摘要:
A field emission device 100, includes an emitter electrode 112, an extractor electrode 120, and a solid-state field controlled emitter that utilizes a Schottky metal-semiconductor junction or barrier (114, 116), which is formed on the emitter electrode 112 and electrically couples with the extractor electrode 120 such that when an electric potential is placed between the emitter electrode 112 and the extractor electrode 120, a field emission of electrons is generated from an exposed surface of the semiconductor layer 116. Schottky metal 114 may be selected from conducting layers such as platinum, gold, silver, or a conductive semiconductor layer that is able to provide a high electron pool at the barrier. The semiconductor layer 116 placed on the Schottky metal is very weakly conductive of n-type and has a wide band gap in order to create conditions conducive to creating induced negative electron affinity at applied fields necessary to provide electron emission. One type of wide band-gap material can be selected from titanium dioxide or titanium nitride.
摘要:
A self-aligned electron device (10) includes emitter (13), extraction electrode (17), and focus electrode (21) separated by dielectric layers, (11, 15, 19). A single cavity (23) extending through the electrodes and the dielectric layers and terminating at the emitter electrode (13) is formed by a single photolithography step and an etching process. A composite emitter (1) including a base (3) disposed on the emitter electrode (13) and a conical tip (5) disposed on the base (3) and terminating at a vertex V is formed in the cavity (23). The base (3) can be made from materials including titanium, chromium, or doped silicon. The tip (5) can be made from a wide variety of materials including a refractory metal, a metal alloy, a silicon alloy, a carbide, a nitride, or an electroformable metal. The cavity (23) and the composite emitter (1) are self-aligned relative to each other. The dielectric layers can be etched back to reduce or eliminate charge accumulation on cavity-facing portions (43, 45) of the dielectric layers. A composite layer including a dielectric and mechanical strength enhancement layer (15a, 19a) of silicon nitride or silicon carbide and a pull-back layer (15b, 19b) of silicon oxide on top of the etch stop layer can be used to form the dielectric layers.
摘要:
When doing multitrack seek or a single track jump, the midpoint between the maximum and the minimum of the tracking error signal is determined. A peak detector (31) detects the positive peak and the negative peak. These maximum and minimum values are stored in a sample and hold circuit (32). A summing circuit (33) determines the midpoint between the maximum and the minimum of the tracking error signal. An operational amplifier (35) provides a true error signal to the servo control system (14) that provides the appropriate servo operating point. The invention is based on the fact that even though there is no absolute reference signal indicating the appropriate on-track position, the tracking servo system (14) obtains the track error signal over the whole range of positions relative to track center when doing a multitrack seek or a single track jump. The appropriate servo operating point is the midpoint between the maximum and the minimum of the track error signal. This provides compensation for level shifts due to factors such as beam displacement, or detector mispositioning, changes in read/write beam profile, and disk tilt. The present invention solves the key disadvantage of the continuous groove tracking method by eliminating tracking offsets without adding additional information to the disk. It also avoids imposing overhead on the data channel. It compensates for effects of disk tilt, detector misalignment, detector and amplifier offsets, and beam decentration due to fine tracking.
摘要:
The present disclosure relates to a data storage device (100), comprising an electron emitter (108) adapted to generate electron beam current and emit electron beams, the electron emitter having a planar emission surface (718), and a storage medium (110) in proximity to the electron emitter, the storage medium having a storage area (400) that is capable of at least two distinct states that represent data, the state of the storage area being changeable in response to bombardment by an electron beam emitted by the electron emitter.
摘要:
A field emission planar electron emitter device 100 has an emitter electrode 112, an extractor electrode 120, and a planar emitter emission layer 214, electrically coupled to the emitter electrode 112 and the extractor electrode 120. The planar electron emitter 214 is configured to bias electron emission in a central region of the emission layer in preference to an outer region thereof. This biasing is achieved by fabricating the planar emitter emission layer so that it has an outer perimeter 216a that is thicker in depth than at an interior portion 216b of the planar emitter emission layer, which reduces electron beam emission at the outer perimeter when an electric field is applied between the emitter electrode 112 and the extractor electrode 120. The electric field draws emission electrons from the surface of the planar emitter emission layer 216 towards the extractor electrode 120 at a higher rate at the interior portion than at the outer perimeter. The planar electron emitter device 100 further includes a focusing electrode 124 electrically coupled to the planar electron emitter 216.
