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公开(公告)号:EP1596233A4
公开(公告)日:2007-05-23
申请号:EP04712756
申请日:2004-02-19
Applicant: HAMAMATSU PHOTONICS KK
Inventor: HOSHINO YASUJI , IIDA TAKASHI , WARASHINA YOSHIHISA , TABATA KEI
CPC classification number: G02B6/423 , G02B6/4201 , G02B6/4214 , G02B6/4243 , G02B6/4249 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
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公开(公告)号:EP2403011A4
公开(公告)日:2013-03-20
申请号:EP10746105
申请日:2010-02-15
Applicant: HAMAMATSU PHOTONICS KK
Inventor: SAKAMOTO AKIRA , IIDA TAKASHI , YAMAMOTO KOEI , YAMAMURA KAZUHISA , NAGANO TERUMASA
IPC: H01L31/10 , H01L31/0236
CPC classification number: H01L31/02366 , H01L27/1446 , H01L31/0236 , H01L31/02363 , H01L31/035281 , H01L31/1804 , Y02E10/547 , Y02P70/521
Abstract: Prepared is an n - type semiconductor substrate 1 having a first principal surface 1a and a second principal surface 1b opposed to each other, and having a p + type semiconductor region 3 formed on the first principal surface 1a side. At least a region opposed to the p + type semiconductor region 3 in the second principal surface 1a of the n - type semiconductor substrate 1 is irradiated with a pulsed laser beam to form an irregular asperity 10. After formation of the irregular asperity 10, an accumulation layer 11 with an impurity concentration higher than that of the n - type semiconductor substrate 1 is formed on the second principal surface 1a side of the n - type semiconductor substrate 1. After formation of the accumulation layer 11, the n - type semiconductor substrate 1 is subjected to a thermal treatment.
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公开(公告)号:EP2072978A4
公开(公告)日:2014-01-08
申请号:EP08765177
申请日:2008-06-05
Applicant: HAMAMATSU PHOTONICS KK
Inventor: SUZUKI TOMOFUMI , SHIBAYAMA KATSUMI , IIDA TAKASHI , YOKINO TAKAFUMI , ITO MASASHI , TEICHMANN HELMUT , HILLER DIETMAR , STARKER ULRICH
CPC classification number: G01J3/14 , G01J3/02 , G01J3/0256
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