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公开(公告)号：EP1699279B8
公开(公告)日：2011-09-21
申请号：EP06115382.1
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
IPC分类号： H05K3/46
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
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公开(公告)号：EP1978797A3
公开(公告)日：2008-10-22
申请号：EP08160963.8
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (9) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).
摘要翻译： 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（9），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元素长型元素周期表第4A族至第1B族中的第4至第7周期的金属元素，Al和Sn，金属层（ 14）然后用酸清洗，然后在金属层（14）上构造导体电路（19）。
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公开(公告)号：EP1978797A2
公开(公告)日：2008-10-08
申请号：EP08160963.8
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).
摘要翻译： 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（19），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元素长型元素周期表第4A族至第1B族中的第4至第7周期的金属元素，Al和Sn，金属层（ 14）然后用酸清洗，然后在金属层（14）上构造导体电路（19）。
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公开(公告)号：EP1699278A3
公开(公告)日：2007-04-18
申请号：EP06115380.5
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
IPC分类号： H05K3/46
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： In a method of forming a metal film, an oxide film is removed on the surface of a nickel film using an aqueous solution of a reducing acid having a concentration of 2.0 to 10.0 mol/L, and then a different metal film is formed on the surface of the nickel film. The method of forming the metal film is useful in a process of manufacturing a multilayer printed circuit.
摘要翻译： 在形成金属膜的方法中，使用浓度为2.0〜10.0mol / L的还原酸水溶液在镍膜的表面上去除氧化膜，然后在其上形成不同的金属膜 镍膜的表面。 形成金属膜的方法在制造多层印刷电路的工艺中是有用的。
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公开(公告)号：EP1893006A1
公开(公告)日：2008-02-27
申请号：EP07108839.7
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： A multilayer printed circuit board comprises a substrate board (101) carrying a lower-layer conductor circuit (104) and, as built up on the substrate board (101) successively and alternately, an interlayer resin insulating layer (102) and an upper-layer conductor circuit (105) in succession. The multilayer printed circuit board further comprises a metal layer (111a) composed of at least one metal selected from among metals having ionization tendencies not lower than tin but not higher than aluminum and noble metals as formed on the surface of said lower-layer conductor circuit (104) and a roughened layer (111b) superimposed on said metal layer (111a).
摘要翻译： 多层印刷电路板包括承载下层导体电路（104）的衬底板（101），并且在衬底板（101）上依次并且交替地形成层间树脂绝缘层（102）和上层导体电路 层导体电路（105）。 多层印刷电路板还包括金属层（111a），其由从具有不低于锡但不高于铝的电离趋势的金属中选择的至少一种金属和在所述下层导体电路的表面上形成的贵金属 （104）和叠加在所述金属层（111a）上的粗糙层（111b）。
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6.发明公开Multilayer printed wiring board and method for producing the same 有权Verfahren zur Herstellung einer Mehrschichtleiterplatte
公开(公告)号：EP1830616A2
公开(公告)日：2007-09-05
申请号：EP07110630.6
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
IPC分类号： H05K3/46
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, A1 and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).
摘要翻译： 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（19），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元件A1和Sn的长型周期表的第4A至1B组中的第4至第7周期的金属元素，金属表面 然后用酸清洗层（14），之后将导体电路（19）构造在金属层（14）上。
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7.发明公开Printed wiring board and method for producing the same 有权Gedruckte Schaltungsplatte und Verfahren zur Herstellung
公开(公告)号：EP1727409A1
公开(公告)日：2006-11-29
申请号：EP06115377.1
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： In a process for manufacturing a multilayer printed circuit board which comprises constructing a conductor circuit (104), roughening the conductor circuit (104) to provide a roughened surface (111), forming an interlayer resin insulating layer (102) over the roughened surface (111) of the conductor circuit (104) and forming openings (106) for via holes in a repeated sequence to construct conductor circuits comprised a plurality of layers isolated by interlayer resin insulating layers, an oxidation treatment is carried out after forming the roughened surface (111) on the conductor circuit (104) to provide an oxide film on the entire roughened surface (111), and thereafter the interlayer resin insulating layer (102) is constructed.
摘要翻译： 在制造多层印刷电路板的方法中，包括构造导体电路（104），粗化导体电路（104）以提供粗糙化表面（111），在粗糙表面上形成层间树脂绝缘层（102） 111），并且以重复的顺序形成用于通孔的开口（106），以构成包括由层间树脂绝缘层隔离的多个层的导体电路，在形成粗糙表面之后进行氧化处理（ 111），在整个粗糙面（111）上形成氧化膜，之后构成层间树脂绝缘层（102）。
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公开(公告)号：EP1968368A3
公开(公告)日：2010-11-24
申请号：EP08157080.6
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).
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公开(公告)号：EP1978796B1
公开(公告)日：2010-06-02
申请号：EP08160500.8
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
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公开(公告)号：EP1978797B1
公开(公告)日：2010-01-13
申请号：EP08160963.8
申请日：1999-09-28
申请人： IBIDEN CO., LTD.
发明人： En, Honchin , Hayashi, Masayuki , Wang, Dongdong , Shimada, Kenichi , Asai, Motoo , Sekine, Koji , Nakai, Tohru , Ichikawa, Shinichiro , Toyoda, Yukihiko
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
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