公开(公告)号：EP2759400A4

公开(公告)日：2015-06-03

申请号：EP12832888

申请日：2012-09-20

申请人： HITACHI CHEMICAL CO LTD

发明人： AOSHIMA MASAHIRO ,  TAKAHASHI YOSHIHIRO ,  YAMAZAKI YUKA ,  KAMIGATA YASUO ,  MURAI HIKARI

IPC分类号： B32B17/10 ,  B32B27/20 ,  H05K1/03 ,  H05K3/46

CPC分类号： B32B17/10697 ,  B32B7/06 ,  B32B17/10027 ,  B32B17/10614 ,  B32B17/10807 ,  H01L23/15 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/036 ,  H05K3/4605 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H01L2924/00

摘要： A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing a laminate plate containing at least one cured resin layer comprising a cured product of a resin composition containing a thermosetting resin and an inorganic filler, and at least one glass substrate layer, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate.

公开(公告)号：EP2518115A4

公开(公告)日：2014-04-16

申请号：EP10839568

申请日：2010-12-24

申请人： HITACHI CHEMICAL CO LTD

发明人： TAKAHASHI YOSHIHIRO ,  KAMIGATA YASUO ,  MURAI HIKARI ,  AOSHIMA MASAHIRO ,  TSUCHIKAWA SHINJI ,  MIYATAKE MASATO ,  KOTAKE TOMOHIKO ,  IZUMI HIROYUKI

IPC分类号： C08L101/00 ,  B32B15/08 ,  C08J5/24 ,  C08K3/00 ,  C08K3/24 ,  C08K5/3415 ,  C08K9/02 ,  C08L63/00 ,  H05K1/03

CPC分类号： C09D163/04 ,  B32B15/08 ,  B32B27/04 ,  B32B27/18 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08K3/013 ,  C08K3/22 ,  C08K3/34 ,  C08K3/36 ,  C08K5/3415 ,  C08K13/02 ,  C08K2003/2206 ,  C08K2003/2227 ,  C08K2003/2255 ,  C08K2003/2296 ,  C08L63/00 ,  C09D7/1216 ,  C09D7/1233 ,  C09D7/61 ,  C09D7/63 ,  C09D163/00 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/0047 ,  H05K2201/0129 ,  H05K2201/0209 ,  Y10T156/10 ,  Y10T428/31529 ,  Y10T428/31678

摘要： Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.