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    Electron source
    1.
    发明公开
    Electron source 审中-公开
    Elektronenquelle

    公开(公告)号：EP1237174A1

    公开(公告)日：2002-09-04

    申请号：EP02251172.9

    申请日：2002-02-20

    申请人： Hewlett-Packard Company

    发明人： Kuo, Huei-Pei ,  Birecki, Henryk ,  Lam, Si-Ty ,  Naberhuis, Steven Louis

    IPC分类号： H01J3/02 ,  H01J1/304 ,  H01J29/48 ,  G11B9/10

    CPC分类号： B82Y10/00 ,  G11B9/10 ,  G11B9/1409 ,  H01J3/02 ,  H01J2201/308

    摘要： A semi-conductor electron source (102) includes a planar emission region (114) for generating an electron emission, and a focusing structure (118, 120) for focusing the electron emission into an electron beam. The emission region (114) may be a porous region located in a layer on an active substrate (104). The focusing structure may include an aperture (122) through which electron emission is focused.

    摘要翻译： 半导体电子源（102）包括用于产生电子发射的平面发射区（114）和用于将电子发射聚焦成电子束的聚焦结构（118,120）。 发射区域（114）可以是位于有源衬底（104）上的层中的多孔区域。 聚焦结构可以包括电子发射聚焦的孔径（122）。

    Method and apparatus for ink transfer printing
    4.
    发明公开
    Method and apparatus for ink transfer printing 失效
    墨水印刷的方法和装置。

    公开(公告)号：EP0600712A3

    公开(公告)日：1994-09-07

    申请号：EP93309555.6

    申请日：1993-11-30

    申请人： Hewlett-Packard Company

    发明人： Lam, Si-Ty ,  You, Young-Soo ,  Lin, An-Chung R.

    IPC分类号： B41J2/005

    CPC分类号： B41J2/0057 ,  B41J2/005

    摘要： An ink transfer printing devide in which ink transfer is controlled by a viscosity change in ink includes an ink reservoir (2) for retaining ink held under pressure. The ink reservoir (2) is associated with an ink transfer surface (4) which has a plurality of perforations (6). Under ambient conditions, the viscosity of the ink prevents flow of the ink through the perforations (6). The ink transfer printing device also includes a viscosity control unit (8, 20, 25, 26, 32, 38, 42, 46) for inducing a change in the viscosity of the ink near certain perforations thereby enabling a controlled amount of the ink near each of these certain perforations (6) to flow through these certain perforations to an outer surface of the ink transfer surface (4). Techniques for controlling the ink dot size using concentric regions (72, 74, 76, 78, 80, 82) about each of the perforations (6) are disclosed. The ink which has flowed onto the outer surface can then be transferred to an intermediate surface (54) or a printing media (10). A method for viscosity-driven ink transfer printing is also disclosed. The present invention enables a printer, a copier, or the like to provide low cost, high speed, high resolution printed images.

    摘要翻译： 通过油墨粘度变化来控制油墨转印的油墨转移印刷装置包括用于保持在压力下保持的油墨的油墨储存器（2）。 墨水储存器（2）与具有多个穿孔（6）的墨水转印表面（4）相关联。 在环境条件下，油墨的粘度防止油墨通过穿孔（6）流动。 油墨转移印刷装置还包括一个粘度控制单元（8,20,25,26,32,38,42,46），用于引导某些穿孔附近油墨的粘度变化，从而使受控量的油墨接近 这些某些穿孔（6）中的每一个穿过这些某些穿孔至油墨转移表面（4）的外表面。 公开了用于使用围绕每个穿孔（6）的同心区域（72,74,76,78,80,82）来控制墨点尺寸的技术。 流过外表面的油墨可以转移到中间表面（54）或打印介质（10）。 还公开了一种用于粘度驱动的墨水转印印刷的方法。 本发明使打印机，复印机等能够提供低成本，高速度，高分辨率的打印图像。

    Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby
    6.
    发明公开
    Process for manufacturing thermal ink jet printheads having metal substrates and printheads manufactured thereby 失效
    一种用于与金属基材产生热驱动喷墨打印头，且根据此方法的方法，打印头制造。

    公开(公告)号：EP0514706A2

    公开(公告)日：1992-11-25

    申请号：EP92107510.7

    申请日：1992-05-04

    申请人： Hewlett-Packard Company

    发明人： Lam, Si-Ty ,  Taub, Howard H.

