公开(公告)号：EP3329749B1

公开(公告)日：2024-05-15

申请号：EP16770968.2

申请日：2016-07-27

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC classification number: H05K1/0209 ,  H05K1/056 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/368 ,  H05K2201/04220130101 ,  H05K2201/06620130101 ,  H05K2201/1040920130101 ,  H05K2201/1059820130101 ,  H05K2201/203620130101 ,  H05K1/0204

公开(公告)号：EP3589455B1

公开(公告)日：2024-05-08

申请号：EP17854187.6

申请日：2017-02-28

IPC: H05K7/20 ,  B25F5/00 ,  H05K1/02

CPC classification number: B25F5/008 ,  H05K7/20445 ,  H05K1/0209 ,  H05K2201/06620130101 ,  H05K7/20909

公开(公告)号：EP4404695A1

公开(公告)日：2024-07-24

申请号：EP24153245.6

申请日：2024-01-22

Applicant: Infineon Technologies Austria AG

Inventor： KSHIRSAGAR, Kushal ,  CHO, Eung San ,  PELUSO, Luca ,  CLAVETTE, Danny ,  KESSLER, Angela

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H01F27/29

CPC classification number: H05K1/0203 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0233 ,  H05K1/0262 ,  H05K1/181 ,  H05K3/301 ,  H01F27/24 ,  H01F27/28 ,  H01F17/04 ,  H02M3/003 ,  H01F27/292 ,  H01F17/06 ,  H01F27/2847 ,  H01F2017/06720130101 ,  H05K2201/1096920130101 ,  H05K2201/06620130101 ,  H05K2201/08620130101 ,  H05K2201/100320130101 ,  H05K2201/105620130101 ,  H05K2201/1060620130101

Abstract: An apparatus and method as discussed herein includes a heat sink element fabricated from electrically conductive material. A first element of electrically conductive material may be fixedly connected to the heat sink element. A second element of electrically conductive material may be fixedly connected to the heat sink element. The first element and the second element may extend substantially orthogonal from a surface of the heat sink element.

公开(公告)号：EP4402993A1

公开(公告)日：2024-07-24

申请号：EP22785989.9

申请日：2022-09-14

Applicant: TDK EUROPE GMBH

Inventor： NISHIZAWA, Shinichiro

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H05K1/18 ,  H05K2201/1037820130101 ,  H05K2201/1001520130101 ,  H05K2201/1065120130101 ,  H05K1/0207 ,  H05K2201/06620130101 ,  H05K2201/0978120130101 ,  H05K1/116 ,  H05K2201/0977220130101 ,  H05K3/3447

公开(公告)号：EP4412405A1

公开(公告)日：2024-08-07

申请号：EP23215109.2

申请日：2023-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： KO, Byunghan ,  KONG, Doil ,  ZHAO, Hu

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/433 ,  H05K1/18 ,  H05K3/34 ,  H05K7/20 ,  H01L23/373

CPC classification number: H05K2201/1015920130101 ,  H05K2201/1073420130101 ,  H05K2201/1054520130101 ,  H05K3/3415 ,  H05K1/181 ,  H05K2201/1020420130101 ,  H05K1/0209 ,  H05K2201/06620130101 ,  H05K2201/1096920130101 ,  H05K2201/203620130101 ,  H05K1/0206 ,  H01L23/3736 ,  H01L23/367 ,  H05K2203/157220130101 ,  H01L23/42 ,  H01L25/18 ,  H01L25/105

Abstract: The present disclosure provides semiconductor assemblies including dummy packages. In some embodiments, the semiconductor assembly includes a solid-state drive (SSD) device including a printed circuit board (20) including a memory region, a plurality of memory packages (200) disposed on the memory region, and at least one dummy package (100) disposed on the memory region. The at least one dummy package (100) is electrically coupled with the printed circuit board (20). The at least one dummy package (100) includes a first pad (150) constituting a heat path through which heat of the printed circuit board (20) is dissipated.

公开(公告)号：EP4369872A1

公开(公告)日：2024-05-15

申请号：EP22206693.8

申请日：2022-11-10

Applicant: HS Elektronik Systeme GmbH

Inventor： GROSS, David ,  SCHREITMÜLLER, Stefan ,  MÜLLER, Tobias ,  WÜNSCH, Alois ,  EIGNER, Robert ,  GIETZOLD, Thomas

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K1/0263 ,  H05K2201/1016620130101 ,  H05K2201/06620130101 ,  H05K2201/1027220130101 ,  H05K2201/105620130101 ,  H05K2201/1041620130101 ,  H05K2201/1096920130101

Abstract: A solid state power switch assembly (4) of an aircraft solid state power controller (2) comprises a circuit board (6), in particular a printed circuit board (6), at least one solid state power switch (8), and a busbar (18). The at least one solid state power switch (8) has a first side and an opposing second side. A power switch electric contact surface (10) is formed on the first side and the at least one solid state power switch (8) is arranged on the circuit board (6) with the second side facing the circuit board (6) and the first side facing away from the circuit board (6). The busbar (18) comprises at least one busbar contact portion (24) configured for electrically contacting the power switch electric contact surface (10) and at least one busbar mounting portion (20a, 20b), which is configured for be mounted to the circuit board (6), so that the at least one solid state power switch (8) is sandwiched between the at least one busbar contact portion (24) and the circuit board (6).