摘要:
A thin film field effect transistor using a thin polycrystalline silicon film formed on an insulating substrate (11) is disclosed in which the thin polycrystalline silicon film is made up of a high-resistance polycrystalline silicon layer (12) disposed on the insulating substrate and a low-resistance polycrystalline silicon layer (13) formed on the high-resistance polycrystalline silicon layer (12) and source and drain electrodes (17a, 17b) are kept in ohmic contact with the low-resistance polycrystalline silicon layer (13).
摘要:
This invention relates to improvements in the SOS technology including the so-called laser annealing processing. According to this invention, the semiconductor layer (2) of an SOS structure (1, 2) consists of the three layers of an interface layer made up of twins, a seed crystalline layer and a re-grown layer far thicker than the preceding two layers when viewed from the side of an insulating substrate. The re-grown layer is formed in such a way that the semiconductor layer (2) deposited on the insulating substrate (1) is irradiated with an electromagnetic wave, for example, a pulsed ruby laser beam, which is absorbed substantially uniformly by a portion except the interface layer and the seed crystalline layer. According to this invention, the quality of the re-grown layer is improved, and the mobility of carriers is enhanced. As a result, the operating speed of a semiconductor device employing the SOS structure (1, 2) is raised, and the leakage current is reduced.
摘要:
When forming a large number of monocrystalline silicon regions on an insulator sheet, a large number of island regions of polycrystalline silicon are connected to one another in a predetermined direction by connecting regions, and are sequentially melted and regrown in that predetermined direction.
摘要:
This invention relates to improvements in the SOS technology including the so-called laser annealing processing. According to this invention, the semiconductor layer (2) of an SOS structure (1, 2) consists of the three layers of an interface layer made up of twins, a seed crystalline layer and a re-grown layer far thicker than the preceding two layers when viewed from the side of an insulating substrate. The re-grown layer is formed in such a way that the semiconductor layer (2) deposited on the insulating substrate (1) is irradiated with an electromagnetic wave, for example, a pulsed ruby laser beam, which is absorbed substantially uniformly by a portion except the interface layer and the seed crystalline layer. According to this invention, the quality of the re-grown layer is improved, and the mobility of carriers is enhanced. As a result, the operating speed of a semiconductor device employing the SOS structure (1, 2) is raised, and the leakage current is reduced.
摘要:
Complementary thin film transistors (C-TFT) formed on an insulating substrate, comprising a pair of highly resistive n-type silicon islands (2, 20), a pair of heavily doped n-type regions (12, 13) formed on one (2) of the islands to form source and drain regions of n-channel TFT, a pair of contacts (170, 180) formed on the surface of the other island (20) and establishing a high potential barrier when the underlying region is of n-type and a low potential barrier when the underlying region is inverted to be of p-type. The process for manufacturing complementary TFTs can be simplified significantly.
摘要:
This invention relates to the structure of a field effect transistor, which is suitable for liquid crystal display of active matrix scheme and there is disclosed a new structure for the field effect transistor, in which at least one of the source region (3) and the drain region (4) is of multi-layered structure, in which high impurity concentration portions (31, 33, 35; 41, 43, 45) and low impurity concentration portions (32, 34; 42, 44) are alternately superposed on each other.
摘要:
Complementary thin film transistors (C-TFT) formed on an insulating substrate, comprising a pair of highly resistive n-type silicon islands (2, 20), a pair of heavily doped n-type regions (12, 13) formed on one (2) of the islands to form source and drain regions of n-channel TFT, a pair of contacts (170, 180) formed on the surface of the other island (20) and establishing a high potential barrier when the underlying region is of n-type and a low potential barrier when the underlying region is inverted to be of p-type. The process for manufacturing complementary TFTs can be simplified significantly.