公开(公告)号：EP3362530A1

公开(公告)日：2018-08-22

申请号：EP16856271.8

申请日：2016-10-14

申请人： Henkel IP & Holding GmbH

发明人： RUATTA, Stephen A. ,  CARSON, George ,  YAO, Li

IPC分类号： C09J7/02 ,  C09J9/02 ,  C08K3/08 ,  C08K5/00 ,  H01B1/22

CPC分类号： C09J9/02 ,  C08K3/08 ,  C08K3/11 ,  C08K5/00 ,  C08K9/04 ,  C08K2003/0806 ,  C08K2003/0843 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C08L33/04 ,  C08L63/00 ,  C09D11/52 ,  C09J4/00 ,  C09J11/04 ,  C09J133/04 ,  C09J133/10 ,  C09J163/00 ,  C09J163/04 ,  C09J179/04 ,  C09J179/085 ,  H01B1/22 ,  H01L24/00 ,  C08F220/18

摘要： In accordance with the present invention, there are provided novel conductive adhesives and methods for the preparation thereof. In another aspect, the present invention provides novel conductive inks and methods for the preparation thereof. In yet another aspect, the present invention provides novel die attach films and methods for the preparation thereof. In still another aspect, the present invention provides novel die attach pastes and methods for the preparation thereof.