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1.SELECTIVE IMPLEMENTATION OF BARRIER LAYERS TO ACHIEVE THRESHOLD VOLTAGE CONTROL IN CMOS DEVICE FABRICATION WITH HIGH K DIELECTRICS 有权
Title translation: 层层壁垒的选择性实施旨在实现阈值电压控制在CMOS元件具有高K电介质的生产公开(公告)号:EP1766691A4
公开(公告)日:2011-06-29
申请号:EP05732384
申请日:2005-03-30
Applicant: IBM
Inventor: BOJARCZUK NESTOR A JR , CABRAL CYRIL JR , CARTIER EDUARD A , COPEL MATTHEW W , FRANK MARTIN M , GOUSEV EVGENI P , GUHA SUPRATIK , JAMMY RAJARAO , NARAYANAN VIJAY , PARUCHURI VAMSI K
IPC: H01L31/113 , H01L21/28 , H01L21/8238 , H01L29/49 , H01L29/51 , H01L31/119
CPC classification number: H01L29/513 , H01L21/28079 , H01L21/28088 , H01L21/823857 , H01L29/495 , H01L29/4966 , H01L29/517
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2.LOW THRESHOLD VOLTAGE SEMICONDUCTOR DEVICE WITH DUAL THRESHOLD VOLTAGE CONTROL MEANS 审中-公开
Title translation: 用双阈值电压控制装置低阈值电压半导体部件公开(公告)号:EP1949447A4
公开(公告)日:2009-11-11
申请号:EP06825854
申请日:2006-10-12
Applicant: IBM
Inventor: CARTER EDUARD A , COPEL MATTHEW W , FRANK MARTIN M , GOUSEV EVGENI P , JAMISON PAUL C , JAMMY RAJARAO , LINDER BARRY P , NARAYANAN VIJAY
CPC classification number: H01L29/513 , H01L21/28194 , H01L21/28238 , H01L21/823807 , H01L29/105 , H01L29/1083 , H01L29/517 , H01L29/518 , H01L29/6659 , H01L29/7833
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3.NITROGEN-CONTAINING FIELD EFFECT TRANSISTOR GATE STACK CONTAINING A THRESHOLD VOLTAGE CONTROL LAYER FORMED VIA DEPOSITION OF A METAL OXIDE 审中-公开
Title translation: WITH A形成的金属氧化物阈值电压控制层的矿床氮场效应晶体管栅极堆栈公开(公告)号:EP1825521A4
公开(公告)日:2008-10-01
申请号:EP05820881
申请日:2005-11-01
Applicant: IBM
Inventor: BOJARCZUK NESTOR A JR , CABRAL CYRIL JR , CARTIER EDUARD A , FRANK MARTIN M , GOUSEV EVGENI P , GUHA SUPRATIK , JAMISON PAUL C , JAMMY RAJARAO , NARAYANAN VIJAY , PARUCHURI VAMSI K
IPC: H01L29/792 , H01L21/336 , H01L29/76 , H01L29/94 , H01L31/00
CPC classification number: H01L29/513 , H01L21/28194 , H01L21/2822 , H01L21/823828 , H01L21/823857 , H01L29/495 , H01L29/4966 , H01L29/4975 , H01L29/517 , H01L29/518
Abstract: A semiconductor structure is provided that includes a V t stabilization layer between a gate dielectric and a gate electrode. The V t stabilization layer is capable of stabilizing the structure's threshold voltage and flatband voltage to a targeted value and comprises a nitrided metal oxide, or a nitrogen-free metal oxide, with the provision that when the V t stabilization layer comprises a nitrogen-free metal oxide, at least one of the semiconductor substrate or the gate dielectric includes nitrogen. The present invention also provides a method of fabricating such a structure.
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