-
1.发明公开
公开(公告)号：EP3967736A1
公开(公告)日：2022-03-16
申请号：EP21205576.8
申请日：2014-03-14
申请人： Fujimi Incorporated
摘要： Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.
-
2.发明公开
公开(公告)号：EP4317337A1
公开(公告)日：2024-02-07
申请号：EP22775475.1
申请日：2022-03-18
申请人： Fujimi Incorporated
IPC分类号： C09G1/02 , C09K3/14 , B24B37/00 , H01L21/304
摘要： The present invention provides means capable of reducing surface defects on a polished substrate. The present invention relates to a method for polishing a substrate, in which the polishing method includes a polishing step, the polishing step includes two or more polishing sub-steps of polishing the substrate by rotating a platen while supplying a polishing composition to a contact surface between the substrate and a polishing pad attached to the platen, the two or more polishing sub-steps include a polishing sub-step 1 of performing polishing on the platen using a polishing composition S1, and a polishing sub-step 2 of performing, after the polishing sub-step 1, polishing on the platen used in the polishing sub-step 1 using a polishing composition S2, the polishing composition S1 contains an abrasive 1, water, and a water-soluble polymer having an abrasive adsorption parameter of 5 or more, and the polishing composition S2 contains an abrasive 2, water, and a water-soluble polymer having the abrasive adsorption parameter less than 5, but does not contain a water-soluble polymer having the abrasive adsorption parameter of 5 or more in a content of 0.005% by mass or more.
-
公开(公告)号：EP3007213A1
公开(公告)日：2016-04-13
申请号：EP14807048.5
申请日：2014-05-02
申请人： Fujimi Incorporated
IPC分类号： H01L21/304 , B24B37/00 , C09K3/14
摘要： This invention provides a silicon wafer polishing composition used in the presence of an abrasive. The composition comprises a silicon wafer polishing accelerator, an amide group-containing polymer, and water. The amide group-containing polymer has a building unit A in its main chain. The building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group. The carbonyl carbon atom constituting the secondary amide group or tertiary amide group is directly coupled to the main chain carbon atom.
摘要翻译： 本发明提供了在磨料存在下使用的硅晶片抛光组合物。 该组合物包括硅晶片抛光促进剂，含酰胺基的聚合物和水。 含酰胺基的聚合物在其主链中具有建筑单元A. 构成单元A包含构成含酰胺基聚合物的主链的主链碳原子和仲酰胺基或叔酰胺基。 构成仲酰胺基或叔酰胺基的羰基碳原子与主链碳原子直接键合。
-
公开(公告)号：EP4410887A1
公开(公告)日：2024-08-07
申请号：EP22875832.2
申请日：2022-09-14
申请人： Fujimi Incorporated
IPC分类号： C08L29/14 , C09K3/14 , H01L21/304
CPC分类号： C09K3/14 , H01L21/304 , C08L29/14
摘要： Provided is a method for producing a polishing composition of which filterability is good and which can reduce surface defects of an object to be polished.
A method for producing a polishing composition containing a modified polyvinyl alcohol composition containing a modified polyvinyl alcohol or a derivative thereof and water includes a heat retention step of retaining the modified polyvinyl alcohol composition at a solution temperature of 30°C or higher and lower than 60°C, in which the heat retention step is performed such that a parameter A is 2.0 or more.-
公开(公告)号：EP3950875A1
公开(公告)日：2022-02-09
申请号：EP20776335.0
申请日：2020-03-25
申请人： Fujimi Incorporated
发明人： TSUCHIYA, Kohsuke , ASADA, Maki , ICHITSUBO, Taiki
IPC分类号： C09K3/14 , B24B37/00 , H01L21/304
摘要： Provided is a polishing composition having excellent capability of reducing haze on the surface of an object to be polished. The polishing composition provided by the present invention includes an abrasive, a basic compound, a water-soluble polymer, and water. The water-soluble polymer includes at least a water-soluble polymer P1 and a water-soluble polymer P2. Here, the water-soluble polymer P1 is an acetalized polyvinyl alcohol-based polymer, and the water-soluble polymer P2 is a water-soluble polymer other than the acetalized polyvinyl alcohol-based polymer.