    IPC分类号： B41J2/16 ,  H01L49/02

    CPC分类号： B41J2/1631 ,  B41J2/1603 ,  B41J2/1625 ,  B41J2/1626 ,  B41J2/1643 ,  C25D1/08 ,  Y10T29/49401

    摘要： A method of manufacturing a thermal ink jet printhead wherein a reusable mandrel (Figure 5) consisting of either a metal pattern on an insulating or semiconductive substrate or an insulating pattern on a metal substrate or metal layer is used in the process of electroforming a plurality of metal substrates (12) used for starting a batch fabrication process. Next, thin film layers of insulating, resistive, and conductive materials (14, 15, 18) are formed on the surfaces of the metal substrates (12) to thereby define heater resistors (16) and lead-in conductors for the plurality of thermal ink jet printheads being formed. Then, a barrier layer (20) such as Vacrel is photodefined on the surface of the thin film insulating, resistive, and conductive layers (14, 15, 18) to thereby define a plurality of ink drop ejection chambers (24) surrounding each of the previously formed heater resistors (16). Next, a plurality of orifice plates (22) are secured, respectively, to the barrier layers (20) in each of the printheads being formed. Finally, the plurality of metal substrates (12) may be removed from the mandrel, such as by stripping away, without the requirement for substrate dicing, and an appropriate mask on the mandrel may be used to create an ink feed hole (30) in each of the metal substrates. The metal substrates (12) are further provided with a break tab line (32) during the electroforming process which is aligned with break patterns in both the above thin film layers (14, 15, 18) and orifice plates (22). In this manner, the individual thin film printheads may be easily broken away and separated one from another.

    摘要翻译： 一种制造热喷墨打印头可重复使用worin心轴（图5）任一的金属图案的上绝缘的或半导电衬底或金属衬底或金属层上的绝缘图案组成的方法在电铸中的多个方法用于 金属衬底（12）用于启动分批制造工艺。 接着，绝缘层，电阻和导电材料（14，15，18）的薄膜层被形成在金属衬底（12）的表面上，从而限定的加热电阻（16）和铅 - 在导体对热的多元 喷墨打印头而形成。 然后，阻挡层（20）：如Vacrel被光薄膜绝缘层，电阻，和导电层的表面上的（14，15，18），以由此限定的墨水滴喷射室包围每个的多个（24） 先前所形成的加热电阻（16）。 接着，孔板（22）多个固定，分别在各打印头的阻挡层（20）形成。 最后，金属衬底（12）多个可从心轴，：如通过剥离掉，而无需用于基材切割的要求被移除，并且在所述心轴上的适当掩模可以被用于创建到供墨孔（30） 每个金属基板。 在金属基板（12）设置有在电铸过程中断此外耳线（32）的所有其与破图案在上述两个薄膜层（14，15，18）和孔板（22）对准。 以这种方式，单独的薄膜打印头可以容易地剖开并彼此分隔开。

    Manufacturing process for three dimensional nozzle orifice plates
    9.
    发明公开
    Manufacturing process for three dimensional nozzle orifice plates 失效
    HerstellungsverfahrenfürdreidimensionaleDüsenplatten。

    公开(公告)号：EP0489246A2

    公开(公告)日：1992-06-10

    申请号：EP91117736.8

    申请日：1991-10-17

    申请人： Hewlett-Packard Company

    发明人： Lam, Si-Ty

    IPC分类号： C25D1/08 ,  B41J2/16

    CPC分类号： B41J2/1623 ,  B33Y10/00 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1642 ,  B41J2/1643 ,  C25D1/08

