公开(公告)号：EP1776004A4

公开(公告)日：2009-09-02

申请号：EP05766192

申请日：2005-07-22

申请人： IBIDEN CO LTD

发明人： SUMITA ATSUNORI ,  KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TSUCHIYA ISAO ,  MABUCHI YOSHIYUKI ,  KIMURA OSAMU

IPC分类号： H05K3/34 ,  H01L21/60

CPC分类号： B23K3/0623 ,  B23K2201/42 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/53209 ,  H01L2224/05599

摘要： Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the loading cylinder 24 in a horizontal direction and the solder balls 78s are dropped onto the electrodes 75 on a multilayer printed wiring board 10 through an openings 16a in the ball arranging mask 16.

公开(公告)号：EP0817548A4

公开(公告)日：1999-12-01

申请号：EP96942586

申请日：1996-12-19

申请人： IBIDEN CO LTD

发明人： MORI YOJI ,  KAWAMURA YOICHIRO

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/46

CPC分类号： H05K1/116 ,  H05K1/0201 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09681 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T428/24917

摘要： A printed wiring board (1) such that openings (8L) formed around a pad (12L) which is a photo-via land do not overlap a pad (12L) and the area of each of the openings (8L) around the pad (12L) is equal to that of each of the other openings (8), the amount of resin (13) with which each of the openings (8, 8L) is filled is equal to that with which each of the openings (8L) is filled over the whole wiring board (1), and the amounts of resin (13) overflowing from the openings (8, 8L) are equal to each other. The circuit pattern provided on the upper surface of an interlayer insulating layer formed on the printed wiring board can be connected to a conductor pad area without causing any defective connection, providing a highly-reliable printed wiring board.

摘要翻译： 印刷电路板，其中存在于作为光电二极管的焊盘周围的开口布置成使其不与焊盘重叠，存在于焊盘周围的开口的面积和另一个开口的面积相等，树脂的量 填充在每个开口中或在整个印刷线路板上均匀化，并且设置从每个开口溢出的树脂量或当树脂在每个开口中填充或均匀时。 根据这样的印刷电路板，当通过布置开口来连接设置在形成在印刷线路板上的层间绝缘板上的电路图案和导体焊盘时，可以实现其中安全连接不会导致断开的可靠的印刷线路板 存在于导体焊盘周围，使得其不与导体焊盘重叠，并且基本上均匀地填充在导体焊盘周围的开口中的树脂的量和填充在另一个开口中的树脂的量。

公开(公告)号：EP1887845A4

公开(公告)日：2010-08-11

申请号：EP06780769

申请日：2006-06-28

申请人： IBIDEN CO LTD

发明人： KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TANAKA HIRONORI ,  FUJII NAOAKI

IPC分类号： H05K3/34 ,  H01L21/48 ,  H01L23/498

CPC分类号： H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP0804061A4

公开(公告)日：2000-01-05

申请号：EP96907729

申请日：1996-03-29

申请人： IBIDEN CO LTD

发明人： YASUE TOSHIHIKO ,  HIRAMATSU YASUJI ,  YANO HIDEKI ,  ISHITANI YOSHIFUMI ,  KAWAMURA YOICHIRO ,  MURASE HIDEKI ,  SUZUKI AYUMI ,  KAWADE MASATO

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

摘要： A multilayered printed wiring board having a smooth surface, which can be improved in resolution, interlayer insulating property, or thermal shock resistance without lowering its peel strength even if its insulating resin layer is thin. In the printed wiring board in which the conductor circuits of upper and lower layers are electrically insulated from each other by means of the insulating resin layer, the insulating layer is constituted of a composite layer composed of a lower layer made of a heat-resistant resin which is hardly soluble in an acid or oxidizing agent and an upper layer made of a bonding agent for electroless plating composed of a heat-resistant resin and, as necessary, a recessed section formed between conductor circuits of the lower layer is filled with a resin to the level corresponding to the surfaces of the conductor circuits.

