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公开(公告)号：EP1505645A3
公开(公告)日：2009-01-14
申请号：EP04018879.9
申请日：2004-08-09
申请人： Hitachi, Ltd.
IPC分类号： H01L23/495 , H01L23/31 , H01L23/14 , H01L23/373
CPC分类号： H01L23/4951 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/165 , H01L25/18 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2224/85099 , H01L2224/85205 , H01L2224/85399 , H01L2924/01012 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K3/386 , H05K2201/0209 , H05K2203/0315 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole mulit-layer circuit board (1) which connects a semiconductor operating element (7), semiconductor memory elements (8), and passive elements (9-12) thereon and part of a supporting material (3) on which said multi-layer circuit board is placed into a single package (4) by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material (2,21) made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.
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2.发明公开
公开(公告)号：EP1505645A2
公开(公告)日：2005-02-09
申请号：EP04018879.9
申请日：2004-08-09
申请人： Hitachi, Ltd.
IPC分类号： H01L23/495 , H01L23/31
CPC分类号： H01L23/4951 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/165 , H01L25/18 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2224/85099 , H01L2224/85205 , H01L2224/85399 , H01L2924/01012 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K3/386 , H05K2201/0209 , H05K2203/0315 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： In order to provide a low-cost and high heat-radiating electronic circuit device featuring high compactness, little warpage, high air tightness, high moldability, high mass productivity, high reliability against thermal shocks, and high oil-proof reliability, a module structure made by packing a whole mulit-layer circuit board (1) which connects a semiconductor operating element (7), semiconductor memory elements (8), and passive elements (9-12) thereon and part of a supporting material (3) on which said multi-layer circuit board is placed into a single package (4) by transfer-molding; wherein said multi-layer circuit board and said supporting material are bonded together with a compound metallic material (2, 21) made up from copper oxide and at least one metal selected from a set of gold, silver, and copper.
摘要翻译： 为了提供具有高紧凑性，翘曲小，气密性好，成型性高，批量生产率高，耐热冲击可靠性高，耐油可靠性高的低成本且高散热性的电子电路装置， 通过包装连接半导体操作元件（7），半导体存储元件（8）和无源元件（9-12）的整个多层电路板（1）和其上的支撑材料（3）的一部分而制成，其上 所述多层电路板通过转印成型放入单个封装（4）中; 其中所述多层电路板和所述支撑材料用由氧化铜和选自金，银和铜的至少一种金属组成的复合金属材料（2,21）结合在一起。
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公开(公告)号：EP1505645B1
公开(公告)日：2013-11-20
申请号：EP04018879.9
申请日：2004-08-09
申请人： Hitachi, Ltd.
IPC分类号： H01L23/495 , H01L23/31 , H01L23/14 , H01L23/373
CPC分类号： H01L23/4951 , H01L23/49531 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/165 , H01L25/18 , H01L2224/05599 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2224/85099 , H01L2224/85205 , H01L2224/85399 , H01L2924/01012 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H05K1/0306 , H05K3/0061 , H05K3/284 , H05K3/386 , H05K2201/0209 , H05K2203/0315 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
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