-
公开(公告)号：EP3708630A1
公开(公告)日：2020-09-16
申请号：EP18871893.6
申请日：2018-10-19
发明人： TSUCHIYA, Kohsuke , TANSHO, Hisanori , SUGA, Yusuke , ICHITSUBO, Taiki , TAKEMOTO, Takayuki , SAITO, Naohiko , KAAI, Michihiro
IPC分类号： C09K3/14 , B24B37/00 , C09G1/02 , H01L21/304
摘要： Provided is a polishing composition which contains a water-soluble polymer and is suitable for reducing LPDs. The polishing composition provided in this application includes an abrasive, a water-soluble polymer, and a basic compound. In the polishing composition, the content of a reaction product of a polymerization initiator and a polymerization inhibitor is 0.1 ppb or less of the polishing composition on a weight basis.
-
公开(公告)号：EP3508550A1
公开(公告)日：2019-07-10
申请号：EP17846509.2
申请日：2017-08-29
IPC分类号： C09K3/14 , B24B37/00 , H01L21/304
摘要： Provided is a polishing composition effective for reducing surface defects. The polishing composition provided by the present invention includes an abrasive, a water-soluble polymer, and a basic compound. The water-soluble polymer includes a polymer A that satisfies both of the following conditions.
(1) The polymer A includes a vinyl alcohol unit and a non-vinyl alcohol unit in one molecule.
(2) An adsorption parameter calculated by [(C1 - C2)/C1] × 100 is 5 or more. Here, C1 is the total amount of organic carbon contained in a test liquid L1 including 0.017% by weight of the polymer A and 0.009% by weight of ammonia. The C2 is the total amount of organic carbon contained in a supernatant liquid obtained by centrifugally separating a test liquid L2 including 0.46% by weight of colloidal silica having a BET diameter of 35 nm, 0.017% by weight of the polymer A, and 0.009% by weight of ammonia, and precipitating the silica particles.-
公开(公告)号：EP3425016A1
公开(公告)日：2019-01-09
申请号：EP17759589.9
申请日：2017-02-08
申请人： Fujimi Incorporated
IPC分类号： C09K3/14 , B24B37/00 , C09G1/02 , H01L21/304
摘要： The present invention relates to a polishing composition containing an abrasive, a water-soluble polymer, an anionic surfactant, a basic compound, and water, in which the anionic surfactant has an oxyalkylene unit, and an average addition mole number of the oxyalkylene unit of the anionic surfactant is more than 3 and 25 or less. According to the present invention, it is possible to provide a polishing composition which can reduce the haze of a polished object and is also excellent in a polishing removal rate.
-
9.发明公开POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION, AND KIT FOR PREPARING POLISHING COMPOSITION 审中-公开抛光剂组合物，工艺用于生产蜡组合和试剂盒进行抛光组合物的制备
公开(公告)号：EP2977423A1
公开(公告)日：2016-01-27
申请号：EP14767647.2
申请日：2014-03-14
申请人： Fujimi Incorporated
IPC分类号： C09K3/14 , B24B37/00 , C09G1/02 , H01L21/304
CPC分类号： C09G1/02 , C08F216/06 , C09G1/16 , C09K3/1436 , C09K3/1454 , H01L21/02024
摘要： Provided are a polishing composition comprising a water-soluble polymer that has a molecular structure comprising a plurality of repeat unit species having different SP values and a polishing composition exhibiting an etching rate and an abrasive adsorption in prescribed ranges when determined by prescribed methods. Also provided is a method for producing a polishing composition, using an abrasive, a basic compound, a water-soluble polymer having an alkaline-hydrolytic functional group, and water. The method comprises a step of obtaining an agent A comprising at least the basic compound and a step of obtaining an agent B comprising at least the water-soluble polymer H.
-
公开(公告)号：EP4120323A1
公开(公告)日：2023-01-18
申请号：EP21768345.7
申请日：2021-03-04
申请人： Fujimi Incorporated
IPC分类号： H01L21/304
摘要： Provided is a polishing composition that contains a cellulose derivative and can improve the polishing removability and enhance the wettability of a polished surface of a silicon wafer. The polishing composition contains an abrasive, a cellulose derivative, a basic compound, and water. Here, the polishing composition has a zeta potential of -24.0 mV or more.
-
-
-
-
-
-
-
-
-
搜索结果
12 条记录 (耗时 0.016 秒)
