Hideaki ,  NARITA, Masashi

IPC分类号： H01L23/36 ,  H01L23/14 ,  H01S5/024

CPC分类号： H01L24/27 ,  H01L23/14 ,  H01L23/3732 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01S5/0213 ,  H01S5/02484 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29144 ,  H01L2924/00012 ,  H01L2924/00014

公开(公告)号：EP1976004A4

公开(公告)日：2013-11-06

申请号：EP06843018

申请日：2006-12-21

申请人： ALMT CORP

发明人： TAKASHIMA KOUICHI ,  MORIGAMI HIDEAKI ,  NARITA MASASHI

IPC分类号： H01L23/36 ,  H01L23/14 ,  H01L23/373 ,  H01S5/024

CPC分类号： H01L24/27 ,  H01L23/14 ,  H01L23/3732 ,  H01L24/29 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/2908 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01S5/0213 ,  H01S5/02484 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29144 ,  H01L2924/00012 ,  H01L2924/00014

公开(公告)号：EP2563464A2

公开(公告)日：2013-03-06

申请号：EP11720231.7

申请日：2011-04-29

申请人： Second Sight Medical Products, Inc.

发明人： FARAJI, Boozarjomehr ,  ZHOU, David, Daomin ,  GREENBERG, Robert, J. ,  OK, Jerry ,  TALBOT, Neil, Hamilton ,  LITTLE, James, Singleton

IPC分类号： A61N1/36 ,  A61N1/375 ,  H01L21/60 ,  H01L21/56 ,  A61B5/04

CPC分类号： H01L21/563 ,  A61B5/04001 ,  A61B2562/125 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

摘要： The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

公开(公告)号：EP2544225A1

公开(公告)日：2013-01-09

申请号：EP11750546.1

申请日：2011-02-24

申请人： Osaka University

发明人： SUGANUMA Katsuaki ,  KIM Seongjun

IPC分类号： H01L21/52 ,  B23K35/28 ,  C22C18/00

CPC分类号： C22C18/00 ,  B23K35/282 ,  B23K2201/40 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/04026 ,  H01L2224/05187 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/325 ,  H01L2224/32507 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/04941 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/15787 ,  H01L2924/05432 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00012 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/014

摘要： In a semiconductor device 100 according to the present invention in which a semiconductor member 120 is stacked on a substrate 110, the semiconductor member 120 and the substrate 110 are bonded together by means of a semiconductor device bonding material 130 of which main component is zinc. Further, a coating layer to prevent diffusion of the semiconductor device bonding material 130 is provided on at least one of the surface of the substrate 110 and the surface of the semiconductor member 120. In addition, the coating layer 140 is configured such that a barrier layer 141 composed of nitride, carbide, or carbonitride and a protective layer 142 composed of a noble metal are stacked. Further, the nitride, the carbide, or the carbonitride composing the barrier layer 141 is selected so as to have free energy smaller than that of a material composing an insulating layer 111 provided in the substrate 110.

摘要翻译： 在根据本发明的半导体器件100中，半导体部件120堆叠在基板110上，半导体部件120和基板110通过主要成分为锌的半导体器件接合材料130接合在一起。 此外，在衬底110的表面和半导体部件120的表面中的至少一个上提供防止半导体器件接合材料130扩散的涂层。另外，涂层140被构造成使得屏障 层叠由氮化物，碳化物或碳氮化物构成的层141和由贵金属构成的保护层142。 此外，选择构成阻挡层141的氮化物，碳化物或碳氮化物的自由能小于构成设置在基板110中的绝缘层111的材料的自由能。

公开(公告)号：EP1830398A4

公开(公告)日：2012-06-06

申请号：EP05809380

申请日：2005-11-22

申请人： TANAKA ELECTRONICS IND

发明人： TESHIMA SATOSHI ,  MIKAMI MICHITAKA

IPC分类号： H01L23/49 ,  C22C5/02

CPC分类号： C22C5/02 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4845 ,  H01L2224/48624 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01064 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01205 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  Y10T428/12431 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2924/01039 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/013 ,  H01L2924/01062 ,  H01L2924/01048 ,  H01L2924/01049 ,  H01L2924/00013 ,  H01L2924/00 ,  H01L2924/01006

公开(公告)号：EP2267354A3

公开(公告)日：2012-03-28

申请号：EP10165808.6

申请日：2010-06-14

申请人： Paragon Semiconductor Lighting Technology Co., Ltd

发明人： Wu, Chao-Chin ,  Yang, Shen-Ta

IPC分类号： F21K99/00 ,  H01L33/62 ,  H01L25/075

CPC分类号： H01L25/0753 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/27013 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An LED package structure with standby bonding pads for increasing wire-bonding yield includes a substrate unit, a light-emitting unit, a conductive wire unit and a package unit. The substrate unit has a substrate body and a plurality of positive pads and negative pads. The light-emitting unit has a plurality of LED chips. The positive electrode of each LED chip corresponds to at least two of the positive pads, and the negative electrode of each LED chip corresponds to at least two of the negative pads. Every two wires of the conductive wire unit are respectively electrically connected between the positive electrode of each LED chip and one of the at least two positive pads and between the negative electrode of each LED chip and one of the at least two negative pads. The package unit has a translucent package resin body on the substrate body to cover the LED chips.

