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公开(公告)号：EP4369872A1
公开(公告)日：2024-05-15
申请号：EP22206693.8
申请日：2022-11-10
Applicant: HS Elektronik Systeme GmbH
Inventor： GROSS, David , SCHREITMÜLLER, Stefan , MÜLLER, Tobias , WÜNSCH, Alois , EIGNER, Robert , GIETZOLD, Thomas
IPC: H05K1/02
CPC classification number: H05K1/0209 , H05K1/0263 , H05K2201/1016620130101 , H05K2201/06620130101 , H05K2201/1027220130101 , H05K2201/105620130101 , H05K2201/1041620130101 , H05K2201/1096920130101
Abstract: A solid state power switch assembly (4) of an aircraft solid state power controller (2) comprises a circuit board (6), in particular a printed circuit board (6), at least one solid state power switch (8), and a busbar (18). The at least one solid state power switch (8) has a first side and an opposing second side. A power switch electric contact surface (10) is formed on the first side and the at least one solid state power switch (8) is arranged on the circuit board (6) with the second side facing the circuit board (6) and the first side facing away from the circuit board (6). The busbar (18) comprises at least one busbar contact portion (24) configured for electrically contacting the power switch electric contact surface (10) and at least one busbar mounting portion (20a, 20b), which is configured for be mounted to the circuit board (6), so that the at least one solid state power switch (8) is sandwiched between the at least one busbar contact portion (24) and the circuit board (6).
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公开(公告)号：EP4369873A1
公开(公告)日：2024-05-15
申请号：EP22206736.5
申请日：2022-11-10
Applicant: HS Elektronik Systeme GmbH
Inventor： MAIER, Josef , GIETZOLD, Thomas
CPC classification number: H05K1/117 , H05K1/144 , H05K1/0284 , H05K3/284 , H05K3/365 , H05K3/368 , H05K2201/04120130101 , H05K2201/20920130101 , H05K2201/0903620130101 , H05K2201/0904520130101 , H05K2203/132720130101
Abstract: The present disclosure relates to a printed circuit board assembly (10) for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board (14) having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components (32, 34) mounted thereon. An insulating potting (16a, 16b) covers the plurality of heat generating electronic circuit components (32, 34) on the at least one of the top side and the bottom side, the insulating potting (16a, 16b) comprising an insulating potting body (38) covering the plurality of heat generating electronic circuit components (32, 34) in a contiguous manner. The printed circuit board (14) is configured to form a male part of a card edge connector in at least one peripheral region (18) thereof. The present disclosure also relates to a method of manufacturing such a printed board assembly (10) using a dam-and-fill technique.
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公开(公告)号：EP4369876A1
公开(公告)日：2024-05-15
申请号：EP22206733.2
申请日：2022-11-10
Applicant: HS Elektronik Systeme GmbH
Inventor： MAIER, Josef , GIETZOLD, Thomas
CPC classification number: H05K3/284 , H05K1/0209 , H05K1/117 , H05K1/144 , H05K2201/0990920130101 , H05K2203/147620130101 , H05K2201/04120130101
Abstract: The present disclosure relates to a printed circuit board assembly (10) for an aircraft solid state power controller (SSPC), comprising at least one printed circuit board (14) having a top side and a bottom side. At least one of the top side and the bottom side has a surface layer made from an electrically conductive material and has a plurality of heat generating electronic circuit components (32, 34) mounted thereon. An insulating potting (16a, 16b) covers the plurality of heat generating electronic circuit components (32, 34) on the at least one of the top side and the bottom side, the insulating potting (16a, 16b) comprising an insulating potting body (38) covering the plurality of heat generating electronic circuit (32, 34) components in a contiguous manner. The present disclosure also relates to a method of manufacturing such a printed circuit board assembly (10), particularly using a dam-and-fill technique.
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公开(公告)号：EP4362256A1
公开(公告)日：2024-05-01
申请号：EP22204393.7
申请日：2022-10-28
Applicant: HS Elektronik Systeme GmbH
Inventor： GIETZOLD, Thomas , KLUGER, Gerd , GREITHER, Markus , SWENSON, Joshua C. , YANG, Nhia , COONEY, Robert C. , BELISLE, Francis , SHEPARD, Charles
CPC classification number: H02H5/041 , H02H7/008 , H03K2017/080620130101 , H03K17/0822 , H03K2217/002720130101
Abstract: A method of monitoring the temperature of a solid state switch (4) in an aircraft solid state power controller (2), comprises the steps of: measuring an electric current (I) flowing through the solid state switch (4); calculating, based on the measured electric current (I), an introduced electric power (Pel) that is introduced into the solid state switch (4) within the predefined time period (Δt); calculating an increase in temperature (ΔT) of the solid state switch (4) that is caused by the introduced electric power (Pel); calculating an actual temperature (Tact) of the solid state switch (4) by adding the calculated increase in temperature (ΔT) to an ambient temperature (Tamb); and comparing the calculated actual temperature (Tact) with a predefined temperature threshold (Tth) and determining an overheat condition if the calculated actual temperature (Tact) exceeds the predefined temperature threshold (Tth).
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