摘要翻译： 提供一种具有优异的分辨率，层间绝缘性能和耐冷热冲击性的多层印刷电路板，而不会在表面上形成不均匀性，并且即使树脂绝缘层的厚度较薄，也降低剥离强度。 本发明提出了一种多层印刷电路板，包括形成在基板上的下导体电路层，形成在下导体电路层上的树脂绝缘层，形成在树脂绝缘层上的上导体电路层和形成在树脂中的通孔 绝缘层，用于电连接下导体电路层和上导体电路层，其中树脂绝缘层由热固性树脂和热塑性树脂的复合层组成。

公开(公告)号：EP0814643A2

公开(公告)日：1997-12-29

申请号：EP97109609

申请日：1997-06-12

申请人： IBIDEN CO LTD

发明人： ASAI MOTOO ,  KAWAMURA YOICHIRO

IPC分类号： H05K3/46 ,  H01L23/12 ,  H01L23/498 ,  H01L23/538 ,  H05K1/11 ,  H05K3/06 ,  H05K3/34

CPC分类号： H05K1/112 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5386 ,  H01L2924/0002 ,  H05K3/06 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/3478 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/099 ,  H05K2201/10734 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0405 ,  H05K2203/043 ,  H01L2924/00

摘要： A multilayer printed circuit board comprises a core substrate, multilayer wiring layers formed on the substrate by alternately laminating an interlaminar insulating layer and conductor circuit, and a group of solder pads having solder bumps planarly arranged on an outermost surface of the multilayer wiring layers, in which the solder pads located from first row to fifth row from an outer position of the solder pad group are constructed with flat pads connected to conductor pattern located on the outermost surface and solder bumps formed on the surfaces of the pads, while the solder pad group other than these solder pads are constructed with viaholes connected to flat innerlayer pad group located in an inner layer and solder bumps formed in recess portions of the viaholes, and the solder pads located from first row to fifth row from an outer position of the innerlayer pad group are constructed with flat pads connected to conductor patterns in the same layer as the innerlayer pad group, while the innerlayer pad groups other than the pads are constituted with flat pads connected to a further innerlayer flat pad group located inward the above innerlayer through viaholes.

摘要翻译： 多层印刷电路板包括芯基板，通过交替层叠层间绝缘层和导体电路而形成在基板上的多层布线层，以及一组焊料凸块，其平坦地布置在多层布线层的最外表面上， 其中焊盘从焊料焊盘组的外部位置位于第一行至第五行的焊盘被构造为连接到位于最外表面上的导体图案的平坦焊盘和形成在焊盘表面上的焊料凸块，而焊盘组 除了这些焊盘之外，构成了连接到位于内层中的平坦内层焊盘组的通孔和形成在通孔的凹部中的焊料凸块以及从内层焊盘的外部位置位于第一行至第五行的焊盘 在与内层垫组相同的层中的导体图案上连接有平垫， 而除了焊盘之外的内层焊盘组由通过通孔连接到位于上层内层的另一内层平垫组的平垫组成。

公开(公告)号：EP1887846A4

公开(公告)日：2010-08-11

申请号：EP06780770

申请日：2006-06-28

申请人： IBIDEN CO LTD

发明人： KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TANAKA HIRONORI ,  FUJII NAOAKI

IPC分类号： H05K3/34 ,  H01L21/48 ,  H01L23/498 ,  H01L23/544

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54473 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP0883173A4

公开(公告)日：2001-05-09

申请号：EP96930376

申请日：1996-09-12

申请人： IBIDEN CO LTD

发明人： ASAI MOTOO ,  KAWAMURA YOICHIRO ,  MORI YOJI

IPC分类号： H05K3/46 ,  H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K3/18 ,  H01L23/12 ,  H05K1/03

CPC分类号： H01L23/49833 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01R12/523 ,  H05K1/0271 ,  H05K1/112 ,  H05K1/114 ,  H05K3/184 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0212 ,  H05K2201/09227 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2201/10734

