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公开(公告)号：EP2268117B1
公开(公告)日：2018-03-14
申请号：EP10165655.1
申请日：2010-06-11
IPC分类号： H05K9/00
CPC分类号： H05K9/0043 , H05K9/0024 , Y10T29/49002
摘要： A system and method of forming a patterned conformal structure (10) for an electrical system (12) is disclosed. The conformal structure (10) includes a dielectric coating (18) positioned on an electrical system (12) having circuit components (16) mounted thereon, the dielectric coating (18) shaped to conform to a surface of the electrical system (12) and having a plurality of openings (20) therein positioned over contact pads (22) on the surface of the electrical system. The conformal structure (10) also includes a conductive coating (24) layered on the dielectric coating (18) and on the contact pads (22) such that an electrical connection is formed between the conductive coating (24) and the contact pads (22). The dielectric coating (18) and the conductive coating (24) have a plurality of overlapping pathway openings (27) formed therethrough to isolate a respective shielding area (26) of the conformal structure over desired circuit components (16) or groups of circuit components.
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2.发明公开System And Method Of Forming A Wafer Scale Package 审中-公开系统和Verfahren zur Formung einer Verpackung auf Waferebene
公开(公告)号：EP2107599A2
公开(公告)日：2009-10-07
申请号：EP09156243.9
申请日：2009-03-26
发明人： Kapusta, Christopher James , Cunningham, Donald , Saia, Richard Joseph , Durocher, Kevin , Iannotti, Joseph , Hawkins, William
IPC分类号： H01L21/60 , B81B7/00 , H01L23/522
CPC分类号： H01L23/3114 , B81B7/007 , H01L23/5223 , H01L23/5228 , H01L23/525 , H01L24/11 , H01L24/12 , H01L2224/02313 , H01L2224/02319 , H01L2224/0401 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A system and method for forming a wafer level package (WLP) (12) (i.e., wafer level chip size package) is disclosed. The WLP (12) includes a silicon integrated circuit (IC) substrate (10) having a plurality of die pads (22) formed on a top surface thereof and a plurality of polymer laminates (16) positioned thereon. Each of the polymer laminates (16) is comprised of a separate pre-formed laminate sheet and has a plurality of vias (20) formed therein that correspond to a respective die pad (22). A plurality of metal interconnects (26) are formed on each of the plurality of polymer laminates (16) so as to cover a portion of a top surface of a polymer laminate (16) and extend down through the via (20) and into contact with a metal interconnect (26) on a neighboring polymer laminate positioned below (16). An input/output (I/O) system interconnect (34) is positioned on a top surface of the wafer level package (12) and is attached to the plurality of metal interconnects (26).
摘要翻译： 公开了一种用于形成晶片级封装（WLP）（12）（即晶片级芯片尺寸封装）的系统和方法。 WLP（12）包括硅集成电路（IC）衬底（10），其具有形成在其顶表面上的多个管芯焊盘（22）和位于其上的多个聚合物层压板（16）。 每个聚合物层压体（16）由单独的预成型层压片构成，并且在其中形成有对应于相应的管芯焊盘（22）的多个通孔（20）。 在多个聚合物层压体（16）中的每一个上形成多个金属互连（26），以覆盖聚合物层压体（16）的顶表面的一部分并向下延伸穿过通孔（20）并且接触 在位于（16）下方的相邻聚合物层压体上具有金属互连（26）。 输入/输出（I / O）系统互连（34）位于晶片级封装（12）的顶表面上，并连接到多个金属互连（26）。
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公开(公告)号：EP1796165A3
公开(公告)日：2010-03-24
申请号：EP06125834.9
申请日：2006-12-11
发明人： Durocher, Kevin Matthew , Goodwin, Stacey Joy , Balch, Ernest Wayne , Kapusta, Christopher James
IPC分类号： H01L23/473 , H01L21/48
CPC分类号： H01L23/473 , H01L21/4871 , H01L2924/0002 , H05K3/027 , H01L2924/00
摘要： A method of making an electronic device cooling system includes forming a thermally conductive layer (88) on an inner surface of the substrate (12) and laser ablating the thermally conductive layer (88) to form microchannels.
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4.发明授权Mems based current sensor using magnetic-to-mechanical conversion and reference components 有权与磁 - 机转换Memsstromsensor，与参考分量
公开(公告)号：EP1610142B1
公开(公告)日：2007-10-03
申请号：EP05253492.2
申请日：2005-06-07
发明人： Berkcan, Ertugrul , Kapusta, Christopher James , Claydon, Glenn Scott , Zribi, Anis , Meyer, Laura Jean , Tian, Wei-Cheng
IPC分类号： G01R33/028 , G01R15/20
CPC分类号： G01R33/0283 , G01R15/148 , G01R33/0286
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公开(公告)号：EP2268117A3
公开(公告)日：2012-01-18
申请号：EP10165655.1
申请日：2010-06-11
IPC分类号： H05K9/00
CPC分类号： H05K9/0043 , H05K9/0024 , Y10T29/49002
摘要： A system and method of forming a patterned conformal structure (10) for an electrical system (12) is disclosed. The conformal structure (10) includes a dielectric coating (18) positioned on an electrical system (12) having circuit components (16) mounted thereon, the dielectric coating (18) shaped to conform to a surface of the electrical system (12) and having a plurality of openings (20) therein positioned over contact pads (22) on the surface of the electrical system. The conformal structure (10) also includes a conductive coating (24) layered on the dielectric coating (18) and on the contact pads (22) such that an electrical connection is formed between the conductive coating (24) and the contact pads (22). The dielectric coating (18) and the conductive coating (24) have a plurality of overlapping pathway openings (27) formed therethrough to isolate a respective shielding area (26) of the conformal structure over desired circuit components (16) or groups of circuit components.
