公开(公告)号：EP2694611A1

公开(公告)日：2014-02-12

申请号：EP11862911.2

申请日：2011-04-25

申请人： Henkel Corporation

发明人： WANG, Eric, C. ,  BECKER, Kevin, Harris ,  ZHUO, Qizhuo

IPC分类号： C09J163/00 ,  C09J121/00 ,  C09J11/04 ,  C09J4/02

CPC分类号： C09J163/04 ,  C08G59/08 ,  C08G59/34 ,  C08G59/68 ,  C09J4/06 ,  C09J121/00 ,  C09J163/10

摘要： This invention is an adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler. The composition is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer (an elastomer having carbon to carbon unsaturation) and an epoxy elastomer, present in an amount within the range of 20% to 40% by weight, and preferably about 30% by weight of the adhesive composition. The epoxy resin is present in the adhesive composition in the range of 3% to 10% by weight, and preferably about 5% by weight. The reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation to react with the acrylate elastomer, providing cross-linking within the composition after cure. One or both must be able to act as a diluent or solvent for the elastomeric polymer, and together are present in the adhesive composition within the range of 35% to 50% by weight of the composition. The filler is a non-conductive filler and makes up the remainder of the composition to a total of 100% by weight.

公开(公告)号：EP2655536A2

公开(公告)日：2013-10-30

申请号：EP11850894.4

申请日：2011-12-16

申请人： Henkel Corporation

发明人： LEE, Byoungchul ,  CHIANG, Pauline ,  BECKER, Kevin, Harris

IPC分类号： C09J175/04 ,  C09J183/02 ,  C09J7/02 ,  H01L21/60

CPC分类号： C09J183/04 ,  C08G18/6225 ,  C08G18/755 ,  C08G18/8116 ,  C08G77/20 ,  C08G2170/40 ,  C08L83/00 ,  C09J133/08 ,  C09J175/04 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/10253 ,  H01L2924/10329 ,  C08F2220/1825 ,  C08F2220/1858 ,  C08F220/20 ,  C08F220/24 ,  C08F220/06

摘要： A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.