摘要： A circuit board for mounting electronic parts, which includes first connecting terminal groups (12A and 12B) composed of a plurality of connecting terminals densely formed on the front surface (S1) of a base substrate (2) having through holes (6) and a second connecting terminal group (13) composed of a plurality of connecting terminals formed in at least outer peripheral section on the rear surface (S2) of the substrate (2). The first groups (12A and 12B) are connected to the second group (13) through the holes (6). On the front surface of the substrate (2), build-up multilayered wiring layers (B1 and B2) having via holes (11) are formed and the first groups (12A and 12B) are connected to the second group (13) through the wiring layers (B1 and B2) and through holes (6). In another example, each signal line (52) on the surfaces of the wiring layers (B1 and B2) is composed of a plurality of wiring patterns (58 and 59) having different line widths and a tapered pattern (60) which connects the wiring patterns (58 and 59) to each other and the width of which continuously varies. The line width of the signal line (52) in an area where the wiring density is relatively high is made narrower than that in another area where the wiring density is relatively low.

公开(公告)号：EP0800336A4

公开(公告)日：1999-04-21

申请号：EP96935417

申请日：1996-10-23

申请人： IBIDEN CO LTD

发明人： KAWAMURA YOICHIRO ,  MURASE HIDEKI ,  ASAI MOTOO

IPC分类号： H05K3/00 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

摘要： A resin filler preferably packed in recesses occurring in the surface of a wiring board or in through holes provided therein, and a structure of a highly reliable built-up multilayer printed wiring board filled with the same resin filler are proposed. This resin filler is a solventless resin filler to be packed in the recesses occurring in the surface of a wiring board or in the through holes provided therein, the resin filler being characterized in that the filler contains resin components of bisphenol type epoxy resin and a curing agent of imidazole, and an additive component of inorganic particles as necessary. A built-up multilayer printed wiring board using this resin filler is also proposed.

公开(公告)号：EP2012569A4

公开(公告)日：2010-06-02

申请号：EP07742024

申请日：2007-04-20

申请人： IBIDEN CO LTD

发明人： KAWAMURA YOICHIRO ,  TANNO KATSUHIKO

IPC分类号： H05K3/34 ,  B23K3/06

CPC分类号： B23K3/0623 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2924/00014 ,  H05K3/3478 ,  H05K3/4644 ,  H05K2201/09481 ,  H05K2203/0195 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/53204 ,  Y10T29/53209 ,  Y10T29/53213 ,  H01L2224/05599

公开(公告)号：EP1884992A4

公开(公告)日：2009-10-28

申请号：EP06756573

申请日：2006-05-18

申请人： IBIDEN CO LTD

发明人： KAWAMURA YOICHIRO ,  SAWA SHIGEKI ,  TANNO KATSUHIKO ,  TANAKA HIRONORI ,  FUJII NAOAKI

IPC分类号： H01L23/12 ,  H05K3/28

CPC分类号： H01L21/4846 ,  H01L21/563 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/381 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0278 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T428/2804 ,  Y10T428/31511 ,  Y10T428/31681 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2224/05599

摘要： Disclosed is a printed wiring board wherein a solder resist layer is formed on the surface of a wiring board which is provided with a conductor circuit, a part of the conductor circuit exposed from an opening formed in the solder resist layer is formed into a conductor pad, a solder bump is formed on the conductor pad, an electronic component is mounted on the board via the solder bump, and the electronic component is sealed with an underfill resin. In this printed wiring board, the surface of the solder resist layer is planarized at least in the electronic component mounting region or the planarized surface is further subjected to a roughening treatment. Also disclosed is a method for manufacturing such a printed wiring board

摘要翻译： 本发明公开了一种印刷线路板，其中在设置有导体电路的布线板的表面上形成阻焊层，将从阻焊层中形成的开口暴露的导体电路的一部分形成为导体焊盘 在导体焊盘上形成焊料凸点，通过焊料凸点将电子元件安装在基板上，并用底部填充树脂密封电子元件。 在该印刷线路板中，至少在电子元件安装区域中阻焊层的表面被平坦化，或者平坦化表面进一步经过粗糙化处理。 还公开了用于制造这种印刷线路板的方法