公开(公告)号：EP2624668A1

公开(公告)日：2013-08-07

申请号：EP12185847.6

申请日：2012-09-25

Applicant: Huawei Device Co., Ltd.

Inventor： Ding, Haixing ,  Xie, Guifu

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0268 ,  H05K1/0295 ,  H05K1/113 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09954 ,  H05K2201/10477 ,  H05K2203/162

Abstract: Embodiments of the present invention provide an integrated module. The integrated module includes a printed circuit board PCB and a modular device, where the modular device is mounted on the PCB; a group of front pin pads is disposed at four edges of a front surface of the PCB and the front pin pads are located around a mounted position of the modular device; and a group of bottom pin pads is disposed at four edges of a bottom surface of the PCB. Positions where the front pin pads are disposed are symmetric to positions where the bottom pin pads are disposed; and network properties of the front pin pads and those of the bottom pin pads are the same.

Abstract translation: 本发明的实施例提供一种集成模块。 集成模块包括印刷电路板PCB和模块化设备，其中模块化设备安装在PCB上; 一组前销焊盘设置在PCB的前表面的四个边缘处，并且前引脚焊盘位于模块化设备的安装位置周围; 并且一组底部销焊盘设置在PCB的底表面的四个边缘处。 设置前销销钉的位置与设置底部销钉的位置对称; 并且前引脚焊盘和底部引脚焊盘的网络属性相同。

公开(公告)号：EP2584605A3

公开(公告)日：2013-11-06

申请号：EP12189084.2

申请日：2012-10-18

Applicant: Huawei Device Co., Ltd.

Inventor： Cheng, Yinghua ,  Sun, Rui ,  Wang, Fengping ,  Ding, Haixing

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1434 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the present invention disclose a packaging structure and method and an electronic device. The packaging structure includes: a substrate (21), where the substrate (21) is arranged with a grounding end (27) and at least two circuit modules; a shielding separator (24) connected to the substrate (21) for separating the at least two circuit modules; a packaging insulator (25) applied on the substrate (21) for covering the at least two circuit modules, where the packaging insulator (25) is lower than the shielding separator (24); and a conductive coating (26) connected to the grounding end (27) and applied on the packaging insulator (25) for covering the packaging insulator (25) and the shielding separator (24). By using embodiments of the present invention, multiple shielded areas may be formed inside a packaging structure, which reduces electromagnetic interference between modules inside the packaging structure, and meanwhile, improves functional performance of circuits inside the packaging structure.

公开(公告)号：EP2584605A2

公开(公告)日：2013-04-24

申请号：EP12189084.2

申请日：2012-10-18

Applicant: Huawei Device Co., Ltd.

Inventor： Cheng, Yinghua ,  Sun, Rui ,  Wang, Fengping ,  Ding, Haixing

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L24/73 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1434 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments of the present invention disclose a packaging structure and method and an electronic device. The packaging structure includes: a substrate (21), where the substrate (21) is arranged with a grounding end (27) and at least two circuit modules; a shielding separator (24) connected to the substrate (21) for separating the at least two circuit modules; a packaging insulator (25) applied on the substrate (21) for covering the at least two circuit modules, where the packaging insulator (25) is lower than the shielding separator (24); and a conductive coating (26) connected to the grounding end (27) and applied on the packaging insulator (25) for covering the packaging insulator (25) and the shielding separator (24). By using embodiments of the present invention, multiple shielded areas may be formed inside a packaging structure, which reduces electromagnetic interference between modules inside the packaging structure, and meanwhile, improves functional performance of circuits inside the packaging structure.

Abstract translation: 本发明的实施例公开了一种包装结构和方法以及电子装置。 该封装结构包括：衬底（21），其中衬底（21）布置有接地端（27）和至少两个电路模块; 连接到所述基板（21）的屏蔽分离器（24），用于分离所述至少两个电路模块; 封装绝缘体（25），其被施加在所述基板（21）上，用于覆盖所述封装绝缘体（25）低于所述屏蔽隔板（24）的所述至少两个电路模块; 以及连接到所述接地端（27）并且被施加在所述包装绝缘体（25）上以覆盖所述包装绝缘体（25）和所述屏蔽分离器（24）的导电涂层（26）。 通过使用本发明的实施例，可以在封装结构内部形成多个屏蔽区域，这减少了封装结构内的模块之间的电磁干扰，同时提高了封装结构内电路的功能性能。