摘要:
The present disclosure relates to a data storage device (100), comprising an electron emitter (108) adapted to generate electron beam current and emit electron beams, the electron emitter having a planar emission surface (718), and a storage medium (110) in proximity to the electron emitter, the storage medium having a storage area (400) that is capable of at least two distinct states that represent data, the state of the storage area being changeable in response to bombardment by an electron beam emitted by the electron emitter.
摘要:
A self-aligned electron device (10) includes emitter (13), extraction electrode (17), and focus electrode (21) separated by dielectric layers, (11, 15, 19). A single cavity (23) extending through the electrodes and the dielectric layers and terminating at the emitter electrode (13) is formed by a single photolithography step and an etching process. A composite emitter (1) including a base (3) disposed on the emitter electrode (13) and a conical tip (5) disposed on the base (3) and terminating at a vertex V is formed in the cavity (23). The base (3) can be made from materials including titanium, chromium, or doped silicon. The tip (5) can be made from a wide variety of materials including a refractory metal, a metal alloy, a silicon alloy, a carbide, a nitride, or an electroformable metal. The cavity (23) and the composite emitter (1) are self-aligned relative to each other. The dielectric layers can be etched back to reduce or eliminate charge accumulation on cavity-facing portions (43, 45) of the dielectric layers. A composite layer including a dielectric and mechanical strength enhancement layer (15a, 19a) of silicon nitride or silicon carbide and a pull-back layer (15b, 19b) of silicon oxide on top of the etch stop layer can be used to form the dielectric layers.
摘要:
A cold electron emitter (200, 200-1, 200-2) may include a heavily a p-doped semiconductor (230), and dielectric layer (245) , and a metallic layer (240) (p-D-M structure). A modification of this structure includes a heavily n+ doped region (220) below the p region (230) (n+-p-D-M structure). These structures make it possible to combine high current emission with stable (durable) operation. The high current density is possible since under certain voltage drop across the dielectric layer (245) , effective negative electron affinity is realized for the quasi-equilibrium "cold" electrons accumulated in the depletion layer in the p-region (230) next to the dielectric layer (245). These electrons are generated as a result of the avalanche in the p-D-M structure or injection processes in the n+-p-D-M structure. These emitters are stable since they make use of relatively low extracting field in the vacuum region and are not affected by contamination and absorption from accelerated ions. In addition, the structures may be fabricated with current state-of-the-art technology.
摘要:
In an electron emitter (100, 200, 300) based on Metal-Insulator-Semiconductor or Metal-Insulator-Metal emitters, field emission structures are enclosed within the emitter structure. The electron emitter may include a conductive substrate (110, 210, 310) and an electron supply layer (120, 220, 320) formed on the conductive substrate (110, 210, 310). The electron supply layer (120, 220, 320), for example undoped polysilicon, has protrusions (130, 230, 330) formed on its surface. The sharpness and density of protrusions (130, 230, 330) may be controlled. Above the electron supply layer (120, 220, 320) and the protrusions, an insulator (140, 240, 340) may be formed thereby enclosing the protrusions (130, 230, 330). A top conductive layer (150, 250, 350) may be formed above the insulator (140, 240, 340). The enclosed protrusions (130, 230, 330) are relatively insensitive to vacuum contamination. The thinness of the insulator (140, 240, 340) allows high intensity electric fields at the protrusions (130, 230, 330) to be generated with low applied voltage. Field-enhanced injection of electrons into the insulator (140, 240, 340) and thence through the top conductive layer (150, 250, 350) results. Furthermore, electron beam dispersion and divergence are minimized.
摘要:
A cold electron emitter (200, 200-1, 200-2, 200-3, 200-12, 200-13) may include a heavily n+ doped wide band gap (WBG) (220), a p-doped WBG region (230), and a low work function metallic layer (n + -p-M structure) (240). A modification of this structure includes heavily p+ doped (235) region between p region (230) and M metallic layer (n + -p-p+-M structure) (240). These structures make it possible to combine high current emission with stable (durable) operation. The high current density is possible because the p-doped (230) or p+ heavily doped (235) WBG region acts as a negative electron affinity material when in contact with low work function metals. The injection emitters with the n + -p-M and n + -p-p+-M structures are stable since the emitters make use of relatively low extracting electric field and arc not affected by contamination and/or absorption from accelerated ions. In addition, the structures may be fabricated with current state-of-the-art technology.