    摘要： A process of forming a mandrel (1, 2, 4, 5; 7, 8, 9, 11, 12) for manufacturing inkjet orifice plates (6, 13) and the like includes the steps of providing an electrically-conductive layer (2, 8) on a substrate (1, 7), providing a pattern of electrically conductive surfaces (4a, 11a) on the conductive layer (2, 8), and surface treating the pattern of conductive surfaces (4a, 11a) to reduce adhesion of a subsequently applied electroplated film (6, 13) to the pattern of conductive surfaces (4a, 11a). The mandrel (1, 2, 4, 5; 7, 8, 9, 11, 12) includes a substrate (1, 7), a pattern of electrically conductive surfaces (4a, 11a) on the substrate (1, 7) and an oxide layer (5, 12) on the pattern of conductive surfaces (4a, 11a) for reducing adhesion of an electroplated film (6, 13) to the pattern of conductive surfaces (4a, 11a). The pattern of conductive surfaces (4a, 11a) can be an electro-deposited layer of nickel, and the release means (5, 12) can be a nickel oxide and/or nickel hydroxide film on the layer of nickel.

    摘要翻译： 形成用于制造喷墨孔板（6,13）等的心轴（1,2,4,5,7,8,9,11,12）的方法包括以下步骤：提供导电层（2 ，8）放置在基板（1,7）上，在导电层（2,8）上提供导电表面（4a，11a）的图案，并且对导电表面（4a，11a）的图案进行表面处理以减少粘附 随后施加的电镀膜（6,13）到导电表面（4a，11a）的图案。 心轴（1,2,4,5,7,8,9,11,12）包括衬底（1,7），衬底（1,7）上的导电表面（4a，11a）的图案和 在导电表面（4a，11a）的图案上的氧化物层（5,12），用于减少电镀膜（6,13）与导电表面（4a，11a）的图案的粘附。 导电表面（4a，11a）的图案可以是镍的电沉积层，并且释放装置（5,12）可以是镍层上的氧化镍和/或氢氧化镍膜。

    Electron source device
    10.
    发明公开
    Electron source device 审中-公开
    电子源器件

    公开(公告)号：EP1174899A2

    公开(公告)日：2002-01-23

    申请号：EP01306009.0

    申请日：2001-07-12

    申请人： Hewlett-Packard Company

    发明人： Lam, Si-Ty ,  Birecki, Henryk ,  Kuo, Huei-Pei ,  Naberhuis, Steven L.

    IPC分类号： H01J3/02

    CPC分类号： H01J3/022

    摘要： A self-aligned electron device (10) includes emitter (13), extraction electrode (17), and focus electrode (21) separated by dielectric layers, (11, 15, 19). A single cavity (23) extending through the electrodes and the dielectric layers and terminating at the emitter electrode (13) is formed by a single photolithography step and an etching process. A composite emitter (1) including a base (3) disposed on the emitter electrode (13) and a conical tip (5) disposed on the base (3) and terminating at a vertex V is formed in the cavity (23). The base (3) can be made from materials including titanium, chromium, or doped silicon. The tip (5) can be made from a wide variety of materials including a refractory metal, a metal alloy, a silicon alloy, a carbide, a nitride, or an electroformable metal. The cavity (23) and the composite emitter (1) are self-aligned relative to each other. The dielectric layers can be etched back to reduce or eliminate charge accumulation on cavity-facing portions (43, 45) of the dielectric layers. A composite layer including a dielectric and mechanical strength enhancement layer (15a, 19a) of silicon nitride or silicon carbide and a pull-back layer (15b, 19b) of silicon oxide on top of the etch stop layer can be used to form the dielectric layers.

    摘要翻译： 自对准电子器件（10）包括由电介质层（11,15,19）分开的发射极（13），引出电极（17）和聚焦电极（21）。 延伸穿过电极和电介质层并终止于发射电极（13）的单个腔（23）通过单个光刻步骤和蚀刻工艺形成。 包括设置在发射极电极（13）上的基座（3）和设置在基座（3）上并终止于顶点V的圆锥形尖端（5）的复合发射极（1）形成在腔体（23）中。 基座（3）可以由包括钛，铬或掺杂硅的材料制成。 尖端（5）可以由多种材料制成，包括难熔金属，金属合金，硅合金，碳化物，氮化物或可电铸金属。 腔体（23）和复合发射体（1）相对于彼此自对准。 电介质层可以被回蚀以减少或消除电介质层的面向空腔的部分（43,45）上的电荷累积。 包括氮化硅或碳化硅的介电和机械强度增强层（15a，19a）以及在该蚀刻停止层的顶部上的氧化硅的拉回层（15b，19b）的复合层可用于形成介电层 层。