公开(公告)号：EP1776004A4

公开(公告)日：2009-09-02

申请号：EP05766192

申请日：2005-07-22

申请人： IBIDEN CO LTD

发明人： SUMITA ATSUNORI ,  KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TSUCHIYA ISAO ,  MABUCHI YOSHIYUKI ,  KIMURA OSAMU

IPC分类号： H05K3/34 ,  H01L21/60

CPC分类号： B23K3/0623 ,  B23K2201/42 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/53209 ,  H01L2224/05599

摘要： Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the loading cylinder 24 in a horizontal direction and the solder balls 78s are dropped onto the electrodes 75 on a multilayer printed wiring board 10 through an openings 16a in the ball arranging mask 16.