摘要:
in accordance with the present invention, there is provided a semiconductor rectifier diode which has low loss, quick response and soft reverse recovery properties and is composed of three consecutive layers, i.e., a p-type emitter layer (3), an n-type base layer (4) and an n-type emitter layer (5), the p-type emitter layer being composed of a first portion (31) and second portions (32) which surround said first portion, have a higher impurity concentration as compared with said first portion, and extend beyond said first portion toward said n-type base layer, and said base layer being composed of a first layer portion (41) which is adjacent to said n-type emitter layer and a second layer portion (42) which is located near a p-n junction (J,) side and has a lower impurity concentration as compared with said first layer portion.
摘要:
The GTO thyristor consists of a semiconductor substrate 11 of disc shape which has, in sequence, an emitter layer 16 on the cathode side, a second base layer 15, a first base layer 13,14, and an emitter layer 12 on the anode side. The emitter layer on the anode side is short-circuited by an emitter short-circuiting layer 13. The emitter layer 16 on the cathode side is divided into a plurality of radially extending elongate units, and the emitter layer 12 on the anode side is likewise divided into elongate units which are provided in the portions located at the areas of projection of the units of the layer 16 onto the anode side. The emitter short-circuiting layer 13 thus forms a plurality of wedge-shaped regions between the said areas of projection of the units of the layer 16. A thyristor of high current capacity and quick turn-off is thus achieved because the varying distance from the central lead wire 20 of the control electrode 18 is compensated by the varying width of the said wedge shaped regions of the emitter short circuit layer 13.
摘要:
A gate turn-off thyristor provided with a disc-shaped semiconductor substrate consisting of at least 4 layers of pnpn forming pn junctions between different layers adjacent to each other, in which the emitter layer (16) on the cathode side is divided into a plurality of elongated regions arranged in the radial direction and disposed in a plurality of rings, in which the base layer (14) on the anode side is formed so as to be connected partially with the anode electrode (2) disposed on the emitter layer on the anode side by a short-circuiting layer having the same conductivity type as the base layer and the short-circuiting layer described above has a coaxial circular pattern, characterized in that the short-circuiting layer described above is formed at least within the part, where the regions between different rings of the emitter layer on the cathode side are projected on the anode side.
摘要:
A gate turn-off thyristor provided with a disc-shaped semiconductor substrate consisting of at least 4 layers of pnpn forming pn junctions between different layers adjacent to each other, in which the emitter layer (16) on the cathode side is divided into a plurality of elongated regions arranged in the radial direction and disposed in a plurality of rings, in which the base layer (14) on the anode side is formed so as to be connected partially with the anode electrode (2) disposed on the emitter layer on the anode side by a short-circuiting layer having the same conductivity type as the base layer and the short-circuiting layer described above has a coaxial circular pattern, characterized in that the short-circuiting layer described above is formed at least within the part, where the regions between different rings of the emitter layer on the cathode side are projected on the anode side.
摘要:
A semiconductor device has a first semiconductor region (13,15,17) of a first conductivity type and a second semiconductor region (14) of a second conductivity type contacted by respective first and second electrodes (6,2). A semi-insulating layer (8) extends between the first and second electrodes (6,2) and there is a first insulating (4,7) between the semi-insulating layer (8) and the first semiconductor region (13,15,17). The sheet resistivity of the semi-insulating layer (8) varies and this improves the high breakdown voltage of the p-n junction of the semiconductor device between the first and second semiconductor layers, by acting as a shield for charges included on a passivation insulation layer (19) covering the semi-insulating layer (8) and the first and second electrodes (6,2). Third semiconductor regions (16), with corresponding third electrodes (5) extend around, and are spaced from, the second semiconductor region (14). The third electrodes (5) extend over the parts of the first semiconductor region (13,15,17) adjacent the third semiconductor region (16) as this also improves the breakdown voltage. The second electrode (2) may also extend over the part of the first semiconductor region (13,15,17) adjacent the second semiconductor region (14) to cover the p-n junction therebetween.