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公开(公告)号：EP0269410A3
公开(公告)日：1989-02-08
申请号：EP87310344.4
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Murakami, Gen , Nishi, Kunihiko
IPC分类号： B65D81/26
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A plurality of semiconductor elements 12 are located within suitahble carriers 13, and a plurality of such carriers 13 are enclosed within a bag 17 or other container. The bag 17 is made from a moisture-proof film 11 which is air sealed to enclose the elements 12. To eliminate moisture within the bag 17, a desiccant may be provided within the bag 17 and/or within the carriers 13. Furthermore a humidity indicator 15 may be provided within the bag 17, which is visible from the outside of the bag 17, and hence provides a visual indication if there is condensation within the bag 17 which could affect the elements 12. As a further step, the film 11 may be multi-layered with one layer being a metal sheet. In this way, contamination by moisture of the semiconductor elements during storage or transport may be reduced, thereby reducing the risk of damage when the semiconductor elements are mounted on a substrate.
摘要翻译： 多个半导体元件12位于西装载体13内，并且多个这样的载体13被封装在袋17或其它容器内。 袋17由空气密封以包围元件12的防潮膜11制成。为了消除袋17内的水分，可以在袋17内和/或载体13内设置干燥剂。此外，湿度 指示器15可以设置在袋17内，袋17可以从袋17的外部看到，并且因此提供视觉指示，如果袋17内存在可能影响元件12的冷凝。作为另外的步骤，膜11 可以是多层的，其中一层是金属片。 以这种方式，可以减少在存储或运输期间半导体元件的湿度的污染，从而降低当将半导体元件安装在基板上时的损坏风险。
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公开(公告)号：EP0512579A1
公开(公告)日：1992-11-11
申请号：EP92110466.7
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Nishi, Kunihiko , Murakami, Gen
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A package of semiconductor elements comprises:
at least one surface-mounting semiconductor device;
a desiccant; and
a moisture-proofing bag member which is made of multi-layered film, said multi-layered film comprising a barrier layer for preventing intrusion of moisture, an inner charge preventing layer formed inside of said barrier, and an outer charge preventing layer formed outside of said barrier layer,
the furface-mounting semiconductor device and the desiccant being sealed in said moisture-proofing bag member.摘要翻译： 一种半导体元件包括：至少一个表面安装半导体器件; 干燥剂 以及由多层膜制成的防潮袋构件，所述多层膜包括防止水分侵入的阻挡层，形成在所述阻挡层内部的内部电荷防止层，以及形成在外部的外部电荷防止层 的所述阻挡层，所述表面安装半导体装置和所述干燥剂被密封在所述防潮袋构件中。
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公开(公告)号：EP0269410A2
公开(公告)日：1988-06-01
申请号：EP87310344.4
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Murakami, Gen , Nishi, Kunihiko
IPC分类号： B65D81/26
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： A plurality of semiconductor elements 12 are located within suitahble carriers 13, and a plurality of such carriers 13 are enclosed within a bag 17 or other container. The bag 17 is made from a moisture-proof film 11 which is air sealed to enclose the elements 12. To eliminate moisture within the bag 17, a desiccant may be provided within the bag 17 and/or within the carriers 13. Furthermore a humidity indicator 15 may be provided within the bag 17, which is visible from the outside of the bag 17, and hence provides a visual indication if there is condensation within the bag 17 which could affect the elements 12. As a further step, the film 11 may be multi-layered with one layer being a metal sheet.
In this way, contamination by moisture of the semiconductor elements during storage or transport may be reduced, thereby reducing the risk of damage when the semiconductor elements are mounted on a substrate.-
公开(公告)号：EP0512579B1
公开(公告)日：1996-01-24
申请号：EP92110466.7
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Nishi, Kunihiko , Murakami, Gen
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
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公开(公告)号：EP0458423A3
公开(公告)日：1991-12-11
申请号：EP91202052.6
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Nishi, Kunihiko , Murakami, Gen
IPC分类号： B65D81/26
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.
摘要翻译： 多个半导体元件12位于西装载体13内，并且多个这样的载体13被封装在袋17或其它容器内。 袋17由空气密封以包围元件12的防潮膜11制成。为了消除袋17内的水分，可以在袋17内和/或载体13内设置干燥剂。此外，湿度 指示器15可以设置在袋17内，袋17可以从袋17的外部看到，并且因此提供视觉指示，如果袋17内存在可能影响元件12的冷凝。作为另外的步骤，膜11 可以是多层的，其中一层是金属片。 以这种方式，可以减少在存储或运输期间半导体元件的湿度的污染，从而降低当将半导体元件安装在基板上时的损坏风险。
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公开(公告)号：EP0458423B1
公开(公告)日：1994-09-21
申请号：EP91202052.6
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Nishi, Kunihiko , Murakami, Gen
IPC分类号： B65D81/26
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
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公开(公告)号：EP0269410B1
公开(公告)日：1992-04-22
申请号：EP87310344.4
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Murakami, Gen , Nishi, Kunihiko
IPC分类号： B65D81/26
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
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公开(公告)号：EP0458423A2
公开(公告)日：1991-11-27
申请号：EP91202052.6
申请日：1987-11-24
申请人： HITACHI, LTD.
发明人： Kitamura, Wahei , Nishi, Kunihiko , Murakami, Gen
IPC分类号： B65D81/26
CPC分类号： B32B27/08 , B32B27/18 , B32B27/304 , B32B27/32 , B32B2307/7246 , B32B2311/24 , B32B2323/04 , B32B2327/06 , B32B2439/00 , B65D79/02 , B65D81/266 , H01L21/67121 , H01L23/3107 , H01L23/3135 , H01L23/49506 , H01L23/49582 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49171 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H05K13/0084 , Y10S174/08 , Y10S428/922 , Y10T29/49121 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging.
To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.摘要翻译： 在诸如树脂模制存储器IC等的薄树脂封装的表面封装中，由于树脂在包装之前吸收了水分，所以在焊料回流步骤中经常发生热冲击施加到封装上的封装的裂纹。 为了解决这个问题，在树脂成型装置的树脂成型装置的组装工序中，在树脂仍然干燥的状态下，将装置密封而成，并且在执行表面包装之前从袋子中取出。
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