公开(公告)号：EP1699279B8

公开(公告)日：2011-09-21

申请号：EP06115382.1

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/46

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

公开(公告)号：EP2086300A1

公开(公告)日：2009-08-05

申请号：EP09156841.0

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Wang, Dongdong ,  Mori, Takahiro

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.

Abstract translation: 金属层18被夹在绝缘层14之间和20，从而没必要的强度得以保持。 因此它遵循，芯的DASS模具厚度基片30可以减小，因此，多层印刷电路板的厚度可以减小。 非贯通孔22，其在绝缘层14和20到达金属层18的形成是简单地需要。 因此，小的非贯通孔22能够容易地通过施加激光束形成的。 因此，通过具有小直径的每个孔36可以被形成。

公开(公告)号：EP2079291A1

公开(公告)日：2009-07-15

申请号：EP09156857.6

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： Inagaki, Yasushi ,  Asai, Motoo ,  Wang, Dongdong ,  Yabashi, Hideo ,  Shirai, Seiji

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a thi rd res in substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

Abstract translation: 芯片电容器20设置在印刷电路板10的核心基板30中。这使得可以缩短IC芯片90与芯片电容器20之间的距离并减小回路电感。 由于核心基板30是通过在基板30c中以多层方式设置第一树脂基板30a，第二树脂基板30b和堤坝而构成的，所以核心基板30可以获得足够的强度。

公开(公告)号：EP2053909A1

公开(公告)日：2009-04-29

申请号：EP08022342.3

申请日：2000-07-28

Applicant: IBIDEN CO., LTD.

Inventor： Zhong, Hui ,  Shimada, Kenichi ,  Toyoda, Yukihiko ,  Asai, Motoo ,  Wang, Dongdong ,  Sekine, Koji ,  Ono, Yoshitaka

IPC: H05K3/28 ,  H05K3/46

CPC classification number: H05K3/285 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/4602

Abstract: The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains a P atom-containing epoxy resin.

Abstract translation: 本发明是提供一种不存在由于阻焊层与另一部分之间的热膨胀差异而引起的裂纹的多层印刷电路板和本发明的多层印刷电路板，其特征在于，包括：导体电路和树脂绝缘层， 基板以重复的方式和形成为最外层的阻焊层，并且阻焊层包含含P原子的环氧树脂。

公开(公告)号：EP1978797A3

公开(公告)日：2008-10-22

申请号：EP08160963.8

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (9) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).

Abstract translation: 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（9），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元素长型元素周期表第4A族至第1B族中的第4至第7周期的金属元素，Al和Sn，金属层（ 14）然后用酸清洗，然后在金属层（14）上构造导体电路（19）。

公开(公告)号：EP1978797A2

公开(公告)日：2008-10-08

申请号：EP08160963.8

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, Al and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).

Abstract translation: 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（19），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元素长型元素周期表第4A族至第1B族中的第4至第7周期的金属元素，Al和Sn，金属层（ 14）然后用酸清洗，然后在金属层（14）上构造导体电路（19）。

公开(公告)号：EP1699278A3

公开(公告)日：2007-04-18

申请号：EP06115380.5

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/46

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: In a method of forming a metal film, an oxide film is removed on the surface of a nickel film using an aqueous solution of a reducing acid having a concentration of 2.0 to 10.0 mol/L, and then a different metal film is formed on the surface of the nickel film. The method of forming the metal film is useful in a process of manufacturing a multilayer printed circuit.

Abstract translation: 在形成金属膜的方法中，使用浓度为2.0〜10.0mol / L的还原酸水溶液在镍膜的表面上去除氧化膜，然后在其上形成不同的金属膜 镍膜的表面。 形成金属膜的方法在制造多层印刷电路的工艺中是有用的。

公开(公告)号：EP2079291B1

公开(公告)日：2013-06-19

申请号：EP09156857.6

申请日：2000-09-01

Applicant: IBIDEN CO., LTD.

Inventor： Inagaki, Yasushi ,  Asai, Motoo ,  Wang, Dongdong ,  Yabashi, Hideo ,  Shirai, Seiji

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/645 ,  H01L24/16 ,  H01L24/17 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 is constituted by providing a first resin substrate 30a, a second resin substrate 30b and a third resin substrate 30c in a multilayer manner, the core substrate 30 can obtain sufficient strength.

公开(公告)号：EP1893006B1

公开(公告)日：2012-04-25

申请号：EP07108839.7

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/46 ,  C23G1/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

公开(公告)号：EP1978796A2

公开(公告)日：2008-10-08

申请号：EP08160500.8

申请日：1999-09-28

Applicant: IBIDEN CO., LTD.

Inventor： En, Honchin ,  Hayashi, Masayuki ,  Wang, Dongdong ,  Shimada, Kenichi ,  Asai, Motoo ,  Sekine, Koji ,  Nakai, Tohru ,  Ichikawa, Shinichiro ,  Toyoda, Yukihiko

IPC: H05K3/38 ,  H05K3/46 ,  H05K3/10

CPC classification number: C23G1/10 ,  H01L2924/0002 ,  H05K3/0094 ,  H05K3/062 ,  H05K3/067 ,  H05K3/108 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4661 ,  H05K2201/0129 ,  H05K2201/0158 ,  H05K2201/0338 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49124 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00

Abstract: In a process for manufacturing a multilayer printed circuit board which comprises forming a resin insulating layer (12) and a conductor circuit (19) on a resin substrate (1), a metal layer (14) composed of at least one metal selected from among the metal elements of the 4 th through 7 th periods in Group 4A through Group 1B of the long-form periodic table of the elements, A1 and Sn is formed on the surface of the resin insulating layer (12), the surface of the metal layer (14) is then cleaned with an acid, and thereafter the conductor circuit (19) is constructed on the metal layer (14).

Abstract translation: 在制造多层印刷电路板的方法中，包括在树脂基板（1）上形成树脂绝缘层（12）和导体电路（9），金属层（14）由至少一种选自 在树脂绝缘层（12）的表面上形成元件A1和Sn的长型周期表的第4A至1B组中的第4至第7周期的金属元素，金属表面 然后用酸清洗层（14），之后将导体电路（19）构造在金属层（14）上。