摘要:
A constant-voltage diode has a first semiconductor region (14) of a first conductivity type, an adjoining semiconductor region (15) of a second conductivity type, a third semiconductor region (16) of the second conductivity type adjoining the second semiconductor region, and a fourth semiconductor region (17) of the first conductivity type partially surrounded by the second semiconductor region (15). At low reverse biases between a cathode electrode (2) and an anode electrode (3), the behavior of the device is determined by the pn junction (J₁) between the first and second semiconductor regions (14,15). As the reverse biasing increases, the depletion layers of that junction (J₁) will reach the fourth semiconductor region (17), but the reverse bias at this time is insufficient to break down that junction (J₁). Increase of reverse bias causes break down of the pn junction (J₃) between the third and fourth semiconductor regions (16,17). This effect is achieved by suitable impurity concentrations in the semiconductor regions (14,15,16,17). A plurality of fourth semiconductor regions (17) may be provided and a bidirectional structure can be obtained by providing a polarity reversed structure with the first semiconductor region (14) in common.
摘要:
A gate turn-off thyristor and a transistor are disclosed, each of which comprises: a semiconductor substrate (1,101) including at least three semiconductor layers between a pair of principal surfaces, adjacent ones of the semiconductor layers being different in conductivity type from each other, a first one of the semiconductor layers being formed of at least one strip-shaped region (20, 120) with a constant width, a second one (30, 130) of the semiconductor layers being exposed to a first principal surface of the semiconductor substrate together with the strip-shaped region; a first main electrode (2.102) kept in ohmic contact with the strip-shaped region at the first principal surface; a first control electrode (3a, 103a) kept in ohmic contact with the second semiconductor layer (30, 130) on one side of the strip-shaped region in the direction of the width thereof and connected directly to a control terminal (6, 106); a second control electrode (3b, 103b) kept in ohmic contact with the second semiconductor layer on the other side of the strip-shaped region in the direction of the width thereof and connected to the control terminal through the first control electrode and the resistance (R) of the second semiconductor layer between the first control electrode and the second control electrode; a second main electrode (4. 104) kept in ohmic contact with a second principal surface of the semiconductor substrate; and means provided in the semiconductor substrate for accelerating the spatial biasing of a conductive region to the other side of the strip-shaped region in the direction of the width thereof when a current flowing across the semiconductor substrate is cut off, thereby enlarging the area of safety operation.
摘要:
A constant-voltage diode has a first semiconductor region (14) of a first conductivity type, an adjoining semiconductor region (15) of a second conductivity type, a third semiconductor region (16) of the second conductivity type adjoining the second semiconductor region, and a fourth semiconductor region (17) of the first conductivity type partially surrounded by the second semiconductor region (15). At low reverse biases between a cathode electrode (2) and an anode electrode (3), the behavior of the device is determined by the pn junction (J₁) between the first and second semiconductor regions (14,15). As the reverse biasing increases, the depletion layers of that junction (J₁) will reach the fourth semiconductor region (17), but the reverse bias at this time is insufficient to break down that junction (J₁). Increase of reverse bias causes break down of the pn junction (J₃) between the third and fourth semiconductor regions (16,17). This effect is achieved by suitable impurity concentrations in the semiconductor regions (14,15,16,17). A plurality of fourth semiconductor regions (17) may be provided and a bidirectional structure can be obtained by providing a polarity reversed structure with the first semiconductor region (14) in common.
摘要:
A gate turn-off thyristor provided with a disc-shaped semiconductor substrate consisting of at least 4 layers of pnpn forming pn junctions between different layers adjacent to each other, in which the emitter layer (16) on the cathode side is divided into a plurality of elongated regions arranged in the radial direction and disposed in a plurality of rings, in which the base layer (14) on the anode side is formed so as to be connected partially with the anode electrode (2) disposed on the emitter layer on the anode side by a short-circuiting layer having the same conductivity type as the base layer and the short-circuiting layer described above has a coaxial circular pattern, characterized in that the short-circuiting layer described above is formed at least within the part, where the regions between different rings of the emitter layer on the cathode side are projected on the anode side.
摘要:
A gate turn-off thyristor provided with a disc-shaped semiconductor substrate consisting of at least 4 layers of pnpn forming pn junctions between different layers adjacent to each other, in which the emitter layer (16) on the cathode side is divided into a plurality of elongated regions arranged in the radial direction and disposed in a plurality of rings, in which the base layer (14) on the anode side is formed so as to be connected partially with the anode electrode (2) disposed on the emitter layer on the anode side by a short-circuiting layer having the same conductivity type as the base layer and the short-circuiting layer described above has a coaxial circular pattern, characterized in that the short-circuiting layer described above is formed at least within the part, where the regions between different rings of the emitter layer on the cathode side are projected on the anode side.
摘要:
A gate turn-off thyristor and a transistor are disclosed, each of which comprises: a semiconductor substrate (1,101) including at least three semiconductor layers between a pair of principal surfaces, adjacent ones of the semiconductor layers being different in conductivity type from each other, a first one of the semiconductor layers being formed of at least one strip-shaped region (20, 120) with a constant width, a second one (30, 130) of the semiconductor layers being exposed to a first principal surface of the semiconductor substrate together with the strip-shaped region; a first main electrode (2.102) kept in ohmic contact with the strip-shaped region at the first principal surface; a first control electrode (3a, 103a) kept in ohmic contact with the second semiconductor layer (30, 130) on one side of the strip-shaped region in the direction of the width thereof and connected directly to a control terminal (6, 106); a second control electrode (3b, 103b) kept in ohmic contact with the second semiconductor layer on the other side of the strip-shaped region in the direction of the width thereof and connected to the control terminal through the first control electrode and the resistance (R) of the second semiconductor layer between the first control electrode and the second control electrode; a second main electrode (4. 104) kept in ohmic contact with a second principal surface of the semiconductor substrate; and means provided in the semiconductor substrate for accelerating the spatial biasing of a conductive region to the other side of the strip-shaped region in the direction of the width thereof when a current flowing across the semiconductor substrate is cut off, thereby enlarging the area of safety operation.