Abstract:
The object of the present invention is to offer a binder composition for electrodes with greater binding strength that does not inhibit the formation of a stable electrode interface (SEI) on the surface of the layer active material. The binder composition for electrodes relating to the present invention includes an ester compound derived from at least one type of tetracarboxylic acid, at least one type of compound having 3 or more amino groups, and an organic solvent. Furthermore, this binder composition for electrodes preferably contains at least one type of diamino compound. In addition, it is preferable to use a solvent with a boiling point ≤ 250 °C in this binder composition for electrodes.
Abstract:
The task of the present invention is to offer a conductive paste that can be molded into a conductive coating or film that can maintain flexibility and ductility even while possessing a thickness of 50 µm ∼ 125 µm. The conductive paste of the present invention includes a conductive particulate, a metal capture agent and a polyimide precursor solution. The metal capture agent can be selected as at least one from among either pyrimidinethiol compounds, triazinethiol compounds and imidazole compounds with a mercapto group. Moreover, the conductive particulate is preferably a core particle that is covered with a metal shell. In addition, a polyamic acid solution is preferred as the polyimide precursor solution.