BINDER COMPOSITION FOR ELECTRODES AND ELECTRODE MIX SLURRY
    2.
    发明公开
    BINDER COMPOSITION FOR ELECTRODES AND ELECTRODE MIX SLURRY 审中-公开
    BINDERZUSAMMENSETZUNGFÜRELEKTRODEN UND ELEKTRODENMISCHUNGSSCHLAMM

    公开(公告)号:EP2405513A1

    公开(公告)日:2012-01-11

    申请号:EP10748544.3

    申请日:2010-03-05

    CPC classification number: H01M4/621 H01M4/622 H01M10/0525

    Abstract: The object of the present invention is to offer a binder composition for electrodes with greater binding strength that does not inhibit the formation of a stable electrode interface (SEI) on the surface of the layer active material. The binder composition for electrodes relating to the present invention includes an ester compound derived from at least one type of tetracarboxylic acid, at least one type of compound having 3 or more amino groups, and an organic solvent. Furthermore, this binder composition for electrodes preferably contains at least one type of diamino compound. In addition, it is preferable to use a solvent with a boiling point ≤ 250 °C in this binder composition for electrodes.

    Abstract translation: 本发明的目的是提供一种粘合剂组合物,该粘合剂组合物具有较大的粘合强度,其不会抑制层活性材料表面上稳定的电极界面(SEI)的形成。 本发明的电极用粘结剂组合物包括衍生自至少一种四羧酸的酯化合物,至少一种具有3个或更多个氨基的化合物和有机溶剂。 此外,该电极用粘合剂组合物优选含有至少一种二氨基化合物。 此外,优选在该电极用粘合剂组合物中使用沸点‰250℃的溶剂。

    CONDUCTIVE PASTE, AND CONDUCTIVE COATING FILM AND CONDUCTIVE FILM USING THE SAME
    3.
    发明公开
    CONDUCTIVE PASTE, AND CONDUCTIVE COATING FILM AND CONDUCTIVE FILM USING THE SAME 有权
    LEITFÄHIGEPASTE UNDLEITFÄHIGERBESCHICHTUNGSFILM UNDLEITFÄHIGERFILM DAMIT

    公开(公告)号:EP2053615A1

    公开(公告)日:2009-04-29

    申请号:EP07791966.0

    申请日:2007-08-03

    Abstract: The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 µm ∼ 125 µm. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.

    Abstract translation: 本发明的任务是提供可以模制成导电涂层或膜的导电膏,即使在厚度为50μm〜125μm的情况下也能够保持柔软性和延展性。 本发明的导电性糊剂包括导电性粒子,金属捕获剂和聚酰亚胺前体溶液。 金属捕获剂可以选自嘧啶硫醇化合物,三嗪硫醇化合物和具有巯基的咪唑化合物中的至少一种。 此外,导电性粒子优选为被金属壳覆盖的核心粒子。 此外,作为聚酰亚胺前体溶液,优选聚酰胺酸溶液。

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