公开(公告)号：EP1334519B1

公开(公告)日：2012-02-01

申请号：EP01942135.3

申请日：2001-06-08

申请人： Intel Corporation

发明人： SESHAN, Krishna

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05172 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  Y10T428/12556 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05655 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184

摘要： The present invention is an input/output for a device and it method of fabrication. The input/output of the present invention comprises a bond pad having a ball limiting metallurgy (BLM) formed thereon and a bump formed on the ball limiting metallurgy (BLM). In an embodiment of the present invention the ball limiting metallurgy comprises a first film comprising nickel, vanadium, and nitrogen. In the second embodiment of the present invention the bump limiting metallurgy includes a first alloy film comprising a nickel-niobium alloy.

公开(公告)号：EP1946362B1

公开(公告)日：2012-01-11

申请号：EP06801412.5

申请日：2006-08-14

申请人： ENTHONE, INCORPORATED

发明人： RICHARDSON, Thomas, B. ,  KLEINFELD, Marlies ,  RIETMANN, Christian ,  ZAVARINE, Igor ,  STEINIUS, Ortrud ,  ZHANG, Yun ,  ABYS, Joseph, A.

IPC分类号： H01L21/445 ,  C25D3/60 ,  C25D3/64

CPC分类号： H01L21/2885 ,  C25D3/60 ,  C25D21/18 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/11462 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014

摘要： A process for forming a solder bump on an under bump metal structure in the manufacture of a microelectronic device comprising exposing the under bump metal structure to an electrolytic bath comprising a source of Sn2+ ions, a source of Ag+ ions, a thiourea compound and/or a quaternary ammonium surfactant; and supplying an external source of electrons to the electrolytic bath to deposit a Sn—Ag alloy onto the under bump metal structure.

公开(公告)号：EP2259213A2

公开(公告)日：2010-12-08

申请号：EP10010109.6

申请日：2007-01-31

申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

发明人： Yamazaki, Shunpei ,  Dairiki, Koji

IPC分类号： G06K19/077 ,  H01B1/12 ,  H01L51/00 ,  C09D11/00 ,  C09K3/16 ,  G03C1/85

CPC分类号： G06K19/07749 ,  H01L24/97 ,  H01L2224/16237 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00

摘要： It is an object to provide a semiconductor device capable of transmitting and receiving data with a reader/writer and reducing breakdown or interference due to static electricity. A semiconductor device includes a semiconductor integrated circuit, a conductive layer serving as an antenna that is connected to the semiconductor integrated circuit, and a substrate interposing the semiconductor integrated circuit and the conductive layer, where at least one of a layer forming the semiconductor integrated circuit, a layer covering the semiconductor integrated circuit, and the substrate is formed from a conductive polymer. In accordance with the above structure, wireless communication with a reader/writer is possible, and breakdown or malfunction in the semiconductor integrated circuit due to static electricity is reduced.

摘要翻译： 本发明的目的是提供一种能够利用读/写器发送和接收数据的半导体器件，并减少因静电引起的击穿或干扰。 半导体器件包括半导体集成电路，用作连接到半导体集成电路的天线的导电层和插入半导体集成电路和导电层的基板，其中形成半导体集成电路的层中的至少一个 ，覆盖半导体集成电路的层，并且基板由导电聚合物形成。 根据上述结构，与读取器/写入器的无线通信是可能的，并且减少了由于静电引起的半导体集成电路中的故障或故障。

公开(公告)号：EP2187440A3

公开(公告)日：2010-10-27

申请号：EP09173510.0

申请日：2009-10-20

申请人： FUJITSU LIMITED

发明人： Iwai, Taisuke ,  Kondo, Daiyu ,  Yamaguchi, Yoshitaka ,  Hirose, Shinichi ,  Sakita, Yukie ,  Soga, Ikuo ,  Yagishita, Yohei

IPC分类号： H01L23/373 ,  H01L23/433

CPC分类号： H01L23/433 ,  H01L23/373 ,  H01L23/3733 ,  H01L24/28 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/29499 ,  H01L2224/73253 ,  H01L2224/83365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/10158 ,  H01L2924/15788 ,  H01L2924/16152 ,  Y10S977/734 ,  Y10S977/739 ,  Y10S977/742 ,  Y10T29/49002 ,  Y10T428/30 ,  Y10T428/31504 ,  H01L2924/00 ,  H01L2224/0401

摘要： The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.