摘要:
Disclosed are a process for preparing a phosphor pattern for a field emission display panel which comprises the steps of: (I) forming (A) a photosensitive resin composition layer containing a phosphor on a substrate to which a conductive layer is formed; (II) irradiating active light to (A) the photosensitive resin composition layer containing a phosphor imagewisely; (III) selectively removing (A) the photosensitive resin composition layer to which active light has been imagewisely irradiated by development to form a pattern; and (IV) calcining the pattern to remove unnecessary portion to form a phosphor pattern, a photosensitive element for a FED display panel, phosphor pattern for a FED display panel, and a FED display panel.
摘要:
The composition for forming a composition for forming a p-type diffusion layer, the composition containing a glass powder and a dispersion medium, in which the glass powder includes an acceptor element and a total amount of a life time killer element in the glass powder is 1000 ppm or less. A p-type diffusion layer and a photovoltaic cell having a p-type diffusion layer are prepared by applying the composition for forming a p-type diffusion layer, followed by a thermal diffusion treatment.
摘要:
Disclosed are a phosphor pattern which comprises a substrate having unevenness and a phosphor layer formed on the inner surface of a concave portion of the substrate, wherein when the length from the bottom of the concave portion to the top of a convex portion is L (µm), the phosphor pattern thickness ratio (x)/(y) of the thickness (x) of the phosphor pattern formed on an uneven wall surface at a position of 0.9 x L from the bottom of the concave portion toward the top of the convex portion to the thickness (y) of the phosphor pattern formed on the uneven wall surface at a position of 0.4 x L from the bottom of the concave portion toward the top of the convex portion satisfies a range of 0.1 to 1.5, and processes for preparing the same.
摘要:
Disclosed are a process for preparing a phosphor pattern for a field emission display panel which comprises the steps of: (I) forming (A) a photosensitive resin composition layer containing a phosphor on a substrate to which a conductive layer is formed; (II) irradiating active light to (A) the photosensitive resin composition layer containing a phosphor imagewisely; (III) selectively removing (A) the photosensitive resin composition layer to which active light has been imagewisely irradiated by development to form a pattern; and (IV) calcining the pattern to remove unnecessary portion to form a phosphor pattern, a photosensitive element for a FED display panel, phosphor pattern for a FED display panel, and a FED display panel.
摘要:
The composition for forming an n-type diffusion layer in accordance with the present invention contains a donor element-containing glass powder and a dispersion medium. An n-type diffusion layer and a photovoltaic cell having an n-type diffusion layer are prepared by applying the composition for forming an n-type diffusion layer, followed by a thermal diffusion treatment.
摘要:
Disclosed are a process for preparing a phosphor pattern of the present invention comprises the steps of:
(I) forming a phosphor-containing photosensitive resin composition layer (A) on a substrate having unevenness, (II) irradiating a scattered light to the layer (A) imagewisely, (III) developing the layer (A) by removing the portion to which the scattered light is imagewisely irradiated to form a pattern, and (IV) calcinating the formed pattern to remove an unnecessary portion from the pattern formed in the step (III) to form a phosphor pattern, a phosphor pattern produced by the above process and a back plate for the plasma display panel provided with the phosphor pattern on a substrate for a plasma display panel.
摘要:
Disclosed is a process for preparing a printed circuit board, which comprises the steps of: (1) forming, on the surface of an insulating substrate on a necessitate portion of which electrolessly plated copper is to be precipitated, a layer of a light-sensitive resin composition comprising (a) 40 to 80 parts by weight of a vinyl-polymerized high molecular weight binder having an acid value of 10 to 46 mgKOH/g, (b) 20 to 60 parts by weight of a compound having at least two polymerizable unsaturated double bonds in a molecule, with the total amount of Components (a) and (b) being 100 parts by weight, and (c) a photopolymerization initiator generating free radicals by irradiation of active light in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of Components (a) and (b); (2) forming a negative pattern of the light-sensitive resin composition on the surface of the substrate by irradiating active light imagewisely and developing with a semi-aqueous developing solution; and (3) forming a circuit pattern by electroless copper plating by using the negative pattern of the light-sensitive resin composition on the surface of the substrate as a plating resist.