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公开(公告)号：EP1796165A2
公开(公告)日：2007-06-13
申请号：EP06125834.9
申请日：2006-12-11
发明人： Durocher, Kevin Matthew , Goodwin, Stacey Joy , Balch, Ernest Wayne , Kapusta, Christopher James
IPC分类号： H01L23/473 , H01L21/48
CPC分类号： H01L23/473 , H01L21/4871 , H01L2924/0002 , H05K3/027 , H01L2924/00
摘要： A method of making an electronic device cooling system includes forming a thermally conductive layer (88) on an inner surface of the substrate (12) and laser ablating the thermally conductive layer (88) to form microchannels.
摘要翻译： 电子设备冷却系统的制造的方法包括在基板的内表面（12）和激光上形成导热层（88）烧蚀导热层（88），以形成微通道。
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7.发明公开
公开(公告)号：EP1610142A1
公开(公告)日：2005-12-28
申请号：EP05253492.2
申请日：2005-06-07
发明人： Berkcan, Ertugrul , Kapusta, Christopher James , Claydon, Glenn Scott , Zribi, Anis , Meyer, Lara Jean , Tian, Wei-Cheng
IPC分类号： G01R33/028 , G01R15/20
CPC分类号： G01R33/0283 , G01R15/148 , G01R33/0286
摘要： A micro-electromechanical system, MEMS, current sensor is described as including a first conductor, a magnetic field shaping component (5) for shaping a magnetic field (20) produced by a current (I) in the first conductor, and a MEMS-based magnetic field sensing component (25) including a magneto-MEMS component (30) for sensing the shaped magnetic field and, in response thereto, providing an indication (80) of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.
摘要翻译： 微机电系统MEMS电流传感器被描述为包括第一导体，用于对由第一导体中的电流（I）产生的磁场（20）进行成形的磁场成形部件（5），以及MEMS- 包括用于感测成形磁场的磁MEMS- MEMS部件（30），并响应于此提供第一导体中的电流的指示（80）。 还描述了一种用于感测使用MEMS的电流的方法，包括使用在第一导体中的电流产生的磁场成形，用具有磁MEMS组件磁场感测电路的基于MEMS的磁场感测组件感测成形的磁场 并且提供第一导体中的电流的指示。
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公开(公告)号：EP2107599B1
公开(公告)日：2019-07-03
申请号：EP09156243.9
申请日：2009-03-26
发明人： Kapusta, Christopher James , Cunningham, Donald , Saia, Richard Joseph , Durocher, Kevin , Iannotti, Joseph , Hawkins, William
IPC分类号： H01L21/60 , B81B7/00 , H01L23/522 , H01L23/31 , H01L23/525 , H01L23/485
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公开(公告)号：EP2050712B1
公开(公告)日：2018-12-26
申请号：EP08166371.8
申请日：2008-10-10
发明人： Aimi, Marco Francesco , Kapusta, Christopher James , Gowda, Arun Virupaksha , Hays, David Cecil , Boomhoower, Oliver Charles , Claydon, Glenn Scott , Iannotti, Joseph Alfred , Keimel, Christopher Fred
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate (20) are capped with a cover (28) using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate (20) has a first side (20A) with multiple MEMS devices. A cover (28) is formed with through-holes (40) for vias (40), and with standoff posts (34) for layer registration and separation. An adhesive sheet (42) is patterned with cutouts (44) for the MEMS devices, vias (40), and standoff posts (34). The adhesive sheet (42) is tacked to the cover (28), then placed on the mems substrate (20) and heated to bond the layers. The via holes (40) may be metalized with leads for circuit board (58) connection. The mems units (22) may be diced from the substrate (20) after sealing, thus protecting them from contaminants.
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公开(公告)号：EP2050712A3
公开(公告)日：2013-11-27
申请号：EP08166371.8
申请日：2008-10-10
发明人： Aimi, Marco Francesco , Kapusta, Christopher James , Gowda, Arun Virupaksha , Hays, David Cecil , Boomhoower, Oliver Charles , Claydon, Glenn Scott , Iannotti, Joseph Alfred , Keimel, Christopher Fred
IPC分类号： B81C1/00
CPC分类号： B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/032 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： Multiple microelectromechanical systems (MEMS) on a substrate (20) are capped with a cover (28) using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate (20) has a first side (20A) with multiple MEMS devices. A cover (28) is formed with through-holes (40) for vias (40), and with standoff posts (34) for layer registration and separation. An adhesive sheet (42) is patterned with cutouts (44) for the MEMS devices, vias (40), and standoff posts (34). The adhesive sheet (42) is tacked to the cover (28), then placed on the mems substrate (20) and heated to bond the layers. The via holes (40) may be metalized with leads for circuit board (58) connection. The mems units (22) may be diced from the substrate (20) after sealing, thus protecting them from contaminants.
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